3-D IC stacks pushed back to 2015 News & Analysis 4/2/2013 6 comments Globalfoundries reports on a functioning 3-D wafer-level stack with through silicon vias as the industry pushes out plans for such products to 2015 or later.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.