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Content tagged with Logic/Interface
posted in May 2001
Cirrus to integrate Silicon Wave's Bluetooth technology in processors
News & Analysis  
5/30/2001   Post a comment
SAN DIEGO--Silicon Wave Inc. here announced it has licensed Bluetooth wireless connectivity technology to Cirrus Logic Inc., which plans to integrate the function into its Maverick microprocessors for consumer products, such as Internet audio players, personal digital assistants (PDAs) and electronic books.
Broadband Wireless Access
Design How-To  
5/29/2001   Post a comment
Benny Bing discusses the design and development of broadband wireless access systems with emphasis on how such systems can efficiently support disparate classes of multimedia traffic.
ADI rolls WAN-independent comms processors
News & Analysis  
5/22/2001   Post a comment
Analog Devices Inc. has let loose its AD6x89 family of WAN-independent communications processors featuring scalable security and the company's proprietary Fast Path quality-of-service (QoS) technology, combining flow switching and bandwidth management.
Mitel taps IBM to produce PowerPC-based digital TV chips
News & Analysis  
5/22/2001   Post a comment
LONDON -- IBM Corp. and Mitel Corp. today announced a partnership aimed at producing new PowerPC-based ICs with MPEG-2 video processing capabilities for digital TV and digital broadcasting services.
Intel targets non-traditional areas with new Fast Ethernet devices
News & Analysis  
5/22/2001   Post a comment
SANTA CLARA, Calif. -- In a move to expand its communications chip business, Intel Corp. here today announced a trio of devices designed for some new and non-traditional applications in Fast Ethernet networks.
Actel, LogicVision develop embedded test for programmable gate array cores
News & Analysis  
5/21/2001   Post a comment
SUNNYVALE, Calif. -- Programmable logic supplier Actel Corp. today announced a partnership with LogicVision Inc. to embed reusable test intellectual property in system-on-chip (SoC) designs.
Agilent to buy Belgium's Sirius to offer new CDMA chip solutions
News & Analysis  
5/21/2001   Post a comment
PALO ALTO, Calif.--Agilent Technologies Inc. today announced it will acquire four-year-old Sirius Communications NV, a Brussels-based developer of ASICs for Code Division Multiple Access (CDMA) cell phones and satellite communications systems.
Atmel, TriQuint team up in CDMA RF chips with SiGe, GaAs processes
News & Analysis  
5/21/2001   Post a comment
HEILBRONN, Germany--Atmel Corp.'s RF-chip operation here and TriQuint Semiconductor Inc. in Hillsboro, Ore., today announced collaboration in development, production, and marketing of new ICs for Code Division Multiple Access (CDMA) handsets.
Intel aims network processors, design tools at speeding product launches
News & Analysis  
5/17/2001   Post a comment
AMSTERDAM -- At the European version of the Intel Developers Forum (IDF) here today, Intel Corp. announced its latest network-processor line and related products that promise to accelerate the design cycles for system manufacturers.
Agere, RF Micro Devices strike SiGe R&D, manufacturing alliance
News & Analysis  
5/17/2001   Post a comment
ALLENTOWN, Pa. -- Agere Systems Inc. and RF Micro Devices Inc. today announced plans to jointly develop and manufacture high-performance ICs for next-generation digital cellular phones and other communications products. The development work will focus on the use of silicon-germanium (SiGe) in radio-frequency (RF) chips, but the two companies said they will also leverage other silicon processes from Agere--formerly Lucent Microelectronics.
AMD's HyperTransport bus gains support from Teradyne testers, Dolphin IC interface
News & Analysis  
5/16/2001   Post a comment
SUNNYVALE, Calif.--Advanced Micro Devices Inc. today said chip testers from Teradyne Inc. and physical interface (PHY) design cores from Dolphin Technology Inc. will be available to support AMD's next-generation I/O data bus, called HyperTransport.
Korea's Hynix to support 3DSP customers with foundry capacity
News & Analysis  
5/15/2001   Post a comment
IRVINE, Calif.--A system-on-chip development and foundry support alliance has been struck between 3DSP Corp. here and South Korea's Hynix Semiconductor Inc. (formerly Hyundai Electronics Industries).
Ireland's Parthus buys Chicory to expand Internet accelerator offering
News & Analysis  
5/15/2001   Post a comment
DUBLIN, Ireland -- Parthus Technologies plc here today announced an agreement to acquire privately-held Chicory Systems Inc., an Austin, Tex.-based supplier of semiconductor technology for mobile Internet applications.
TI to seek FCC certification of 22-Mbit/sec. wireless LAN technology
News & Analysis  
5/14/2001   Post a comment
DALLAS -- Texas Instruments Inc. today announced plans to move quickly to gain U.S. certification of its 22-megabit-per-second wireless local area network technology following last week's decision by the Federal Communications Commission (FCC) to grant interim waivers for new digital devices operating in the 2.4-GHz band.
Intersil, Symbol fight Proxim's patent claims in wireless LANs
News & Analysis  
5/14/2001   Post a comment
IRVINE, Calif. -- Intersil Corp. and Symbol Technologies Inc. today announced they are joining forces to fight Proxim Inc., which has sued both companies as part of an effort to enforce patented technology for 2.4-GHz wireless local area networks.
Conexant's Mindspeed unit, Infineon cooperate in testing of SHDSL chips
News & Analysis  
5/8/2001   Post a comment
NEWPORT BEACH, Calif.--A milestone in interoperability of chip products based on the symmetric high-bit-data-rate digital subscriber line (SHDSL) standard has been reported by Conexant Systems Inc.'s Mindspeed Technologies subsidiary here and Infineon Technologies AG of Munich.
Cypress announces first programmable Sonet OC-48 PHY interface chip
News & Analysis  
5/7/2001   Post a comment
SAN JOSE --Cypress Semiconductor Corp. here today claimed to be the first to offer a programmable chip solution for physical layer (PHY) interface to synchronous digital hierarchy/synchronous optical networks (SDH/Sonet) operating at 2.5-gigabit-per-second OC-48 rates.
LSI Logic says new flip-chip package increases I/O by 65%
News & Analysis  
5/7/2001   Post a comment
MILPITAS, Calif. -- LSI Logic Corp. here today unveiled its third-generation of organic flip-chip packages, called flxI/O, which uses an area array approach for signal I/O placement to optimize die size and increase the number of input/output contacts, according to the company.
Switch fabrics, coprocessors invade network world
News & Analysis  
5/7/2001   Post a comment
If last spring's Networld+Interop trade show was a coming-out party for a second wave of network processors, this year's model will do the same for the devices that surround them, including switch fabrics and coprocessors.
Infineon pursues multi-tenant broadband segment with VDSL chip series
News & Analysis  
5/7/2001   Post a comment
SAN JOSE -- Infineon Technologies Inc. today entered an emerging broadband market with the launch of a new product line aimed at delivering higher-speed bandwidth to apartment buildings, hotels, and offices over existing telephone lines.
Eight million gate comms chip pushes design limits
News & Analysis  
5/4/2001   Post a comment
Agere Systems has put together a single-chip comms engine for add-drop multiplexers that pulls together eight million gates. But while designing the chip, the company found that the verification tools needed to check its work almost ran out of steam.
LSI Logic reports validation of Ultra320 SCSI capabilities in controller
News & Analysis  
5/3/2001   Post a comment
MILPITAS, Calif. -- LSI Logic Corp. today claimed it is the first to validate Ultra320 SCSI interoperability and packetized protocol capability for next-generation SCSI interfaces in disk drives. The validation was performed on LSI Logic's Ultra SCSI controller using the SPI-4 SCSI Parallel Interface version 4.0.
TI says ICs, patented technology boost upstream cable bandwidth by 50%
News & Analysis  
5/3/2001   Post a comment
HOUSTON -- Targeting next-generation digital cable services, Texas Instruments Inc. here today announced a new chip offering based on advanced Time Division Multiple Access (TDMA) technology, which TI said enables a 50% increase in upstream capacity in networks.
Mitsubishi packs TV video processor, MCU on single chip for American market
News & Analysis  
5/1/2001   Post a comment
SUNNYVALE, Calif.--Mitsubishi Electric Corp.'s U.S. subsidiary here today claimed that the company has developed the first IC to integrate a color TV image signal processor and 8-bit microcontroller for North American television sets.
Virtual Silicon, Hynix to develop nonvolatile memory for SoC logic processes
News & Analysis  
5/1/2001   Post a comment
SUNNYVALE, Calif.--South Korea's Hynix Semiconductor Inc.--formerly called Hyundai Electronics Industries--today announced a joint-development partnership with Virtual Silicon Technology Inc. here to create advanced nonvolatile memory for embedded use in system-on-chip designs.
M-LVDS: A New Standard for High-Speed Multipoint Data Buses
News & Analysis  
5/1/2001   Post a comment
A new standard, M-LVDS, is emerging to solve multiple-driver, multiple-receiver, half-duplex design problems. Texas Instruments' Jim Dietz discusses the unique considerations associated with multipoint topologies, describes M-LVDS, and compares the evolving standard with existing multipoint and single-ended solutions.


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latest comment mhrackin Where's the "empty bin" link?
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