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posted in December 2009
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Samsung plans to rival TSMC in foundry, says report
News & Analysis  
12/4/2009   4 comments
South Korea's Samsung Electronics Co. Ltd. plans to double its production of chips for others, so called foundry production, every year until it rivals market leader Taiwan Semiconductor Manufacturing Co. Ltd., according to a Chosun Ilbo report that referenced an un-named company spokesman as its source.
Marvell tops analyst estimates
News & Analysis  
12/3/2009   Post a comment
Chip maker Marvell Technology Group reported revenue for the quarter ended Oct. 31 that exceeded analysts' expectations and the company's own revised sales target for the period.
AMD co-founder joins board of Scottish startup
News & Analysis  
12/3/2009   Post a comment
John Carey, co-founder of Advanced Micro Devices Inc. in 1969 and lead investor in Integrated Device Technology Inc. in 1980, has joined Elonics Ltd. (Livingston, Scotland) as a non-executive director.
ST reorganizes regional structure
News & Analysis  
12/3/2009   Post a comment
STMicroelectronics NV (Geneva, Switzerland) has announced changes in its global sales and marketing organization, consolidating ST's regions in Asia to two: Greater China & South Asia, Japan & Korea, with effect from Jan. 1, 2010.
Update: EU clears Renesas-NEC merger
News & Analysis  
12/2/2009   Post a comment
The proposed merger between Japanese chip makers Renesas Technology and NEC Electronics has been approved by the European Commission, the executive body of the European Union.
STMicroelectronics : Low-power MCU targets M2M cellular communication
Product News  
12/2/2009   Post a comment
STMicroelectronics has announced a robust low-power processor chip dedicated to managing SIM data for machine-to-machine (M2M) cellular communications.
Single-chip TV receiver supports analog, digital
Product News  
12/2/2009   Post a comment
Fresco Microchip is rolling out a single-chip solution that supports universal analog audio and video demodulation as well as digital intermediate frequency processing for global terrestrial and cable television markets.
USB host audio decoder ICs support a variety of audio compression formats
Product News  
12/1/2009   Post a comment
ROHM Semiconductor has developed USB host audio decoder ICs that are compatible to a variety of audio compression formats (BU9457KV: MP3, BU9458KV: MP3, WMA, AAC) and featuring high ESD resistance, which makes them suitable for car audio applications requiring specific surge characteristics as well as home and portable audio sets.
Analyst raises forecast on soaring October chip sales
News & Analysis  
12/1/2009   Post a comment
Bruce Diesen, analyst with Carnegie ASA (Oslo, Norway), has raised his forecast for the 2009 chip market, for the second month in a row. Carnegie asserts the market will still be down but the shrink will be less than Carnegie previously predicted.
October chip sales grew fastest in Europe
News & Analysis  
12/1/2009   Post a comment
The European and Americas regions grew fastest according to the October three-month average chip sales released by the Semiconductor Industry Association on Monday (Nov. 30), when compared with the previous month.
X-FAB and Plus Semi agree on sale of X-FAB UK
News & Analysis  
12/1/2009   Post a comment
X-FAB Silicon Foundries Group and Swindon-based Plus Semi have agreed on the sale of X-FAB's wafer fabrication plant in Plymouth, UK, to Plus Semi. A technology license agreement ensures the continuation of the existing operation.
Squeezable interface technology targets the 3D market
News & Analysis  
12/1/2009   Post a comment
Product design and development firm Cambridge Consultants launched Suma, a uniquely intuitive and very low-cost squeezable user-interface technology aimed at 3D content interaction.
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