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Content tagged with Logic/Interface
posted in February 2008
Adaptive digital power controllers target efficiency-sensitive apps
Product News  
2/28/2008   Post a comment
Zilker Labs Inc. has introduced adaptive DC-DC power controllers that are intended to maximize efficiency in power-constrained applications, particularly in the embedded computing, storage and telecom/datacom sectors.
Power controller features dynamic phase dropping
Product News  
2/28/2008   Post a comment
Check out Primarion's PX3664, a digital multi-phase power controller with dynamic phasing for synchronous DC/DC buck converters in computing and communications applications.
RS-485/RS-422 transceivers feature integrated LDO
Product News  
2/26/2008   Post a comment
Maxim's latest half-duplex RS-485/RS-422 transceivers are designed to save board space and reduce cost in automotive and industrial applications.
60-GHz radio-on-a-chip is smaller than a dime
Product News  
2/20/2008   Post a comment
This integrated product from Vubiq is intended to advance wireless HD video, wireless Gigabit LANs and WPAN development.
The nuts and bolts of HDCP
Design How-To  
2/20/2008   Post a comment
As the digital distribution of television, movies and music expands, content providers are growing increasingly concerned about the simplicity with which content pirates can copy and share copyrighted material. Various digital rights management (DRM) schemes have been developed. To protect digital content as it's transmitted over cables between devices, Intel developed a DRM scheme known as the High-bandwidth Digital Content Protection system (HDCP).
Chipset offers flexible approach to implementing AMD power CPU
Product News  
2/19/2008   Post a comment
IR has introduced the IR3514 and IR3507 XPhase chipset that enables designers to migrate from AMD processors requiring a parallel VID to SVID processors without the need to change the motherboard.
Hall-effect sensors integrate MCU, digital interfaces
Product News  
2/19/2008   Post a comment
Optimized for automotive and mechatronic applications, Micronas announced the HAL 28xy series of Hall-effect sensors, which integrate a microcontroller (MCU), a temperature sensor, advanced on-chip compensation, and a digital interface.
After the war: more hurdles ahead for high def
News & Analysis  
2/19/2008   1 comment
The demise of Toshiba's HD DVD format may help nudge high definition video forward, but there is still plenty of work ahead in HD video and an uncertain impact on videogame consoles.
Micron rolls out 2-megapixel imaging SoC
Product News  
2/19/2008   Post a comment
Check out Micron's one-fifth inch 2-megapixel (MP) imaging SoC that is powered by DigitalClarity technology for thin mobile phones, PC cameras and personal digital assistants.
Audio line driver cuts cost, components in TV peripherals
Product News  
2/15/2008   Post a comment
The DRV601 2-Vrms-output stereo line driver from Texas Instruments aims to reduce cost and component count and optimize performance in set-top boxes, HDTV receivers, DVD players, gaming consoles and portable media players.
USB power management switches adjust current limit
Product News  
2/15/2008   Post a comment
TI's high accuracy power distribution switches with integrated 85-milliohm FET offer flexibility in a 2 x 2mm package.
Sun preps Infiniband for broad net role
News & Analysis  
2/14/2008   Post a comment
Sun Microsystems hopes to get a jump on Ethernet developers later this year when it rolls out its first Infiniband products capable of natively handling networking, storage and clustering jobs, leapfrogging a similar vision of a unified data center network based on advances in Ethernet.
First GHz chip to be interconnected with nanotubes
Product News  
2/14/2008   Post a comment
The world's first CMOS circuit using nanotubes as an interconnect was recently designed at Stanford University, in cooperation with Toshiba.
RF SoC supports global TV standards for cell phones
Product News  
2/13/2008   Post a comment
Samsung unveiled the S3C4F60, a 65-nm single-chip mobile TV SoC, which combines a channel decoder with an RF chip.
Front-end module targets 3.9G wireless applications
Product News  
2/13/2008   Post a comment
Check out Skyworks' LTE front-end module that integrates the power amplifier (PA), interstage filter, input and output matching, power detection, and duplexer in a single 4 x 7 x 1.1 mm package.
ST readies integrated SoC for NFC applications
Product News  
2/13/2008   Post a comment
STMicroelectronics will start sampling in the second quarter of the year to lead customers engineering versions of an integrated secure SoC for Near Field Communications applications.
Chip makers turn the crank on 10G Ethernet
News & Analysis  
2/13/2008   Post a comment
Chip makers including NetXen and ServerEngines are gearing up a new wave of 10Gbit/second Ethernet silicon supporting the latest PCI Express links and virtualization standards to take servers another step down the road to converged data center networks.
Infineon brings advanced mobile features to low-cost handsets
Product News  
2/12/2008   Post a comment
In an effort to bring advanced mobile phone features such as camera, mobile Internet and audio-entertainment to low-cost markets, Infineon has developed the X-GOLD113 and X-GOLD213, its third generation of single chips manufactured using 65-nm process technology.
6-channel LED driver line expands with 1-wire interfaces
Product News  
2/12/2008   1 comment
Leadis Technology Inc. is sampling LDS8867, LDS8868 and LDS8869, a family of charge-pump based LED drivers that uses the company's proprietary PowerLite Current Regulator to deliver up to 95% power efficiency for longer battery life.
DVB-H/T receiver housed in 5-mm x 5-mm CSP package
Product News  
2/11/2008   Post a comment
Abilis' digital mobile TV receiver integrates a multi-band RF tuner, advanced OFDM demodulator, memory and interfaces onto a single 90nm CMOS die, with the receiver performance surpassing the MBRAI 2 and Nordig 1.0.3 specifications.
Low-power GPS chip targets mobile phones
Product News  
2/11/2008   Post a comment
NXP Semiconductors has introduced its first single-chip, Assisted-GPS (A-GPS) product, designed for use in both mobile phones and standalone personal navigation devices (PNDs).
Vacuum system reduces automotive plant carbon footprint: Part 1 - Nature of the problem
Design How-To  
2/8/2008   Post a comment
Modern material handling and control systems can cut energy consumption when most electrical power is produced by gas, oil, and coal power plants.
High-speed USB slips under $1 mark
Product News  
2/7/2008   Post a comment
The cost of putting high-speed USB into a product drops to less than $1 with the release of an integrated product from SMSC, which is also squeezing the size and power consumption to new lows with its 332x family of transceivers.
Mobile TV heats up (again) with Broadcom's 65-nm SOC
Product News  
2/6/2008   1 comment
The oft-hyped mobile TV market is re-emerging with a vengeance at the Mobile World Congress as Broadcom joins the fray with the industry's first single-chip DVB-T/DVB-H system-on-chip based on 65-nm CMOS process technology.
64-bit RFID tag could replace bar codes
News & Analysis  
2/6/2008   Post a comment
Researchers from the European Holst Center said their 64-bit, inductively-coupled, passive RFID tag achieved a record 780-bit/second data readout.
ISSCC shrinks 11n, Wimax and Bluetooth
Product News  
2/6/2008   1 comment
The cost of the latest Wi-Fi and Bluetooth links are headed south, and WiMax may come to a cellphone near you soon based on papers from Atheros and STMicroelectronics at the International Solid State Circuits Conference.
Circuit board layout guidelines for Class-D amplifiers
Design How-To  
2/6/2008   3 comments
Optimize the performance and reliability of your Class-D amplifier design by following these basic pc-board layout practices.
GaAs MMIC chipset packaging uses surface-mount technology
Product News  
2/4/2008   Post a comment
Mimix Broadband's latest receiver delivers a 3.5 dB noise figure, and its transmitter provides a linear, variable gain.
Multi-sensor interface chip consumes 30-µW of power
Product News  
2/3/2008   Post a comment
ZMD launched the first member of its MULti-Sensor IC (MUSiC) semiconductor family—the ZMD21013, which is a low-power multi-channel device aimed at microcontroller-based mobile electronic products.
Introducing MagnaPHY high-speed chip-to-chip serial interconnect
Design How-To  
2/1/2008   Post a comment
Everything you need in your chip-to-chip interconnect (high-speed, low pin-count, etc.); sort of like PCIe but without the overhead and oriented toward high-speed embedded applications.


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