Mil/aero group foresees shift to optical in 2012 News & Analysis 2/24/2010 1 comment The VITA Standards Organization, a leading standards group for military and aerospace markets, will announce as early as next week a call for participation in a group to explore the feasibility of deploying in 2012 products with optical backplanes and system interconnects.
Comment: Sparking interest in engineering Industrial Control DesignLine Blog 2/23/2010 Post a comment Intel is behind a $3.5 billion initiative to support investment in U.S.-based growth-oriented industries. The initiative also wants to increase jobs available this year for recent college graduates.
Mid-year slump to limit chip market growth, says analyst News & Analysis 2/23/2010 Post a comment A mid-year slump in the western economy is likely to inhibit consumer electronics spending and hold annual semiconductor revenue growth back at 11.2 percent in 2010, according to Robert Castellano of market research company The Information Network (New Tripoli, Pennsylvania).
X-FAB opens UK branch office News & Analysis 2/23/2010 Post a comment Following the recent sale of its Plymouth silicon fabrication facility to Plessey Semiconductors, X-FAB has established a UK office supporting research and development, customer hotline support and sales
Analysts: Five observations on mobile from MWC News & Analysis 2/19/2010 Post a comment Apple and software are in the driver's seat in the mobile market but platform fragmentation may be ahead, according to analysts from Barclay's Capital who shared their observations from the Mobile World Congress in Barcelona this week.
ISSCC, Nvidia shortfall lead weekly story ranking News & Analysis 2/19/2010 Post a comment Here are the top five online stories for the week beginning Sunday, Feb. 14, as ranked by EE Times readers, up to and including Friday, Feb. 19. The ranking is based on the number of reader "views" or "hits" on a particular article.
Crisis hits Elmos 2009 figures News & Analysis 2/19/2010 Post a comment Automotive chip vendor Elmos AG (Dortmund, Germany) has been hit badly in FY 2009 by the automotive crisis. Despite a strong uptrend in the second half of the year, the company saw its sales decline drastically.
Intel lab explores nanoscale power storage News & Analysis 2/18/2010 1 comment Intel researchers are exploring nanoscale materials that could be used to create ultracapacitors with a greater energy density than today's lithium ion batteries as part of work in a new lab dedicated to work on microgrids.
PLX fires up 8 GHz PCI Express chip News & Analysis 2/17/2010 Post a comment PLX Technology, Inc. announced it has working PCI Express Gen 3 silicon that it will demo to key customers before the end of March and aims to sample a range of PCIe Gen 3 switches made in 40nm process technology before the end of the year, starting with server and storage switches sampling before July.
ZeroG chief executive joins GainSpan News & Analysis 2/17/2010 Post a comment Greg Winner has been named chief executive of embedded Wi-Fi chip startup GainSpan Corp., fresh from closing a deal in January to sell its competitor startup ZeroG to Microchip Technology Inc.
Six things that surprised us at ISSCC News & Analysis 2/16/2010 1 comment The pervasive focus on power management, the lack of papers on nanotechnology and software and the slow recovery of attendance were among the surprises for EE Times editors at the 2001 ISSCC last week.
Intel's Gargini pushes III-V-on-silicon as 2015 transistor option News & Analysis 2/12/2010 Post a comment A presentation prepared by Paolo Gargini, Intel's director of technology strategy, to give to the Industry Strategy Symposium Europe, held in Dublin, Ireland, earlier this week, stressed Intel's progress in adding compound semiconductor layers to silicon as a means of continuing scaling and reducing power consumption.
Infineon emphasizes power, China in 'new start' News & Analysis 2/11/2010 1 comment Infineon Technologies AG (Munich, Germany) is set to drive itself forward by focusing on power semiconductors and the Chinese market, according to the text of speech given to shareholders by CEO Peter Bauer.
UMC sees January sales drop 9% sequentially News & Analysis 2/11/2010 Post a comment United Microelectronics Corp., the world's second largest foundry, had January sales of NT$8,600 million (about $268 million), a decrease of 9.25 percent from the December 2009 sales figure of NT$9,292 million (about $290 million).
IDT launches PCIe Gen 2 system interconnect product line Product News 2/10/2010 1 comment IDT (Integrated Device Technology Inc.) has started to sample a line of PCI Express (PCIe) Gen2 system interconnect switching products, featuring an advanced switch architecture to support multi-domain data and control plane connectivity for multi-root communications and embedded applications.
TSMC sees sales drop in January News & Analysis 2/10/2010 Post a comment Foundry giant Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) said its January sales on an unconsolidated basis, were approximately NT$29.16 billion (about $908 million) a decrease of 4.3 percent from December 2009 and an increase of 134.4 percent over January 2009.
Ozmo hires veteran as CEO News & Analysis 2/10/2010 Post a comment Ozmo Devices Inc. (Palo Alto, Calif.), a provider of Wi-Fi Personal Area Network (Wi-Fi PAN) chips, has recruited Bill McLean to serve as chief executive officer.
Medtronic turns a light on brain implants News & Analysis 2/10/2010 Post a comment Medtronic has developed prototype implant that uses light to alter the behaviors of nerve cells in the human brain, one of a handful of papers at the International Solid State Circuits Conference seeking more refined electronic techniques to diagnose or apply therapies to neural conditions.
SMIC expected to announce capital injection News & Analysis 2/9/2010 Post a comment Semiconductor Manufacturing International Corp. (Shanghai, China) is expected to announce a capital injection from Datang Telecom Technology & Industry Holdings Co. Ltd., an existing investor, at a quarterly investor conference call on Wednesday (Feb. 9).
Nujira launches power-saving alliance at MWC News & Analysis 2/9/2010 Post a comment Mobile phone power amplifier specialist Nujira Ltd. (Cambridge, England) has announced the formation of an OpenET Alliance to develop and publish open specifications for envelope-tracking interfaces for 3G and 4G platforms.
Texas Instruments samples quad-radio chip News & Analysis 2/9/2010 Post a comment Texas Instruments Inc. (Dallas, Texas) has produced a wireless connectivity chip, intended to provide extra radios beside the main cellular channel needed on a mobile phone. The WiLink 7.0 (part numbers WL1281 and WL1283) offers wireless LAN 802.11n, GPS, Bluetooth and FM transmit and receive.
Single mode Bluetooth low energy module Product News 2/9/2010 Post a comment The Insight SiP ISP091201 is a completely self-contained Bluetooth low energy SiP module that includes Nordic's MicroBlue nRF8001 connectivity-on-chip solution, integrating the radio, baseband and software stack plus an integrated antenna, 16MHz crystal and 15 supporting passive components.
An analyst's 10 reasons to be cheerful News & Analysis 2/8/2010 Post a comment Bill McClean, analyst with IC Insights Inc. (Scottsdale, Ariz.) has provided ten reasons that support the idea that 2010 could be between a good and a great year for the semiconductor industry.
Engineers explore life beyond 10 Gbit links News & Analysis 2/8/2010 1 comment Electronics engineers are bumping up against the limits of their tools and techniques—and perhaps even physics--to keep pace with the rapidly expanding needs of an Internet-driven society as they coalesce around a move to 25 Gbit/second chips and ponder what comes next.
CSEM offers transceiver-with-DSP for wireless networks Product News 2/4/2010 Post a comment Centre Suisse d'Electronique et de Microtechnique (Neuchatel, Switzerland) has produced a one-volt RF transceiver with an integrated DSP tailored for portable wireless communications in such things as wireless sensor networks and body area networks.