Home networking groups edge toward G.hn News & Analysis 2/25/2009 1 comment Three ad hoc groups promoting competing networking standards have formed liaisons with the Home Grid Forum, another step toward industry support for the ITU G.hn effort to create a single wired standard for home networks over powerline, coax and telephone lines.
AxisNT touts efficiency gains of tripe mode PA module News & Analysis 2/23/2009 Post a comment Wireless infrastructure group Axis Network Technology (Aylesbury, England) has started sampling a triple mode power amplifier module and IP linearization solution that, it says, offers a 45 percent final stage efficiency for UMTS 64QAM systems at 2.1GHz.
Recession seen slowing embedded modem growth News & Analysis 2/18/2009 Post a comment More than 35 million cellular modems for laptops and netbooks shipped in 2008, 10 percent of which were embedded in the computers, according to market research firm ABI Research. The firm expects the number of embedded modems to double to 7 million units in 2009, fewer than it had previously forecast.
Economic realities to impact LTE roll-out News & Analysis 2/18/2009 Post a comment Fourth generation networks and specifically LTE (Long Term Evolution) may be one of the major talking points here at the Mobile World Congress, but the messages are unclear about what their impact will be in the short term.
Mellanox bridges data center nets News & Analysis 2/17/2009 Post a comment Mellanox Technologies, Ltd. will jump into the market for multi-protocol bridging chips and systems with its BridgeX chip and a family of gateway systems based on it supporting 40Gb/s InfiniBand, 10 Gigabit Ethernet and 8Gb/s Fibre Channel.
Startup aims Wi-Fi at embedded systems Product News 2/16/2009 Post a comment Startup ZeroG Wireless officially throws its hat into the ring of competitors trying to bring Wi-Fi to embedded systems with a new chip and module that could bring 802.11b connectivity to new lows in cost, size and power consumption.
Engineers push into 40G networking News & Analysis 2/11/2009 Post a comment Engineers showed progress pulling transceivers and other building blocks for 40 Gbit/second networking into CMOS at the International Solid State Circuits Conference.
Researcher describes 77-GHz transceiver News & Analysis 2/11/2009 Post a comment Fujitsu described what it claimed was the world's first working 77-GHz transceiver, and an NEC researcher discussed an ultrawideband device capable of data rates up to 2.88 Gbits/second at the International Solid State Circuits Conference.
Serdes about to get extreme makeover Product News 2/10/2009 2 comments Serdes, the serializer/deserializer chips at the heart of many high-speed designs for the past decade, are about to get an extreme makeover from analog to digital techniques for many designs over the next few years according to a panel of experts at the International Solid State Circuits Conference.
Intel, NEC show diverging CPU paths News & Analysis 2/10/2009 1 comment Intel detailed its Nehalem CPUs and NEC showed a promising approach to stacked memory and logic chips at the International Solid State Circuits Conference, raising the question of whether the future of microprocessors will be down the system-on-chip or system-in-package road.
Radio chips dial into medical apps News & Analysis 2/9/2009 Post a comment Radio frequency CMOS is being applied to a growing but fragmented set of medical applications ranging from imaging and DNA testing to networking in and around the body, according to a panel of experts here in a session before the formal opening of the International Solid State Circuits Conference.
Video: Green tech drives ICs beyond silicon News & Analysis 2/9/2009 Post a comment The green technology era will drive semiconductor innovations in and beyond silicon across a wide variety of applications, according to Rene Penning de Vries, chief technology officer of NXP Semiconductors in a keynote at the International Solid State Circuits Conference.
SMIC cuts pay, capex after 28% revenue decline News & Analysis 2/5/2009 Post a comment Chinese semiconductor foundry Semiconductor Manufacturing International Corp. plans a dramatic cut in capital expenditures and will reduce payroll costs by 15 percent--without a workforce reduction--after fourth quarter 2008 revenue declined more than 25 percent.
Panel eyes road to 25Gbit/s backplanes News & Analysis 2/5/2009 Post a comment Ethernet will shift up to 40 and 100 Gbits/second data rates using 10 Gbit/s and eventually 25 Gbit/s serial channels in as few as three years, said experts at a DesignCon panel here, but the road to those new speed grades has plenty of bumps ahead, they noted.
Gesture control enabled by 3-D sensor Product News 2/4/2009 Post a comment Emerging consumer electronics applications have prompted smart 3-D sensor chip maker Canesta Inc. to adapt its 3-D CMOS image technology from automotive applications to a new consumer version of its 3-D image processing chip.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.