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posted in February 2002
Cell phone chips integrate DSP, Xscale processor
News & Analysis  
2/28/2002   Post a comment
Integrated baseband chips are being developed for 2.5G and 3G cell phones that merge Intel Corp.'s 400-MHz PXA250 Xscale processor, 400-MHz Micro Signal Architecture DSP and enough on-board flash to handle all DSP and applications code. The company hopes the parts, made in Intel's 0.13-micron process and being worked on at its R&D lab in Israel, can help recreate in the cellular world the kind of high-volume platform Intel and Microsoft forged with the PC.
Infineon's new VDSL chip sets support ATM, packet transmissions
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2/28/2002   Post a comment
MUNICH -- Infineon Technologies AG today announced plans to introduced a new chip-set series for 4-band very-high-bit rate digital subscriber line (VDSL) networks with support for asynchronous transfer mode (ATM) and packet-over-VDSL communications.
Opti sales surge on last-time buys as its weighs liquidation plan
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2/28/2002   Post a comment
MOUNTAIN VIEW, Calif.--Still reconsidering a plan to liquidate itself, Opti Inc. here posted a net income of $381,000 on revenues of $2.5 million in the fourth quarter of 2001. The company's sales surged 98% on a sequential basis from the third quarter of 2001 because of an increase in last-time buys of PC chip sets, said Opti's chief executive officer.
STMicro collaborates with APT to offer Serial ATA chip solutions
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2/28/2002   Post a comment
GENEVA--STMicroelectronics today announced it was jumping into the race to develop new chips for the high-speed Serial ATA interface to storage peripherals and hard-disk drives by striking a product-design alliance with APT Technologies Inc. of Santa Cruz, Calif.
Gain enters analog IC market with physical-layer transceiver for USB 2.0
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2/27/2002   Post a comment
SAN FRANCISCO -- Gain Technology Corp. rolled out its first analog front-end interface chip for high-speed USB peripherals during the Intel Developer Forum here this week. The GT3200 is compliant with the USB 2.0 Transceiver Macrocell Interface (UTMI) specification, said Gain, which is based in Tucson, Ariz.
Conexant shows Bluetooth-enabled digital camera platform
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2/26/2002   Post a comment
ORLANDO, Fla. -- Conexant Systems Inc. here at a photography trade show demonstrated a Bluetooth-enabled digital still camera platform. The digital camera platform is the first to include support for wireless transmissions via Bluetooth connections, said the Newport Beach, Calif., company.
RF Solutions, Ellipsis to develop wireless LAN chip sets for multiple standards
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2/26/2002   Post a comment
NORCROSS, Ga. -- RF Solutions Inc. and Ellipsis Digital Systems Inc. today announced a partnership to develop a chip set for dual-band, multi-protocol wireless local area networks (WLANs) supporting 2.4 and 5-GHz standards.
Zarlink adds flexible TDM switch chip for 8K-by-8K channels in networks
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2/26/2002   Post a comment
OTTAWA -- Zarlink Semiconductor Inc. today expanded its high-density non-blocking time-division multiplexing (TDM) chip offering for switching 8,192-by-8,192 channels of voice/data traffic in next-generation networking systems.
Philips, STMicro to bundle hardware/software platforms for digital TV, set-top boxes
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2/26/2002   Post a comment
EINDHOVEN, the Netherlands -- Royal Philips Electronics N.V. and STMicroelectronics today announced an agreement to jointly develop platform products for set-top boxes and digital television sets. The alliance will apply Philips' software for multimedia home platforms and STMicroelectronics' single-chip digital decoder to provide new turnkey solutions.
Intel targets 'modular infrastructure' shift in communications systems
News & Analysis  
2/26/2002   Post a comment
SAN FRANCISCO -- The year-and-a-half slump in communications markets is causing a sea of change in the industry, prompting systems houses to shift product development strategies from proprietary ASIC designs to standard ICs and a "modular infrastructure" business model, said Intel Corp.'s top networking executive during briefing with journalists on Monday evening.
Broadcom's ServerWorks launches Xeon chip set for DDR memory
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2/25/2002   Post a comment
SAN FRANCISCO -- ServerWorks Corp. today announced an optimized chip set for Intel Corp.'s Xeon processors using a new architecture supporting 3.2-gigabyte-per-second memory bandwidth--a 50% increase over an existing chip-set solution for Pentium III platforms, said the company at the Intel Developer Forum here.
LSI, Seagate team up to make first Serial ATA interface chip for PC drives
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2/25/2002   Post a comment
SAN FRANCISCO -- LSI Logic Corp. and disk-drive maker Seagate Technology LCC today announced plans to develop a "breakthrough" Serial ATA interface for next-generation desktop PC hard disk drives.
Motorola integrates Kodak technology in CMOS sensor for video, camera systems
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2/25/2002   Post a comment
ORLANDO, Fla. - During a trade show here today, Motorola Inc. announced a new "camera-on-a-chip" sensor IC, based on what the company called "groundbreaking" wafer processing capabilities and patented photodiode and pixel design technology from Eastman Kodak Co. The second-generation ImageMOS VGA device also employs Motorola's patented image sensor technology.
Intersil, Cisco to offer 54-Mbit wireless LAN client reference designs
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2/21/2002   Post a comment
IRVINE, Calif.-- Intersil Corp. and Cisco Systems Inc. today announced collaboration on high-speed wireless LAN client adapter reference designs, which help other companies make system products based on the IEEE 802.11g draft standard.
STMicro, Imagination Technologies aim alliance at mobile multimedia applications
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2/21/2002   Post a comment
CANNES, France -- During the 3GSM World Congress conference here today, STMicroelectronics and U.K.-based Imagination Technologies Group announced plans to cooperate in development of system-on-chip platforms for mobile multimedia systems.
Germany's IHP plans 5-GHz wireless LAN processor with MIPS core
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2/20/2002   Post a comment
FRANKFURT (ODER), Germany-- In a move to create 5-GHz processors for wireless local area networks, Germany's Innovations for High Performance (IHP) microelectronics institute here today announced it will cooperate with MIPS Technologies Inc. in development of wireless broadband communications ICs.
Zoran processor filters foul language from kids in Sanyo DVD players
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2/20/2002   Post a comment
SANTA CLARA, Calif. -- Zoran Corp. here and Japan's Sanyo Group today announced a long-term strategic partnership in DVD chip technology, and separately, the Santa Clara company said it has delivered a new integrated circuit that improves parental control over what children hear in TV programming, compared to V-Chip technology.
Motorola announces 3G platform in new open cell-phone strategy
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2/19/2002   Post a comment
CANNES, France -- Motorola Inc. rolled out its promised third-generation cellular phone chip set and development platform at the 3GSM World Congress conference here. The 3G phone chip set's baseband processor is based on the StarCore DSP architecture, which was jointly developed by Motorola and Agere Systems Inc.
Microsoft supports smart phone platform based on TI's OMAP
News & Analysis  
2/19/2002   Post a comment
CANNES, France -- In a move to play more of its cards in the next-generation "smart phone" marketplace, Microsoft Corp. today announced its Windows Powered Smartphone 2002 software is available on a DSP-based design reference platform from Texas Instruments Inc.
Microsoft, Intel try to set PDA/smart phone standards like they did in PCs
News & Analysis  
2/19/2002   Post a comment
CANNES, France -- PC technology giants Microsoft Corp. and Intel Corp. today announced a joint initiative to develop reference design platforms for next-generation personal digital assistants (PDAs) and smart phones. The two companies said the lack of industry standards in wireless communications systems was holding back the spread of smart phones and next-generation PDAs.
Nokia, TI offer compete 2.5/3G platform for cell-phone makers
News & Analysis  
2/18/2002   Post a comment
CANNES, France -- The race to provide packaged solutions for next-generation cellular phone handsets is heating up. Finland's Nokia Group and Texas Instruments Inc. today announced complete "open and standards-based" reference platforms for 2.5- and third-generation (3G) smart phones using Nokia's Series 60 terminal software and TI's OMAP integrated digital signal processor.
Phoenix and Standard Microsystems collaborate in PC security chips
News & Analysis  
2/18/2002   Post a comment
SAN JOSE -- Embedded software supplier Phoenix Technologies Ltd. today announced a partnership with Standard Microsystems Corp. to enhance built-in PC security with new tamper-resistant silicon hardware that stores protective device keys and related data.
Tropian teams with Agilent and Silicon Labs to serve advanced GSM phones
News & Analysis  
2/18/2002   Post a comment
CANNES, France--Prior to the opening of a cellular phone trade show here, Tropian Inc. today announced it was collaborating with Agilent Technologies Inc. to jointly demonstrate a radio-frequency transmitter for GSM/GPRS/Edge handsets. Silicon Valley-based Tropian also announced a partnership with Silicon Laboratories Inc. to offer the industry's first tri-band E-GPRS radio transceiver reference-design platform.
Chartered strikes mixed-signal IP alliance with VCX exchange
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2/18/2002   Post a comment
SINGAPORE -- In a move to increase its support and availability of third-party mixed-signal design cores for silicon foundry customers, Chartered Semiconductor Manufacturing Ltd. today announced an alliance with the online Virtual Component Exchange (VCX) to lower the cost of "hardening" intellectual property (IP) for ICs fabricated in Chartered's wafer fabs.
STMicro launches division to create wireless infrastructure ICs
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2/18/2002   Post a comment
GENEVA--STMicroelectronics today announced a new chip division in the south of France to pursue dedicated products for wireless infrastructure equipment, such as base stations and other systems serving cellular phones and mobile terminals.
US players line up 3G chipsets
News & Analysis  
2/18/2002   Post a comment
Three US companies have said they will launch their 3G chipsets at 3GSM Congress this week.
Tough logic market tests Texas Instruments
News & Analysis  
2/15/2002   Post a comment
Texas Instruments Inc.'s logic business took it on the chin last year, compelling the company to pay close attention to this market as competitors encroach on TI's dominance. As with DSPs and analog products, TI has long led in logic sales, but it now faces a stiff challenge from Fairchild Semiconductor International Inc. and perhaps ON Semiconductor Inc. as well.
STMicro teams with U.K.-based CDT to develop drivers for LEP displays
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2/15/2002   Post a comment
GENEVA--STMicroelectronics today announced plans to develop device drivers for light emitting polymer (LEP) displays with U.K.-based Cambridge Display Technology Ltd. The two companies are targeting power-optimized and low-cost LEP drivers for portable applications, such as mobile phones, personal digital assistants (PDAs), and next-generation multimedia terminals.
MIPS rolls out faster 64-bit RISC core, promises 1-GHz at 0.10-micron process
News & Analysis  
2/14/2002   Post a comment
MOUNTAIN VIEW, Calif. -- Raising the speed stakes in the embedded processor market, MIPS Technologies Inc. announced a new 600-MHz version of its 64-bit MIPS64 RISC core for 0.13-micron process technologies. The new superscalar 20Kc "hard" core is scalable to 1-GHz speeds when produced in next-generation 0.10-micron processes, according to MIPS Technologies.
Philips integrates audio codec, touch-screen controller for handheld devices
News & Analysis  
2/13/2002   Post a comment
SAN JOSE -- Philips Semiconductors today announced a mixed-signal audio codec IC, which combines coder-decoder functions with a touch-screen controller and power management interface for handheld systems based on Intel Corp.'s embedded processors.
Infineon teams with PacketVideo and sci-worx to integrate multimedia in handsets
News & Analysis  
2/13/2002   Post a comment
MUNICH -- Infineon Technologies AG today announced an alliance with PacketVideo Corp. of San Diego and sci-worx GmbH of Hannover, Germany, to tightly integrate multimedia technologies with Internet modem chips and application processors for next-generation handsets.
Philips invests in Ishoni, plans joint development of broadband ICs
News & Analysis  
2/12/2002   Post a comment
SANTA CLARA, Calif. -- In a move to accelerate development of chip solutions for broadband communications, Royal Philips Electronics N.V. today announced a $25 million equity investment and majority ownership in four-year-old Ishoni Networks Inc. here.
Philips develops one-chip stereo radio for embedded use in consumer products
News & Analysis  
2/11/2002   Post a comment
EINDHOVEN, the Netherlands -- Philips Semiconductors today announced development of a single-chip implementation of stereo radio for European, U.S., and Japanese FM bands. The Dutch company said the breakthrough will enable low-cost FM radio receivers to be embedded in a range of portable consumer products, such as mobile phones, MP3 players, CD players, toys, and inexpensive promotional "giveaways."
Sierra Monolithics uses IBM's SiGe to make 40-Gbit chips for optical networks
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2/11/2002   Post a comment
REDONDO BEACH, Calif.-- Sierra Monolithics Inc. here today announced a highly integrated multi-rate chip set for 40-gigabit-per-second OC-768 optical communications. The company said its chip set was the first highly-integrated serializer/deserializer (SerDes) fabricated with silicon-germanium (SiGe) technology.
Standard Microsystems to enter USB 2.0 controller market
News & Analysis  
2/11/2002   Post a comment
HAUPPAUGE, N.Y.--Standard Microsystems Corp. here today announced its entry into the "Hi-Speed" Universal Serial Bus (USB) 2.0 peripheral controller market with plans to introduce two ICs supporting the higher-speed transfer rates of the technology.
Philips, MobilEye to integrate car driver 'assistance' on chip
News & Analysis  
2/4/2002   Post a comment
EINDHOVEN, the Netherlands -- Philips Semiconductors here and MobilEye B.V., also of the Netherlands, today announced a partnership to make system-on-chip solutions for automotive driver "assistance" applications, which the two companies said will be the first step towards development of "autonomous driving systems."
Via aims to become next $1 billion IC maker in Taiwan, preps 1-GHz processor
News & Analysis  
2/1/2002   Post a comment
TAIPEI, Taiwan -- Via Technologies Inc. will shortly unveil a new corporate and product diversification strategy that could turn the company into the next $1 billion chip maker in Taiwan.
Physical-Layer Solutions for Switch and Router Backplane Interconnect
News & Analysis  
2/1/2002   Post a comment
As the speed and port density of switches and routers increase, designing interconnect within these systems becomes more difficult. Michael Bollesen of Cypress Semiconductor compares LVDS and Differential CML for point-to-point connectivity of high-speed switch and router backplanes.


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