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Content tagged with Logic/Interface
posted in April 2002
TI, IDT, Hitachi collaborate on small QFN packages for logic devices
News & Analysis  
4/30/2002   Post a comment
DALLAS -- The big battle over tiny packages for advanced standard logic devices is expanding. Standard logic allies Texas Instruments Inc., Integrated Devices Inc., and Hitachi Ltd. today introduced quad flat no-lead (QFN) packages with 14, 16 and 20 contacts for gate and octal-bit width devices.
Year-old Bermai packs all functions for 5-GHz wireless LANs in one chip
News & Analysis  
4/29/2002   Post a comment
LAS VEGAS -- In a move that's certain to raise the stakes in wireless local area networks, startup Bermai Inc. plans to formally launch its single-chip solution for 5-GHz wireless LANs at the NetWorld+Interop trade show here this week. The year-old fabless chip company is jumping into a crowded market, claiming to be the first to offer a single "radio chip" for the emerging 802.11a wireless LANs.
Microsoft takes Nvidia to arbitration over pricing of Xbox processors
News & Analysis  
4/29/2002   Post a comment
SANTA CLARA, Calif. -- Nvidia Corp. today said a dispute between itself and Microsoft Corp. over pricing of processor chip sets used in Xbox video game consoles has been taken to binding arbitration.
MIPS Technologies aims new 32-bit core at multi-CPU chip designs
News & Analysis  
4/29/2002   Post a comment
SAN JOSE--At the Embedded Processor Forum here today, MIPS Technologies Inc. today announced a new 32-bit synthesizable RISC core, designed to optimize system-on-chip (SoC) designs implemented with multiple central processing units on chip.
Fairchild rolls out MicroPak as next-generation logic package
News & Analysis  
4/29/2002   Post a comment
SOUTH PORTLAND, Maine--Fairchild Semiconductor International Inc. today released 50 standard logic functions in its new MicroPak chip-scale package, which is 65% smaller than widely used SC70 packages, according to the company. Fairchild said the MicroPak is its next-generation package for a wide range of logic and switch functions.
Trident banks on 0.13-micron 3-D processor, chip set for rebound
News & Analysis  
4/25/2002   Post a comment
SUNNYVALE, Calif. -- Trident Microsystems Inc. here reported a 4.4 sequential decrease in revenues to $28.8 million in the company's fiscal third quarter, ended March 31, compared to $30.2 million in the prior three-month period. The graphics chip supplier's sales were 16.6% higher than $24.7 million in the quarter last year.
IPWireless, Flextronics develop 3.5 million-gate IC for 3G broadband modem
News & Analysis  
4/24/2002   Post a comment
SAN BRUNO, Calif. -- IPWireless Inc. here has teamed with Flextronics Semiconductor Inc. to develop a new 0.13-micron system-on-chip IC with up to 3.5 million gates to reduce the size of high-speed wireless broadband modems to a PC card format for communicates over 3G cellular networks.
austriamicrosystems offers SiGe chip set, ASIC library for passive optical networks
News & Analysis  
4/24/2002   Post a comment
GRAZ, Austria ---Chip maker austriamicrosystems AG here today announced development of a new generation of design functions in an ASIC library for electro-optical interface ICs for passive optical networks (PON). In addition, the Graz-based company said it has created a new chip set, called Key Electro-Optical Elements (KEOPE), which will be fabricated in a high-speed, low-power silicon-germanium (SiGe) technology.
Philips licenses MoSys 1T-SRAM with error correction for 0.13-micron designs
News & Analysis  
4/18/2002   Post a comment
SUNNYVALE, Calif.-- MoSys Inc. today announced it has licensed its one-transistor SRAM cell technology, called T1-SRAM, to Philips Semiconductors, which plans to use the embedded memory in cellular infrastructure ASICs and system-on-chip (SoC) designs.
Voice-over-Internet chip sales to reach $1.4 billion by 2006, says report
News & Analysis  
4/17/2002   Post a comment
TEMPE, Ariz. -- The packet voice equipment market has almost completed the changeover from frame relay-based technology to voice-over-Internet protocol (VoIP), with channel/port shipments expected to grow at a 116% compound annual rate between 2001 and 2006, according to a new report from Forward Concepts here.
Siemens to use Motorola's 3G chips, platform under new partnership
News & Analysis  
4/15/2002   Post a comment
MUNICH -- Motorola Inc. today announced a major win in its campaign to sell cell-phone chip sets and platforms to competing handset makers under a new agreement to collaborate with Siemens AG in mainstream Universal Mobile Telecommunications System (UMTS) terminals.
LSI launches 90-nm ASIC offering, expands foundry pact with TSMC
News & Analysis  
4/15/2002   Post a comment
MILPITAS, Calif. -- In a move to enable next-generation chips with up to 1 billion transistors, LSI Logic Corp. here today announced its new ASIC and system-on-chip (SoC) product portfolio, based on 90-nm (0.09-micron) process technology. The company's "G90" product offering consists of process technology, IC building blocks, and design tools to enable development of 90-nm chip designs.
Matsushita licenses MoSys one-transistor SRAM for communications ICs
News & Analysis  
4/12/2002   Post a comment
SUNNYVALE, Calif.--MoSys Inc. today announced it has licensed its one-transistor SRAM sell technology to Matsushita Communication Industrial Co. Ltd. in Japan for embedded design use in ICs for communications applications. Terms of the licensing agreement were not released.
ATMOS and TSMC to qualify embedded DRAM for 90-nm process
News & Analysis  
4/9/2002   Post a comment
OTTAWA -- ATMOS Corp. here and Taiwan Semiconductor Manufacturing Co. Ltd. today announced an agreement to develop, verify and qualify embedded DRAM memory technology for 90-nm (0.09-micron) process technology. The memory will be based on the ATMOS SoC-RAM cell design technology and will be offered to foundry customers using TSMC's Nexsys 90-nm process.
Philips claims smallest IC package with improved heat dissipation
News & Analysis  
4/8/2002   Post a comment
EINDHOVEN, the Netherlands -- Royal Philips Electronics N.V. today announced development of the world's smallest IC package, called the depopulated very-thin quad flat-pack no-lead (DQFN) package. The DQFN is 75% smaller than the existing thin shrink small-outline package (TSSOP) and has a footprint of 2.5-by-3 mm in a 14-pin configuration, Philips said.
PC Synchronous Serial I/O
Design How-To  
4/8/2002   Post a comment
Lorenzo Tazzari describes how to use an addressable serial-I/O chip in a simple circuit, driven by any LPT port, to remotely control a PC's I/O operations.
Is USB 2 Ready for You?
Design How-To  
4/8/2002   Post a comment
A performance increase of 40x in any application is enough to turn heads-that's what USB 2.0's 480 Mbit/sec transfer rate promises. Using the same cables and connectors as the widely used USB 1.1 peripherals and devices, Jon Gabay explains how USB 2.0 is poised to provide connectivity for the next generation of personal peripherals.
DSP Group, Parthus to merge IP licensing businesses in new company
News & Analysis  
4/5/2002   Post a comment
DUBLIN, Ireland -- Parthus Technologies plc here and U.S.-based DSP Group Inc. today announced an agreement to combine their intellectual property (IP) licensing businesses to strengthen their positions in digital signal processing cores and designs for digital communications and multimedia devices. The new company will be called ParthusCeva Inc.
TI targets two-week delivery of logic in move to speed shipment cycles
News & Analysis  
4/4/2002   Post a comment
DALLAS -- Texas Instruments Inc. today announced a new strategy to cut delivery times on high-volume standard logic devices from what TI said is an industry practice of eight-week turnaround cycles to two weeks.
Agere maps out flexible strategy for faster 1394b connections, chips
News & Analysis  
4/4/2002   Post a comment
ALLENTOWN, Pa. -- Agere Systems Inc. this week disclosed development of a new "bi-lingual" physical layer (PHY) circuit that's capable of supporting both 1394a and faster 1394b serial-link data transport speeds as part of a roadmap to fan out several different chip architectures for PC systems and consumer electronics.
STMicro and 8x8 to address videophones, Internet telephony chip applications
News & Analysis  
4/3/2002   Post a comment
SANTA CLARA, Calif. -- Europe's STMicroelectronics and 8x8 Inc. here today announced a partnership to develop Internet protocol (IP) based video chip solutions. Under an agreement, 8x8 has licensed very long instruction word (VLIW) processor cores from STMicroelectronics to develop new IP-based telephony chip products.
UMC and Micronas collaborate on flat-panel video TV chip
News & Analysis  
4/2/2002   Post a comment
HSINCHU, Taiwan -- United Microelectronics Corp. here and Germany's Micronas GmbH announced collaboration in the production of a new low-cost flat-panel video controller IC, using UMC's 0.18-micron mixed-signal CMOS process technology. The device, designed by Micronas, is aimed at simplifying and lowering the cost of video and TV in systems using liquid-crystal displays (LCDs) or plasma displays instead of picture tubes.
New Software and Hardware Boost System, People Connectivity
Product News  
4/2/2002   Post a comment
Jim Lipman, TechOnLine's Content Director, outlines several recently announced software and hardware products that support existing and evolving connectivity and communication standards. Parts Search

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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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