Breaking News
Content tagged with Logic/Interface
posted in February 2009
Page 1 / 2   >   >>
Gennum coax video interface delivers uncompressed HD for surveillance, industrial imaging applications
Product News  
2/27/2009   Post a comment
Aviia (Advanced Video Interface for Industrial Applications) is a robust interface for high definition (HD) video over coaxial cable lengths up to 100 meters.
2G dual-band transmit modules target emerging market handsets
Product News  
2/26/2009   Post a comment
RF Micro Devices' family of dual-band GSM/GPRS transmit modules provides a small footprint, improved efficiency and robust ESD protection.
UMTS femto base-station chipset drives adoption in access points, residential gateways
Product News  
2/26/2009   Post a comment
The receiver and transmitter in Maxim's new UMTS femto base-station chipset use the company's proprietary high dynamic range MAX-PHY interface to eliminate the need for a mixed-signal analog front-end.
Atmel : RF transceiver is IEEE P802.15.4c compliant
Product News  
2/26/2009   Post a comment
Atmel announced the AT86RF212, an IEEE P802.15.4c compliant RF transceiver for the Chinese wireless market.
INTERFACES: PCI Express Digital I/O Interface is isolated
News & Analysis  
2/26/2009   Post a comment
SeaLevel Systems' DIO-32.PCIe adaptor has 16 optically isolated inputs & 16 Reed relay outputs (SPST) and is PCI Express X1 compliant.
Home networking groups edge toward G.hn
News & Analysis  
2/25/2009   1 comment
Three ad hoc groups promoting competing networking standards have formed liaisons with the Home Grid Forum, another step toward industry support for the ITU G.hn effort to create a single wired standard for home networks over powerline, coax and telephone lines.
At ESC Silicon Valley, survival's in the bag
Product News  
2/23/2009   Post a comment
Books, scholarships, games, training, and more, all in a pretty cool Safari bag--yours if you register quickly for ESC Silicon Valley.
2009 EE Times ACE Awards finalists announced
Product News  
2/23/2009   Post a comment
See the companies, executives, teams, and others selected as ACE Award finalists.
Startup virtualizes data center I/O
News & Analysis  
2/23/2009   Post a comment
Startup VirtenSys officially debuts today aggregation switches that virtualize server I/O in hardware, aiming to lower cost and power consumption and ease management.
AxisNT touts efficiency gains of tripe mode PA module
News & Analysis  
2/23/2009   Post a comment
Wireless infrastructure group Axis Network Technology (Aylesbury, England) has started sampling a triple mode power amplifier module and IP linearization solution that, it says, offers a 45 percent final stage efficiency for UMTS 64QAM systems at 2.1GHz.
Netbooks, smart phones: Will the twain meet?
Teardown  
2/23/2009   Post a comment
Conventional laptops and mobile phones remain worlds apart when it comes to cost, size and design metrics.
How to pick a RapidIO switch
Design How-To  
2/20/2009   Post a comment
Here are the secrets to selecting the right RapidIO switch--and to picking a vendor that help you with the design process.
Recession seen slowing embedded modem growth
News & Analysis  
2/18/2009   Post a comment
More than 35 million cellular modems for laptops and netbooks shipped in 2008, 10 percent of which were embedded in the computers, according to market research firm ABI Research. The firm expects the number of embedded modems to double to 7 million units in 2009, fewer than it had previously forecast.
Teardown ESC: Open-source cell phone
Design How-To  
2/18/2009   3 comments
See what's inside Openmoko's open-source cell phone at the Embedded Systems Conference in San Jose.
Teardown ESC: Beat your child to a real 3D gaming experience
Product News  
2/18/2009   Post a comment
Check out the teardown of a 3rd SpaceVest from TN Games at ESC in Silicon Valley--your child will envy you.
Teardown ESC: Oregon Scientific's SmartGlobe Deluxe
Product News  
2/18/2009   Post a comment
The SmartGlobe is the first Internet-updatable model of the earth. Check out its innards at the Embedded Systems Conference in San Jose.
Economic realities to impact LTE roll-out
News & Analysis  
2/18/2009   Post a comment
Fourth generation networks and specifically LTE (Long Term Evolution) may be one of the major talking points here at the Mobile World Congress, but the messages are unclear about what their impact will be in the short term.
Demand soars for energy efficient electronics
News & Analysis  
2/17/2009   2 comments
Energy efficiency has fully emerged as a key requirement for power electronics and management.
Mellanox bridges data center nets
News & Analysis  
2/17/2009   Post a comment
Mellanox Technologies, Ltd. will jump into the market for multi-protocol bridging chips and systems with its BridgeX chip and a family of gateway systems based on it supporting 40Gb/s InfiniBand, 10 Gigabit Ethernet and 8Gb/s Fibre Channel.
TI lance OMAP 4 basé sur ARM Cortex-A9
News & Analysis  
2/17/2009   Post a comment
Texas Instruments a aggrandi sa famille de produits OMAP pour applications mobiles avec une quatrième génération qui utilise les coeurs Cortex-A9 MPCores de ARM.
BOARDS: New communications PCIe boards feature direct FPGA connectivity
Product News  
2/17/2009   Post a comment
Pentek's 7700 family designed for routing flexibility for communications, software radio, radar, telemetry, and signal intelligence
Selecting the right platform for a media-centric embedded system
News & Analysis  
2/16/2009   Post a comment
Selecting from the many available platforms for a video-enabled embedded application is a daunting task, but this special feature takes designers through the technical and market-driven decision points.
Startup aims Wi-Fi at embedded systems
Product News  
2/16/2009   Post a comment
Startup ZeroG Wireless officially throws its hat into the ring of competitors trying to bring Wi-Fi to embedded systems with a new chip and module that could bring 802.11b connectivity to new lows in cost, size and power consumption.
Infineon lance une plateforme 2G/3G/HSDPA low cost
News & Analysis  
2/16/2009   Post a comment
Infineon Technologies AG (Munich, Allemagne) a annoncé développer une plateforme pour l'accès internet rapide pour téléphone portable comportant une connexion 3G à "côut optimisé". L'échantillonnage est prévu en juin.
ST-Ericsson annonce une architecture Multiprocesseur ARM sous Symbian
News & Analysis  
2/16/2009   Post a comment
ST-Ericsson a prévu de dévoiler une plateforme mobile multi processeurs ( basé sur ARM Cortex-A9) sous l'OS Symbian durant l'exposition Mobile World Congress à Barcelone.
Sequans launches single-die, triple-frequency mobile WiMAX chip
Product News  
2/15/2009   Post a comment
The SQN1210 reduces power consumption by 35%, implements uplink MIMO for double cell coverage, and paves the way to a 4G cellular solution.
AMCC cuts more than 100 jobs
News & Analysis  
2/11/2009   Post a comment
Applied Micro Circuits cut more than 100 jobs and said it would reduce employee compensation.
Engineers push into 40G networking
News & Analysis  
2/11/2009   Post a comment
Engineers showed progress pulling transceivers and other building blocks for 40 Gbit/second networking into CMOS at the International Solid State Circuits Conference.
Want to connect at ESC? Use Facebook, LinkedIn, Twitter, and MyESC
Product News  
2/11/2009   2 comments
Embedded systems designers can exchange ideas via Internet-based social networking.
Researcher describes 77-GHz transceiver
News & Analysis  
2/11/2009   Post a comment
Fujitsu described what it claimed was the world's first working 77-GHz transceiver, and an NEC researcher discussed an ultrawideband device capable of data rates up to 2.88 Gbits/second at the International Solid State Circuits Conference.
Inside Contactless partenaire de Qualcomm
News & Analysis  
2/11/2009   Post a comment
Inside Contactless le spécialiste des composants pour carte à puce sans contacts va travailler avec Qualcomm Inc. pour développer deux conceptions de référence de portables 3G NFC
Serdes about to get extreme makeover
Product News  
2/10/2009   2 comments
Serdes, the serializer/deserializer chips at the heart of many high-speed designs for the past decade, are about to get an extreme makeover from analog to digital techniques for many designs over the next few years according to a panel of experts at the International Solid State Circuits Conference.
Intel, NEC show diverging CPU paths
News & Analysis  
2/10/2009   1 comment
Intel detailed its Nehalem CPUs and NEC showed a promising approach to stacked memory and logic chips at the International Solid State Circuits Conference, raising the question of whether the future of microprocessors will be down the system-on-chip or system-in-package road.
Connect with international press at ESC
Product News  
2/9/2009   Post a comment
Spread the news about your products around the world. ESC Silicon Valley has new opportunities to meet the international press.
Free sponsored sessions at ESC deliver real stuff
Product News  
2/9/2009   Post a comment
Vendors offer indepth info about Windows' Embedded, nonvolatile memory architectures, and more.
Radio chips dial into medical apps
News & Analysis  
2/9/2009   Post a comment
Radio frequency CMOS is being applied to a growing but fragmented set of medical applications ranging from imaging and DNA testing to networking in and around the body, according to a panel of experts here in a session before the formal opening of the International Solid State Circuits Conference.
Video: Green tech drives ICs beyond silicon
News & Analysis  
2/9/2009   Post a comment
The green technology era will drive semiconductor innovations in and beyond silicon across a wide variety of applications, according to Rene Penning de Vries, chief technology officer of NXP Semiconductors in a keynote at the International Solid State Circuits Conference.
Analysis: Smartphones throw suppliers a lifeline
News & Analysis  
2/6/2009   Post a comment
Take a close look at any supplier of ICs that is still showing revenue growth and, more often than not, the relative strength of the smartphone market deserves at least part of the credit.
Smart sensor targets advanced machine vision
Product News  
2/6/2009   Post a comment
A smart sensor that aims to lower the cost of automotive, industrial and consumer electronics machine vision systems integrates a DSP chip with a CMOS imager, according to the Swiss Center for Electronics.
Silicon Image in the black for fourth quarter
News & Analysis  
2/6/2009   Post a comment
In what has become an increasingly rare event in the semiconductor industry, fabless chip vendor Silicon Image reported a profit for the fourth quarter of 2008.
SMIC cuts pay, capex after 28% revenue decline
News & Analysis  
2/5/2009   Post a comment
Chinese semiconductor foundry Semiconductor Manufacturing International Corp. plans a dramatic cut in capital expenditures and will reduce payroll costs by 15 percent--without a workforce reduction--after fourth quarter 2008 revenue declined more than 25 percent.
Panel eyes road to 25Gbit/s backplanes
News & Analysis  
2/5/2009   Post a comment
Ethernet will shift up to 40 and 100 Gbits/second data rates using 10 Gbit/s and eventually 25 Gbit/s serial channels in as few as three years, said experts at a DesignCon panel here, but the road to those new speed grades has plenty of bumps ahead, they noted.
Gesture control enabled by 3-D sensor
Product News  
2/4/2009   Post a comment
Emerging consumer electronics applications have prompted smart 3-D sensor chip maker Canesta Inc. to adapt its 3-D CMOS image technology from automotive applications to a new consumer version of its 3-D image processing chip.
Phyworks : Low power equaliser, driver and retimer simplifies 10G SFP system design
Product News  
2/4/2009   Post a comment
The PHY1066 equaliser, driver and retimer IC from Phyworks enables host board designers to create 10 Gbits/s Ethernet SFP+ receive and transmit interfaces for ‘direct attach’ passive twin-ax copper cables and 10GBASE-SR optical modules.
EPCOS : EMC filters offer high attenuation
Product News  
2/4/2009   Post a comment
With the B84771A, B84771C and B84771M series EPCOS offers compact filter solutions that cost-effectively combine an IEC connector with an EMC filter.
Video: USB 3.0 and power tool at DesignCon
News & Analysis  
2/4/2009   Post a comment
Silicon blocks for the emerging USB 3.0 interface and software tools to ease the job of power integrity design grabbed my attention on the show floor at DesignCon.
New SATA Bidirectional Repeater ICs offer low dynamic power characteristics
Product News  
2/3/2009   Post a comment
Fabless semiconductor company, Parade Technologies Ltd., has introduced two new SATA Bidirectional Repeater integrated circuits that exhibit low dynamic power characteristics.
Signal integrity issues dog high-speed design
News & Analysis  
2/3/2009   Post a comment
Engineers are struggling with old and new signal integrity issues as they drive toward designs in the 5 to 10 Gbit/s range, according to a panel of experts at DesignCon.
Maximize high-speed signal integrity with the right choice of cables, layout, and equalizer ICs (Part 2)
Design How-To  
2/2/2009   Post a comment
As data rates increase, maintaining signal integrity is more challenging; this multipart article looks at fundamentals of the problem, as well as passive and active approaches to dealing with it.
Renesas : Automotive dual-core SoC includes image recognition
Product News  
2/2/2009   Post a comment
Renesas Technology has announced the SH7776 (SH-Navi3), a dual-core system-on-chip (SoC) device with on-chip enhanced graphics functions and a high-performance image recognition processing function for the next generation high-performance car information terminals.
Page 1 / 2   >   >>


EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Aging Brass: Cow Poop vs. Horse Doo-Doo
Max Maxfield
35 comments
As you may recall, one of the things I want to do with the brass panels I'm using in my Inamorata Prognostication Engine is to make them look really old. Since everything is being mounted ...

EDN Staff

11 Summer Vacation Spots for Engineers
EDN Staff
11 comments
This collection of places from technology history, museums, and modern marvels is a roadmap for an engineering adventure that will take you around the world. Here are just a few spots ...

Glen Chenier

Engineers Solve Analog/Digital Problem, Invent Creative Expletives
Glen Chenier
11 comments
- An analog engineer and a digital engineer join forces, use their respective skills, and pull a few bunnies out of a hat to troubleshoot a system with which they are completely ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
45 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

Flash Poll
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)