Samsung plans to rival TSMC in foundry, says report News & Analysis 12/4/2009 4 comments South Korea's Samsung Electronics Co. Ltd. plans to double its production of chips for others, so called foundry production, every year until it rivals market leader Taiwan Semiconductor Manufacturing Co. Ltd., according to a Chosun Ilbo report that referenced an un-named company spokesman as its source.
Marvell tops analyst estimates News & Analysis 12/3/2009 Post a comment Chip maker Marvell Technology Group reported revenue for the quarter ended Oct. 31 that exceeded analysts' expectations and the company's own revised sales target for the period.
ST reorganizes regional structure News & Analysis 12/3/2009 Post a comment STMicroelectronics NV (Geneva, Switzerland) has announced changes in its global sales and marketing organization, consolidating ST's regions in Asia to two: Greater China & South Asia, Japan & Korea, with effect from Jan. 1, 2010.
Update: EU clears Renesas-NEC merger News & Analysis 12/2/2009 Post a comment The proposed merger between Japanese chip makers Renesas Technology and NEC Electronics has been approved by the European Commission, the executive body of the European Union.
USB host audio decoder ICs support a variety of audio compression formats Product News 12/1/2009 Post a comment ROHM Semiconductor has developed USB host audio decoder ICs that are compatible to a variety of audio compression formats (BU9457KV: MP3, BU9458KV: MP3, WMA, AAC) and featuring high ESD resistance, which makes them suitable for car audio applications requiring specific surge characteristics as well as home and portable audio sets.
Analyst raises forecast on soaring October chip sales News & Analysis 12/1/2009 Post a comment Bruce Diesen, analyst with Carnegie ASA (Oslo, Norway), has raised his forecast for the 2009 chip market, for the second month in a row. Carnegie asserts the market will still be down but the shrink will be less than Carnegie previously predicted.
October chip sales grew fastest in Europe News & Analysis 12/1/2009 Post a comment The European and Americas regions grew fastest according to the October three-month average chip sales released by the Semiconductor Industry Association on Monday (Nov. 30), when compared with the previous month.
X-FAB and Plus Semi agree on sale of X-FAB UK News & Analysis 12/1/2009 Post a comment X-FAB Silicon Foundries Group and Swindon-based Plus Semi have agreed on the sale of X-FAB's wafer fabrication plant in Plymouth, UK, to Plus Semi. A technology license agreement ensures the continuation of the existing operation.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.