Meeting Zuckerberg and Mr. EUV Blog 12/13/2012 3 comments I learned a little something in brief encounters this week with Facebook’s Mark Zuckerberg and the man I think of as Mr. EUV—two very unique men in black.
IBM details 3-D server chip stacks News & Analysis 12/12/2012 4 comments IBM will show work stacking 45-nm server processors with memory and transceivers at IEDM, techniques that could give it significant performance and power gains.
28-nm FDSOI is production ready, says ST News & Analysis 12/11/2012 11 comments To coincide with a meeting on process technology held alongside IEDM, European chip company ST has announced that its 28-nm fully depleted silicon-on-insulator (FDSOI) is available for pre-production volumes from its wafer fab at Crolles, France.
Intel upping Atom ante News & Analysis 12/7/2012 20 comments Intel is positioning its upcoming Atom-based Centerton chip as a server alternative to 64-bit ARM devices.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.