Vitesse, Vixel to develop ICs for Fiber Channel loop switch systems News & Analysis 4/18/2001 Post a comment CAMARILLO, Calif. -- Vitesse Semiconductor Corp. and Vixel Corp. today announced plans to jointly develop and market semiconductors for Fibre Channel-based loop switch applications in standalone and embedded systems. These embedded systems include disk arrays and redundant array of independent disks (RAID) subsystems.
Altera's net income slides 39% from fourth quarter News & Analysis 4/18/2001 Post a comment Altera Corp. announced first quarter earnings per diluted share of $0.16, which meets First Call consensus estimates, and compares to 25 cents per share pro forma results in the fourth quarter and 18 cents per share in the first quarter of 2000.
AMCC uses Cisco protocol in devices for Resilient Packet Ring networks News & Analysis 4/17/2001 Post a comment SAN DIEGO--Applied Micro Circuits Corp. today announced it has developed its first high-speed networking devices using the Spatial Reuse Protocol (SRP) from Cisco Systems Inc. as part of a new technology roadmap for OC-48 and OC-192 Resilient Packet Ring (RPR) systems. AMCC and Cisco are teamed up in development of products in the roadmap.
Music's CAM-based IC speeds priority scheduling in networks News & Analysis 4/16/2001 Post a comment MILPITAS, Calif. -- Music Semiconductors Inc. today rolled out a new device that combines the company's content addressable memory (CAM) technology with an embedded microsequencer to quickly mange packet prioritization and other network features in routers and switch equipment.
Cypress targets new optical networking ICs after buying HiBand News & Analysis 4/13/2001 Post a comment SAN JOSE --Cypress Semiconductor Corp. here said it plans to build next-generation optical communications ICs on technology from HiBand Semiconductor Inc., after completing the purchase of the three-year-old Scotts Valley, Calif.-based startup. Cypress today announced completion of the acquisition, which was announced two months ago to expand company's portfolio in physical-layer ICs for networking applications (see Feb. 5 story<
Philips and STMicro expand use of ARM cores in system-on-chip designs News & Analysis 4/10/2001 Post a comment CAMBRIDGE, England --Microprocessor core supplier ARM Holdings PLC today (April 10) announced expansion of separate licensing agreements with European chip makers Philips Semiconductors and STMicroelectronics. Both companies are adding several ARM RISC cores and technologies to their portfolios for system-on-chip designs targeted at a broad range of applications.
MoSys, TSMC to develop double-density and low-power 1T-SRAMs for embedded use News & Analysis 4/9/2001 Post a comment SUNNYVALE, Calif. -- MoSys Inc. here today (April 9) announced a series of new licensing pacts for its 1T-SRAM technology, including a joint-development agreement with Taiwan Semiconductor Manufacturing Co. Ltd. to create new low-power and double-density derivatives of one-transistor memory cells for TSMC's 0.13-micron foundry processes.
LSI Logic to shift 30% of its production to foundries as part of TSMC alliance News & Analysis 4/5/2001 Post a comment MILPITAS, Calif. -- LSI Logic Corp. is the latest major chip manufacturer to begin shifting a significant portion of its wafer-processing volume to third-party foundries. The company plans to immediately increase its foundry use to 20% of its processed wafers in 2001, from about 6-to-8% in 2000, and eventually it plans to outsource slightly more than 30% of its silicon.
IDT and TI agree to source 3.3-V octal bus switch devices News & Analysis 4/2/2001 Post a comment SANTA CLARA, Calif. -- Integrated Device Technology Inc. and Texas Instruments Inc. today (April 2) announced an agreement to become alternate sources for octal bus switch devices made with 3.3-volt crossbar low-voltage technology. These devices are used in networking, telecommunications, and enterprise infrastructure systems.
Texas Instruments and IDT extend second-source agreement News & Analysis 4/2/2001 Post a comment Texas Instruments inc. and Integrated Device Technology, Inc. today announced an alternate source agreement on 3.3-volt crossbar low-voltage technology (CBTLV) bus switch devices for the networking, telecommunications and enterprise infrastructure
IDT moves into China, telecom segments with $80 million purchase of Newave News & Analysis 4/2/2001 Post a comment SHANGHAI, China -- In a bold move to immediately expand in China and voice-communications chip markets, Integrated Device Technology Inc. today (April 2) announced it will spend $80 million in cash to acquire four-year-old Newave Semiconductor Corp., a fabless startup with more than 70 engineers based in the company's Shanghai design subsidiary.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.