3-D IC stacks pushed back to 2015 News & Analysis 4/2/2013 6 comments Globalfoundries reports on a functioning 3-D wafer-level stack with through silicon vias as the industry pushes out plans for such products to 2015 or later.
NASA's Orion Flight Software Production Systems Manager Darrel G. Raines joins Planet Analog Editor Steve Taranovich and Embedded.com Editor Max Maxfield to talk about embedded flight software used in Orion Spacecraft, part of NASA's Mars mission. Live radio show and live chat. Get your questions ready.
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