Cell phone chips integrate DSP, Xscale processor News & Analysis 2/28/2002 Post a comment Integrated baseband chips are being developed for 2.5G and 3G cell phones that merge Intel Corp.'s 400-MHz PXA250 Xscale processor, 400-MHz Micro Signal Architecture DSP and enough on-board flash to handle all DSP and applications code. The company hopes the parts, made in Intel's 0.13-micron process and being worked on at its R&D lab in Israel, can help recreate in the cellular world the kind of high-volume platform Intel and Microsoft forged with the PC.
Opti sales surge on last-time buys as its weighs liquidation plan News & Analysis 2/28/2002 Post a comment MOUNTAIN VIEW, Calif.--Still reconsidering a plan to liquidate itself, Opti Inc. here posted a net income of $381,000 on revenues of $2.5 million in the fourth quarter of 2001. The company's sales surged 98% on a sequential basis from the third quarter of 2001 because of an increase in last-time buys of PC chip sets, said Opti's chief executive officer.
Conexant shows Bluetooth-enabled digital camera platform News & Analysis 2/26/2002 Post a comment ORLANDO, Fla. -- Conexant Systems Inc. here at a photography trade show demonstrated a Bluetooth-enabled digital still camera platform. The digital camera platform is the first to include support for wireless transmissions via Bluetooth connections, said the Newport Beach, Calif., company.
Intel targets 'modular infrastructure' shift in communications systems News & Analysis 2/26/2002 Post a comment SAN FRANCISCO -- The year-and-a-half slump in communications markets is causing a sea of change in the industry, prompting systems houses to shift product development strategies from proprietary ASIC designs to standard ICs and a "modular infrastructure" business model, said Intel Corp.'s top networking executive during briefing with journalists on Monday evening.
Broadcom's ServerWorks launches Xeon chip set for DDR memory News & Analysis 2/25/2002 Post a comment SAN FRANCISCO -- ServerWorks Corp. today announced an optimized chip set for Intel Corp.'s Xeon processors using a new architecture supporting 3.2-gigabyte-per-second memory bandwidth--a 50% increase over an existing chip-set solution for Pentium III platforms, said the company at the Intel Developer Forum here.
Motorola integrates Kodak technology in CMOS sensor for video, camera systems News & Analysis 2/25/2002 Post a comment ORLANDO, Fla. - During a trade show here today, Motorola Inc. announced a new "camera-on-a-chip" sensor IC, based on what the company called "groundbreaking" wafer processing capabilities and patented photodiode and pixel design technology from Eastman Kodak Co. The second-generation ImageMOS VGA device also employs Motorola's patented image sensor technology.
Germany's IHP plans 5-GHz wireless LAN processor with MIPS core News & Analysis 2/20/2002 Post a comment FRANKFURT (ODER), Germany-- In a move to create 5-GHz processors for wireless local area networks, Germany's Innovations for High Performance (IHP) microelectronics institute here today announced it will cooperate with MIPS Technologies Inc. in development of wireless broadband communications ICs.
Zoran processor filters foul language from kids in Sanyo DVD players News & Analysis 2/20/2002 Post a comment SANTA CLARA, Calif. -- Zoran Corp. here and Japan's Sanyo Group today announced a long-term strategic partnership in DVD chip technology, and separately, the Santa Clara company said it has delivered a new integrated circuit that improves parental control over what children hear in TV programming, compared to V-Chip technology.
Motorola announces 3G platform in new open cell-phone strategy News & Analysis 2/19/2002 Post a comment CANNES, France -- Motorola Inc. rolled out its promised third-generation cellular phone chip set and development platform at the 3GSM World Congress conference here. The 3G phone chip set's baseband processor is based on the StarCore DSP architecture, which was jointly developed by Motorola and Agere Systems Inc.
Microsoft supports smart phone platform based on TI's OMAP News & Analysis 2/19/2002 Post a comment CANNES, France -- In a move to play more of its cards in the next-generation "smart phone" marketplace, Microsoft Corp. today announced its Windows Powered Smartphone 2002 software is available on a DSP-based design reference platform from Texas Instruments Inc.
Microsoft, Intel try to set PDA/smart phone standards like they did in PCs News & Analysis 2/19/2002 Post a comment CANNES, France -- PC technology giants Microsoft Corp. and Intel Corp. today announced a joint initiative to develop reference design platforms for next-generation personal digital assistants (PDAs) and smart phones. The two companies said the lack of industry standards in wireless communications systems was holding back the spread of smart phones and next-generation PDAs.
Nokia, TI offer compete 2.5/3G platform for cell-phone makers News & Analysis 2/18/2002 Post a comment CANNES, France -- The race to provide packaged solutions for next-generation cellular phone handsets is heating up. Finland's Nokia Group and Texas Instruments Inc. today announced complete "open and standards-based" reference platforms for 2.5- and third-generation (3G) smart phones using Nokia's Series 60 terminal software and TI's OMAP integrated digital signal processor.
Tropian teams with Agilent and Silicon Labs to serve advanced GSM phones News & Analysis 2/18/2002 Post a comment CANNES, France--Prior to the opening of a cellular phone trade show here, Tropian Inc. today announced it was collaborating with Agilent Technologies Inc. to jointly demonstrate a radio-frequency transmitter for GSM/GPRS/Edge handsets. Silicon Valley-based Tropian also announced a partnership with Silicon Laboratories Inc. to offer the industry's first tri-band E-GPRS radio transceiver reference-design platform.
Chartered strikes mixed-signal IP alliance with VCX exchange News & Analysis 2/18/2002 Post a comment SINGAPORE -- In a move to increase its support and availability of third-party mixed-signal design cores for silicon foundry customers, Chartered Semiconductor Manufacturing Ltd. today announced an alliance with the online Virtual Component Exchange (VCX) to lower the cost of "hardening" intellectual property (IP) for ICs fabricated in Chartered's wafer fabs.
Tough logic market tests Texas Instruments News & Analysis 2/15/2002 Post a comment Texas Instruments Inc.'s logic business took it on the chin last year, compelling the company to pay close attention to this market as competitors encroach on TI's dominance.
As with DSPs and analog products, TI has long led in logic sales, but it now faces a stiff challenge from Fairchild Semiconductor International Inc. and perhaps ON Semiconductor Inc. as well.
STMicro teams with U.K.-based CDT to develop drivers for LEP displays News & Analysis 2/15/2002 Post a comment GENEVA--STMicroelectronics today announced plans to develop device drivers for light emitting polymer (LEP) displays with U.K.-based Cambridge Display Technology Ltd. The two companies are targeting power-optimized and low-cost LEP drivers for portable applications, such as mobile phones, personal digital assistants (PDAs), and next-generation multimedia terminals.
MIPS rolls out faster 64-bit RISC core, promises 1-GHz at 0.10-micron process News & Analysis 2/14/2002 Post a comment MOUNTAIN VIEW, Calif. -- Raising the speed stakes in the embedded processor market, MIPS Technologies Inc. announced a new 600-MHz version of its 64-bit MIPS64 RISC core for 0.13-micron process technologies. The new superscalar 20Kc "hard" core is scalable to 1-GHz speeds when produced in next-generation 0.10-micron processes, according to MIPS Technologies.
Philips develops one-chip stereo radio for embedded use in consumer products News & Analysis 2/11/2002 Post a comment EINDHOVEN, the Netherlands -- Philips Semiconductors today announced development of a single-chip implementation of stereo radio for European, U.S., and Japanese FM bands. The Dutch company said the breakthrough will enable low-cost FM radio receivers to be embedded in a range of portable consumer products, such as mobile phones, MP3 players, CD players, toys, and inexpensive promotional "giveaways."
Philips, MobilEye to integrate car driver 'assistance' on chip News & Analysis 2/4/2002 Post a comment EINDHOVEN, the Netherlands -- Philips Semiconductors here and MobilEye B.V., also of the Netherlands, today announced a partnership to make system-on-chip solutions for automotive driver "assistance" applications, which the two companies said will be the first step towards development of "autonomous driving systems."
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.