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posted in March 2007
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Omron Semi to launch foundry services
News & Analysis  
3/30/2007   Post a comment
Japan's Omron Corp. Friday (March 30) completed its acquisition of Seiko Epson's chip fab, Yasu Semiconductor Corp., which it plans to relaunch as a foundry for nonvolatile memory and logic.
Smart junction blocks ease the automotive wiring squeeze: Part 2 - Enablers and advantages
Design How-To  
3/30/2007   Post a comment
Clever connector design and intelligent MOSFETs, with a proper PCB layout and thermal design, come together for a smart, fuse-and-relay-free junction block.
Single-chip ZigBee platform enables 20-year battery life
Product News  
3/29/2007   Post a comment
Designed to support wireless applications, Freescale Semiconductor has developed a single-chip ZigBee PiP (Platform in Package) that enables up to 20-year battery life and features up to 2-Mbits/s TurboLink technology.
Configurable memory buffer exceeds DDR3-1600 rates
Product News  
3/29/2007   Post a comment
Inphi says its latest ExacTik precision timing device is the industry's first JEDEC compliant double data-rate (DDR3) configurable integrated register device.
Chip maker expands power amplifier line for EDGE handsets
Product News  
3/29/2007   Post a comment
RF Micro Devices' quad-band EDGE power amplifier (PA) module is designed to support merchant-market EDGE transceivers that implement large signal polar modulation (LSPM) transmit architectures.
Dual-band PA module targets entry-level handset sector
Product News  
3/29/2007   Post a comment
RF Micro Devices designed its latest PowerStar power amplifier for manufacturers of dual-band handsets for the growing entry level and replacement markets. The GSM/GPRS PA dual-band module features improved isolation, harmonic performance and cross-band, helping to reduce RF complexity and increase design flexibility related to antenna and switch selection.
Acer fires back at HP over patent dispute
News & Analysis  
3/29/2007   Post a comment
With sales booming, especially in the US, Acer Inc. finds itself the target of a patent infringement lawsuit from rival Hewlett-Packard. It isn't backing down.
Ethernet upgrades to be sole data center net
News & Analysis  
3/29/2007   Post a comment
Broadcom, IBM, Intel and others are in an early development stage with Converged Enhanced Ethernet (CEE), an interconnect that in addition to improved data networking could take on jobs handled by Fibre Channel and Infiniband, creating a single technology to link all systems in the data center.
Smart junction blocks ease the automotive wiring squeeze: Part 1 - The electronic distribution system problem and the MOSFET/IP solution
Design How-To  
3/28/2007   Post a comment
Applying technology and IP, junction block developers target both functionality and cost for a reliable design without any fuses or relays.
Qualcomm readies Ultra Mobile Broadband chipsets
Product News  
3/28/2007   Post a comment
Qualcomm plans to sample early next year a pair of modem chipsets that supports the forthcoming Ultra Mobile Broadband (UMB) standard.
ARC scores major licensing deals in Asia
Product News  
3/28/2007   Post a comment
ARC International has sealed licensing agreements with several Asia-based semiconductor companies who will use its configurable processor IP in SoCs targeted at applications such as multimedia devices VoIP phones, and flash memory devices.
RF Magic rolls DVB-C silicon tuner
Product News  
3/27/2007   Post a comment
Fabless RF system-on-chip vendor RF Magic Inc. has unveiled a single-chip silicon tuner developed specifically for applications compliant with the digital video broadcasting over cable (DVB-C) standard in use in Europe, Asia, Australia and South Africa.
Touch-sensing ICs target medical touch-panel applications
Product News  
3/26/2007   Post a comment
Omron Electronic Components developed the B6TS application-ready touch-sensing IC family which measures floating capacitance through most touch-panel materials. They are suitable for use in medical products that need to withstand disinfectant cleaning, impervious to liquids and operated by personnel wearing surgical gloves.
3.125-Gbits/s LVDS buffers reduce jitter
Product News  
3/26/2007   Post a comment
National added three signal-conditioning buffers to its LVDS product portfolio that offer transmit pre-emphasis and receive equalization for jitter performance up to 3.125-Gbits/s, while using less power than previous-generation devices.
BenQ rejects $634M claim from bankrupt mobile unit
News & Analysis  
3/26/2007   Post a comment
Taiwan consumer electronics maker BenQ Corp. has rejected claims that it owes $634 million to creditors of its bankrupt German mobile phone unit.
SMIC scouting private equity infusion, report says
News & Analysis  
3/26/2007   Post a comment
Rumors swirl that Chinese foundry Semiconductor Manufacturing International Corp. is trying to stir interest in the private equity community for a 20 percent stake in its struggling business.
Intel confirms $2.5 billion fab in China
News & Analysis  
3/26/2007   Post a comment
Intel Corp. confirmed Monday that it will build a 300mm wafer fab in the northern Chinese city of Dalian.
WLAN chip packaged in small form-factor TFBGA
Product News  
3/23/2007   Post a comment
Aimed at handheld applications such as feature phones and smartphones, handheld game consoles and PDAs, NXP Semiconductor housed its latest WLAN chip in an 81-pin TFBGA.
NXP advances TV-on-mobile functions in handsets
Product News  
3/23/2007   Post a comment
NXP Semiconductors introduced the NXP TV-on-mobile HotPlug system product that combines everything an OEM needs to implement TVoM functions in advanced mobile systems, including hardware, DVB-H and DVB-T software stacks and security.
GaN transistors boost WiMAX power amplification by 50%
Product News  
3/23/2007   Post a comment
Cree Inc. is shipping sample quantities of three gallium nitride (GaN) high electron mobility transistors that provide linear power and efficiency for WiMAX and broadband wireless access applications operating between 2.3 GHz and 3.9 GHz.
Updated: Court rules on Qualcomm standards behavior
News & Analysis  
3/22/2007   Post a comment
A federal district court has adopted a unanimous jury finding that Qualcomm violated its duty to disclose patents to an industry standards body and thereby waived its rights to enforce two patents the company alleged covered the H.264 video compression standard, according to a statement released by rival Broadcom.
Applied Materials opening China R&D center
News & Analysis  
3/22/2007   Post a comment
Applied Materials Inc. is planning to invest $83 million to ramp up its first product development center in China, which opens Friday.
For low-power design, speak two languages
News & Analysis  
3/22/2007   Post a comment
It's looking like the impasse between camps supporting Common Power Format and Unified Power Format means that chip designers will need to familiarize themselves with both or hope that translators can make the task easier.
Developing an automotive electrical distribution system: Part 2 - Simulation and analysis ease design flow, cut warranty costs
Design How-To  
3/21/2007   Post a comment
Simulation and analysis techniques can be applied to an electrical distribution design flow to make it more efficient and less costly. Critical elements of such methods include early system simulation, interpretive analysis, FMEA, and component sizing.
Intel leads $40M investment in Legend Silicon
News & Analysis  
3/21/2007   Post a comment
The venture capital arm of Intel led a Series D private equity investment of up to $40 million in digital broadcasting and broadband transmission IC vendor Legend Silicon.
24-port RAID 6 controller delivers 700-Mbytes/s throughput speed
Product News  
3/21/2007   Post a comment
AMCC completed the roll out of its RAID 6 controller line with the 3ware 9650SE-24M8, a 24-port device that delivers throughput speeds of more than 700Mbytes/s.
White LEDs warm up for indoor lighting
Product News  
3/21/2007   1 comment
Cree Inc. has increased the brightness and efficiency of its XLamp XR-E and XLamp XR-C white light-emitting diodes by more than 20 percent, enough to making them suitable for indoor "warm white" lighting applications.
Sensor interface chip offers six user-configurable I/O channels
Product News  
3/21/2007   Post a comment
Aimed at fusion-sensing applications, Sensor Platforms Inc.'s SSP1401 multi-channel LRC sensor interface chip has six user-configurable I/O channels that can drive most types of sensor elements, including resistive, capacitive, inductive and piezo-resistive.
Keynoters sketch out future of handsets
News & Analysis  
3/20/2007   Post a comment
Cellphones will become broadband devices with built-in TV projectors while Wi-Fi handsets could someday become an alternative for cellular, according to investor Vinod Khosla and Skype CEO Niklas Zennstrom who gave back-to-back talks at the VON conference.
iSuppli: Video surveillance growth to shift IC revenue
News & Analysis  
3/20/2007   Post a comment
Robust short-term growth projections for the video surveillance camera represents the biggest revenue growth opportunity for chip suppliers and will propel a major shift in semiconductor revenue, according to market research firm iSuppli.
BroadLight rolls quad GPON OLT controller
Product News  
3/20/2007   Post a comment
BroadLight launched what it claims is the industry's first quad GPON OLT controller that provides a high level of integration for packet and TDM transport over ITU-T G.984 GPON and dramatically reduces power, space and costs for multi-port OLTs.
PCIe interconnect chips manage communications in bladed systems
Product News  
3/20/2007   Post a comment
Check out IDT's latest additions to its PCIe switch line, one of which is the industry's largest monolithic PCIe switch with 16 ports and 64 lanes. The devices manage all communications throughout high-density bladed systems while providing full-line rate throughput.
China firm wants in on One Laptop Per Child
News & Analysis  
3/20/2007   Post a comment
A Chinese company is hoping to leverage its position as a domestic firm to muscle in on the One Laptop Per Child project.
China trip by Intel CEO fuels fab rumors
News & Analysis  
3/20/2007   Post a comment
Intel Corp. is renting out the Great Hall of the People in Beijing next week, stirring more speculation about a plan to build a fab in the northern part of the country.
Teardown that Prius!
Automotive DesignLine Blog  
3/19/2007   Post a comment
Check out this video to see what it's like to take apart a hybrid vehicle--in about one minute.
Multimedia processor lowers cost of video-enabled portable devices
Product News  
3/19/2007   Post a comment
Building on its Mobile-Media architecture, CEVA has unveiled its Mobile-Media-Lite family with the launch of the MM2200, an integrated, single processor that handles all multimedia-related processing, as well as application and system tasks for lower cost video-enabled portable multimedia devices.
Logic devices expand system resources in mobile platforms
Product News  
3/19/2007   Post a comment
STMicroelectronics has introduced the Xpander Logic family to help customers overcome the limited number of I/O ports in microcontroller and microprocessor-based embedded systems.
Qualcomm, Broadcom settle two of five lawsuits
News & Analysis  
3/16/2007   Post a comment
Qualcomm and Broadcom continued efforts to settle at least some of the multiple patent infringement and trade-secret misappropriation claims the two have traded for the last three years. The two companies have agreed to dismiss, without prejudice, all patent claims and counter-claims pending in U.S. District Court in San Diego and to dismiss with prejudice trade-secret claims in the same court.
Half-duplex RS-485 transceivers eliminate isolated control channel
Product News  
3/16/2007   Post a comment
The MAX13487E/MAX13488E are the first RS-485 transceivers to employ Maxim Integrated Products' proprietary AutoDirection technology, which eliminates an isolated control channel to simplify designs and reduce discrete component count in isolated metering, automotive and industrial applications.
BenQ chairman defends executive detained in raid
News & Analysis  
3/16/2007   Post a comment
BenQ Chairman KY Lee rushes to defend a senior executive detained in a police raid targeting insider trading and bonus irregularities.
UMC setting up support in Hyderabad
News & Analysis  
3/16/2007   Post a comment
Foundry United Microelectronics Corp is the latest to move a support office to India, following a similar move by Taiwan Semiconductor Manufacturing Co. last month.
Luxtera integrates photodetectors on SOI
News & Analysis  
3/15/2007   Post a comment
Luxtera uses Freescale SOI process with special germanium layer for integrating photodetectors into monolithic receivers.
Broadcom names CFO
News & Analysis  
3/15/2007   Post a comment
Fabless chip vendor Broadcom said that Eric Brandt would join the company later this month as senior vice president and chief financial officer.
BenQ offices raided by police
News & Analysis  
3/15/2007   Post a comment
Police raid the offices of Taiwan's BenQ, looking for clues of irregularities in bonus payments and possible insider trading.
Consumer and automotive electronics converge: Part 2 - A MOST implementation
Design How-To  
3/14/2007   Post a comment
To seamlessly move large amounts of audio, video, and control information to, from, and between electronic devices and automotive systems, a car needs to have a flexible and powerful communications backbone.
TI houses PCIe devices in 12x12mm packaging
Product News  
3/14/2007   Post a comment
TI announced a new package size for the XIO2000A, its PCI Express (PCIe) to PCI Bus translation bridge device targeting PCIe Mini Cards and ExpressCards for the mobile computing market where board space is a premium.
NXP ups WiMAX data rate with 2x2 MIMO transceiver
Product News  
3/14/2007   Post a comment
NXP Semiconductors has started sampling a range of extended data rate transceivers for mobile WiMAX applications. Volume production of the devices is scheduled to start in the second quarter of the year.
OKI samples 10-Gbits/s optical receiver module
Product News  
3/14/2007   Post a comment
Oki Electric is sampling a pair of ROSA (Receiver Optical Sub Assembly) optical receiver modules.
Samsung samples 8-Gbyte moviNAND Flash to mobile OEMs
Product News  
3/14/2007   Post a comment
Samsung is sampling to major mobile manufacturers its moviNAND embedded-Flash solution with 8-Gbytes of storage, which it says is the highest density embedded Flash memory to date. It can store up to 2,000 songs or enough map data to implement global positioning system (GPS) and points of interest for the entire western world.
Analyst upgrades Broadcom to 'strong buy'
Product News  
3/13/2007   Post a comment
Craig Berger, an analyst for Wedbush Morgan Securities, upgraded his firm's rating on Broadcom's stock to "strong buy" Tuesday, citing multiple factors including suspicion that Broadcom has secured more design wins at Nokia than previously anticipated, which could boost second half 2007 revenue.
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