Cirrus to integrate Silicon Wave's Bluetooth technology in processors News & Analysis 5/30/2001 Post a comment SAN DIEGO--Silicon Wave Inc. here announced it has licensed Bluetooth wireless connectivity technology to Cirrus Logic Inc., which plans to integrate the function into its Maverick microprocessors for consumer products, such as Internet audio players, personal digital assistants (PDAs) and electronic books.
Broadband Wireless Access Design How-To 5/29/2001 Post a comment Benny Bing discusses the design and development of broadband wireless access systems with emphasis on how such systems can efficiently support disparate classes of multimedia traffic.
ADI rolls WAN-independent comms processors News & Analysis 5/22/2001 Post a comment Analog Devices Inc. has let loose its AD6x89 family of WAN-independent communications processors featuring scalable security and the company's proprietary Fast Path quality-of-service (QoS) technology, combining flow switching and bandwidth management.
Agere, RF Micro Devices strike SiGe R&D, manufacturing alliance News & Analysis 5/17/2001 Post a comment ALLENTOWN, Pa. -- Agere Systems Inc. and RF Micro Devices Inc. today announced plans to jointly develop and manufacture high-performance ICs for next-generation digital cellular phones and other communications products. The development work will focus on the use of silicon-germanium (SiGe) in radio-frequency (RF) chips, but the two companies said they will also leverage other silicon processes from Agere--formerly Lucent Microelectronics.
TI to seek FCC certification of 22-Mbit/sec. wireless LAN technology News & Analysis 5/14/2001 Post a comment DALLAS -- Texas Instruments Inc. today announced plans to move quickly to gain U.S. certification of its 22-megabit-per-second wireless local area network technology following last week's decision by the Federal Communications Commission (FCC) to grant interim waivers for new digital devices operating in the 2.4-GHz band.
LSI Logic says new flip-chip package increases I/O by 65% News & Analysis 5/7/2001 Post a comment MILPITAS, Calif. -- LSI Logic Corp. here today unveiled its third-generation of organic flip-chip packages, called flxI/O, which uses an area array approach for signal I/O placement to optimize die size and increase the number of input/output contacts, according to the company.
Eight million gate comms chip pushes design limits News & Analysis 5/4/2001 Post a comment Agere Systems has put together a single-chip comms engine for add-drop multiplexers that pulls together eight million gates. But while designing the chip, the company found that the verification tools needed to check its work almost ran out of steam.
M-LVDS: A New Standard for High-Speed Multipoint Data Buses News & Analysis 5/1/2001 Post a comment A new standard, M-LVDS, is emerging to solve multiple-driver, multiple-receiver, half-duplex design problems. Texas Instruments' Jim Dietz discusses the unique considerations associated with multipoint topologies, describes M-LVDS, and compares the evolving standard with existing multipoint and single-ended solutions.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.