Year-old Bermai packs all functions for 5-GHz wireless LANs in one chip News & Analysis 4/29/2002 Post a comment LAS VEGAS -- In a move that's certain to raise the stakes in wireless local area networks, startup Bermai Inc. plans to formally launch its single-chip solution for 5-GHz wireless LANs at the NetWorld+Interop trade show here this week. The year-old fabless chip company is jumping into a crowded market, claiming to be the first to offer a single "radio chip" for the emerging 802.11a wireless LANs.
Fairchild rolls out MicroPak as next-generation logic package News & Analysis 4/29/2002 Post a comment SOUTH PORTLAND, Maine--Fairchild Semiconductor International Inc. today released 50 standard logic functions in its new MicroPak chip-scale package, which is 65% smaller than widely used SC70 packages, according to the company. Fairchild said the MicroPak is its next-generation package for a wide range of logic and switch functions.
Trident banks on 0.13-micron 3-D processor, chip set for rebound News & Analysis 4/25/2002 Post a comment SUNNYVALE, Calif. -- Trident Microsystems Inc. here reported a 4.4 sequential decrease in revenues to $28.8 million in the company's fiscal third quarter, ended March 31, compared to $30.2 million in the prior three-month period. The graphics chip supplier's sales were 16.6% higher than $24.7 million in the quarter last year.
austriamicrosystems offers SiGe chip set, ASIC library for passive optical networks News & Analysis 4/24/2002 Post a comment GRAZ, Austria ---Chip maker austriamicrosystems AG here today announced development of a new generation of design functions in an ASIC library for electro-optical interface ICs for passive optical networks (PON). In addition, the Graz-based company said it has created a new chip set, called Key Electro-Optical Elements (KEOPE), which will be fabricated in a high-speed, low-power silicon-germanium (SiGe) technology.
LSI launches 90-nm ASIC offering, expands foundry pact with TSMC News & Analysis 4/15/2002 Post a comment MILPITAS, Calif. -- In a move to enable next-generation chips with up to 1 billion transistors, LSI Logic Corp. here today announced its new ASIC and system-on-chip (SoC) product portfolio, based on 90-nm (0.09-micron) process technology. The company's "G90" product offering consists of process technology, IC building blocks, and design tools to enable development of 90-nm chip designs.
ATMOS and TSMC to qualify embedded DRAM for 90-nm process News & Analysis 4/9/2002 Post a comment OTTAWA -- ATMOS Corp. here and Taiwan Semiconductor Manufacturing Co. Ltd. today announced an agreement to develop, verify and qualify embedded DRAM memory technology for 90-nm (0.09-micron) process technology. The memory will be based on the ATMOS SoC-RAM cell design technology and will be offered to foundry customers using TSMC's Nexsys 90-nm process.
Philips claims smallest IC package with improved heat dissipation News & Analysis 4/8/2002 Post a comment EINDHOVEN, the Netherlands -- Royal Philips Electronics N.V. today announced development of the world's smallest IC package, called the depopulated very-thin quad flat-pack no-lead (DQFN) package. The DQFN is 75% smaller than the existing thin shrink small-outline package (TSSOP) and has a footprint of 2.5-by-3 mm in a 14-pin configuration, Philips said.
PC Synchronous Serial I/O Design How-To 4/8/2002 Post a comment Lorenzo Tazzari describes how to use an addressable serial-I/O chip in a simple circuit, driven by any LPT port, to remotely control a PC's I/O operations.
Is USB 2 Ready for You? Design How-To 4/8/2002 Post a comment A performance increase of 40x in any application is enough to turn heads-that's what USB 2.0's 480 Mbit/sec transfer rate promises. Using the same cables and connectors as the widely used USB 1.1 peripherals
and devices, Jon Gabay explains how USB 2.0 is poised to provide connectivity for the next generation of personal peripherals.
DSP Group, Parthus to merge IP licensing businesses in new company News & Analysis 4/5/2002 Post a comment DUBLIN, Ireland -- Parthus Technologies plc here and U.S.-based DSP Group Inc. today announced an agreement to combine their intellectual property (IP) licensing businesses to strengthen their positions in digital signal processing cores and designs for digital communications and multimedia devices. The new company will be called ParthusCeva Inc.
Agere maps out flexible strategy for faster 1394b connections, chips News & Analysis 4/4/2002 Post a comment ALLENTOWN, Pa. -- Agere Systems Inc. this week disclosed development of a new "bi-lingual" physical layer (PHY) circuit that's capable of supporting both 1394a and faster 1394b serial-link data transport speeds as part of a roadmap to fan out several different chip architectures for PC systems and consumer electronics.
UMC and Micronas collaborate on flat-panel video TV chip News & Analysis 4/2/2002 Post a comment HSINCHU, Taiwan -- United Microelectronics Corp. here and Germany's Micronas GmbH announced collaboration in the production of a new low-cost flat-panel video controller IC, using UMC's 0.18-micron mixed-signal CMOS process technology. The device, designed by Micronas, is aimed at simplifying and lowering the cost of video and TV in systems using liquid-crystal displays (LCDs) or plasma displays instead of picture tubes.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.