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Content tagged with Logic/Interface
posted in May 2007
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Standard aims to expand use of flash in PCs
News & Analysis  
5/31/2007   Post a comment
Dell, Intel and Microsoft agreed to work on a standard for NAND flash memory controllers that the trio expects will expand the use of flash memory in notebooks and desktops.
China chip market entering cooling phase
News & Analysis  
5/31/2007   Post a comment
After a hot 2004, China's chip market may be settling into a more sustainable growth phase. Growth is expected to hit a cyclical peak this year, expanding 20 percent to $51.7 billion.
Lenovo unveils laptops supporting WAPI
News & Analysis  
5/31/2007   Post a comment
Lenovo releases laptops that support China's domestic wireless-LAN standard.
New high-speed memory card format ready for mass market
Product News  
5/31/2007   Post a comment
After three years of work, Taiwan says its new high-speed memory card format is ready to roll. It promises the 60Mbyte per second transfer speeds of USB 2.0.
Samsung joins in $20m Series E round at SiGe Semi
News & Analysis  
5/30/2007   Post a comment
Samsung's ventures unit has joined in a $20 million Series E round of financing at RF chip specialist SiGe Semiconductor Inc. (Ottawa, Canada).
REVIEW: PMBus point-of-load DC-to-DC chip has 500-mV to 8-V output ranges
Product News  
5/30/2007   Post a comment
Here's a nifty power conversion and power management IC for synchronous DC-to-DC converter designs. The chip is configured to regulate two independent outputs, or two phases in a single output mode, and supports two types of current-sense topologies. Output range spans 500-mV to 8-V. eeProductCenter Senior Tech Editor Alex Mendelsohn reports.
RF packaged multi-function circuits ease manufacturing
Product News  
5/30/2007   Post a comment
Check out TriQuint's first three packaged devices in its Multi-Function Circuit (MFC) family that it says offer manufacturing ease and cost advantages. The devices address OEM needs for frequency upconversion (amplification) in the transmit and local oscillator chains for digital radio and satellite communications systems.
Connectorized hermetic I/Q mixers cover 6-GHz to 23-GHz
Product News  
5/30/2007   Post a comment
Check out Hittite's latest connectorized passive GaAs MMIC I/Q mixer modules for telecommunications, military, space and test equipment applications. They provide a high level of image rejection, wide IF bandwidth, and high isolation.
Realtek samples single-chip CMOS ultra-wideband product
Product News  
5/30/2007   Post a comment
Realtek is sampling a single-chip CMOS ultra-wideband product that supports Certified Wireless USB device controller and WiMedia Logical Link Control Protocol functions and features a dual-band ultra-wideband radio.
TSMC partners with R&D foundry SVTC
News & Analysis  
5/30/2007   Post a comment
Looking to smooth the way for cutting edge products, TSMC is linking up with R&D foundry SVTC so that companies can quickly move from concept to commercial runs.
Digital cable TV heats up in China, but challenges loom
News & Analysis  
5/29/2007   Post a comment
China's digital cable TV market hit 14 million subscribers in the first quarter, abd is expected to double this year. But issues over unpaid royalties continue to hang over local set-top box vendors.
Chip combines Bluetooth 2.1, EDR technology, Class 1 transceiver
Product News  
5/24/2007   Post a comment
Broadcom has started to sample its latest Bluetooth product, which is claims is the industry's first to combine Bluetooth 2.1 features, enhanced data rate (EDR) technology and a Class 1 RF transceiver in a single, monolithic chip.
Teridian launches single-package DAA modem device
Product News  
5/23/2007   Post a comment
Check out Teridian's pair of modem chipsets, one of which it claims is the first single package silicon direct access arrangement (DAA) product that uses an inexpensive common pulse transformer to form a digital isolation barrier.
Intel-ST deal: What it means
News & Analysis  
5/23/2007   Post a comment
Now that Intel and STMicroelectronics have finally sealed the deal, here's a look at how the deal measures up and what it may mean for the rest of the industry.
NHK demos image sensor for full 8K resolution
Product News  
5/22/2007   Post a comment
Japan Broadcasting Corp. (NHK) has developed a 33-million pixel CMOS image sensor to deliver "8K by 4K" video resolution, which Japan's largest broadcaster is promoting as Super Hi-Vision for future broadcast services.
UMC opens R&D lab in southern Taiwan
News & Analysis  
5/22/2007   Post a comment
United Microelectronics Corp. opened an R&D center Tuesday that will focus on 45-nanometer and below process technologies.
PCI group makes steady progress on Express specs
News & Analysis  
5/22/2007   Post a comment
The PCI Express train is making slow, steady progress forward increasing data rates and expanding into new uses, based on briefings and demonstrations of PCI Express versions 2.0 and 3.0 at the annual PCI Special Interest Group's developer's conference.
Chip brands failing Intel, AMD
News & Analysis  
5/22/2007   Post a comment
What's in a name? Apparently not much, according to one survey that finds chip brands don't register as well with consumers as companies might think.
Fujitsu preps mobile WiMAX SoC
Product News  
5/21/2007   Post a comment
Fujitsu is getting ready to sample in August its first mobile baseband SoC that is designed using 90-nm low-leakage process technology.
Kit gives a common touch to capacitive input
News & Analysis  
5/21/2007   Post a comment
Companies looking to design iPod-like touch-based interfaces into industrial or consumer electronic systems could be aided by Cirque Corp.'s GlideSensor Development Kit.
S. Korea indicts four for trying to sell WiBro secrets to U.S. firm
News & Analysis  
5/21/2007   Post a comment
Four men in South Korea have been indicted for corporate espionage in connection with trying to sell WiBro technology to a US telecommunications firm.
Pericom jumps on 5 GHz Express train
News & Analysis  
5/21/2007   Post a comment
Pericom Semiconductor Corp. is launching two switches it claims are the first devices supporting the second generation PCI Express specification that runs at data rates up to 5 GHz, as the PCI Special Interest Group convenes its annual meeting here.
Infiniband proponent rolls out 10G Ethernet device
News & Analysis  
5/21/2007   Post a comment
Mellanox Technologies, the sole provider of merchant Infiniband silicon, is jumping on a growing bandwagon of companies fielding chips for 10 Gbit/second Ethernet.
NXP looking for acquisitions in India
News & Analysis  
5/18/2007   Post a comment
NXP is looking acquisitions in India according to Frans van Houten, the company's president and CEO.
H.264 video encoder motion search implementation on a programmable accelerator
Design How-To  
5/18/2007   Post a comment
H.264 video encoding supports the movement of a reference block in 41 possible motion vectors, but calculating all possibilities requires significant number crunching. Stretch's high-performance motion search engine computes all 41 possible H.264 motion vectors for a 16x16 macroblock at a sustainable rate of 250 MB-SADs (macroblock sum-of-absolute-differences computations) per second. How it works.
AMD's Puma chases Intel Centrino sockets
News & Analysis  
5/18/2007   Post a comment
Advanced Micro Devices announced today its Griffin CPU, the first processor it has designed from the ground up for notebooks. AMD is pairing its new CPU with a chip set in a Puma platform that aims to take on Intel's Centrino chips for sockets in high-end notebooks.
Chartered borrows $610 million for 300mm wafer fab
News & Analysis  
5/18/2007   Post a comment
Chartered Semiconductor Manufacturing borrows $610 million to move ahead with the ramp-up of its first 300-millimeter wafer fab.
Betting on '08, Taiwan vendors prep WiMAX 16e systems
News & Analysis  
5/18/2007   Post a comment
Anticipating more demand for WiMAX next after Intel Corp starts shipping modules, Taiwan system vendors are quickly jumping onto the bandwagon.
Optimized memory utilization boosts graphics display controller IC efficiency
Design How-To  
5/17/2007   Post a comment
The complex memory traffic patterns across GDC interfaces present potential data bottlenecks. A balanced design architecture can reduce, and even eliminate, choke points while optimizing performance, cost, and board space utilization.
Asia EMS/ODM market to more than double by 2011
News & Analysis  
5/17/2007   Post a comment
Asia's low-cost advantage and increasing skill set will help it more than double its market share in EMS and ODM by 2011.
China tech industry to hit $1.45 trillion by 2010
News & Analysis  
5/16/2007   Post a comment
China's high-tech industry will rake in $1.45 trillion by 2010, nearly triple its size of just a few years ago, according to a report from a top Chinese policy group.
Samsung showcases 52-inch module from 8G LCD line
Product News  
5/16/2007   Post a comment
S-LCD, Samsung's joint venture with Sony Corp., unveiled a 52-inch LCD panel module, the first to roll out of its 8th-generation LCD fab. Mass production is expected later this year.
Microsoft brings Vista to developing world PCs
News & Analysis  
5/16/2007   Post a comment
After a year in trials, Microsoft Corp. is fine tuning its FlexGo initiative for developing world PCs, working with partners including Advanced Micro Devices, Infineon, Intel, and Via Technologies.
QuickLogic introduces "Boot from Managed NAND" solution
Product News  
5/15/2007   Post a comment
Quicklogic's Managed Land solution supports Secure Digital (SD), Secure Digital High Capacity (SDHC), and Multimedia Card (MMC) based devices.
Sales up, but NEC Electronics still in the red
News & Analysis  
5/15/2007   Post a comment
NEC Electronics Corp. reported on Monday (May 14) that it finished the fiscal year that ended in March in the red, even though sales were up 7 percent over the previous year.
REVIEW: Power management chip throttles USB source
Product News  
5/15/2007   Post a comment
USB battery charging gets easier, thanks to a new power management chip from IC maker Linear Technology. Its bus controlled LTC3555 multi-function power management device for li-ion/polymer battery applications, integrates a switching manager, battery charger, and multiple synchronous buck regulators, plus an always-on LDO, all in a QFN surface-mount package. eeProductCenter Senior Tech Editor Alex Mendelsohn checks it out.
China Netcom decides on homegrown WiMAX rival for Olympics
News & Analysis  
5/15/2007   Post a comment
China Netcom said it will deploy a local wireless technology for the 2008 Beijing Olympics instead of WiMAX, although other operators like China Mobile will go for WiMAX.
STATS ChipPAC opens R&D center for advanced packaging
News & Analysis  
5/15/2007   Post a comment
Singapore's STATS ChipPAC has launched a new research facility to carve out a niche in the high-end packaging market.
One Laptop per Child official criticizes WiMAX community
News & Analysis  
5/14/2007   Post a comment
Frustrated that WiMAX vendors are favoring equipment development for licensed bands, a One Laptop per Child executive said there is also a need for more products that operate in unlicensed bands.
Converter transports Ethernet services over existing connections
Product News  
5/10/2007   Post a comment
TranSwitch, TPACK have teamed up to offer an end-to-end Ethernet over Next Generation PDH (Plesiochronous Digital Hierarchy) product that allows telecom equipment vendors to support Ethernet services over existing PDH and SONET/SDH connections with reliability and bandwidth efficiency.
Beijing sets up $1.3 billion war chest for innovation
News & Analysis  
5/10/2007   Post a comment
Beijing opens its wallet in an effort to steer local tech firms to develop local standards and build up their innovative capabilities.
Philips to sell $2.5 billion stake in TSMC
News & Analysis  
5/9/2007   Post a comment
As part of a plan to shift assets out of chips, Philips Electronics preps a major share sale in foundry Taiwan Semiconductor Manufacturing Co.
Five BenQ executives indicted
News & Analysis  
5/9/2007   Post a comment
Another blow reigns down on Taiwan's BenQ Corp. as prosecutors indict five top executives, including the chairman and president, for insider trading.
TI's Puma 5 cable modem chip pounces on Docsis 3.0 transition
Product News  
5/7/2007   Post a comment
Texas Instruments' Puma 5 cable modem transceiver touts full Docsis 3.0 support, but TI doesn't expect a tide of OEM designs until 2008.
UMC targets CPUs, mulls commodity flash
News & Analysis  
5/7/2007   Post a comment
As IDMs push to go fabless or fab-lite, UMC chief executive Jackson Hu says there will be more opportunities for the foundry to push into microprocessors and flash memory, a market he said the foundry "cannot ignore."
ARM nudges mobile Java forward
News & Analysis  
5/7/2007   Post a comment
ARM Ltd. is upgrading its mobile Java software stack, turning what was essentially a tool kit into a turnkey Java virtual machine (JVM) for cellphones as the JavaOne Conference opens today.
UHF antenna rolls for mobile TV applications
Product News  
5/6/2007   Post a comment
Siano Mobile Silicon and Vishay Intertechnology Inc. have teamed up to develop what they say is the world's smallest UHF antenna chip for mobile digital TV applications.
ST samples 65-nm multi-standard HDD physical layer IP
Product News  
5/6/2007   Post a comment
Check out ST's 65-nm MIPHY macro-cell, which will be integrated in SoC designs for SATA applications.
Bandlet de-interlace and up-conversion for HDTV via "super-resolution" framework
Design How-To  
5/4/2007   Post a comment
Up-converting and de-interlacing standard definition television into high-quality HD raises deep image processing, mathematical and real time processing problems. The Let It Wave approach, using FPGA technology, is based on a full exploration of the 3-D environment of a missing pixel to compute it, by interpolating one or more available pixels located close to a line going through the missing pixel with a particular spatio-temporal direction. This "super-resolution" framework includes the previo
Zarlink transceiver helps implants go broadband
Product News  
5/2/2007   Post a comment
Taking a step closer to the vision of the bionic man, Zarlink Semiconductor Inc. is rolling out today a wireless transceiver for medical implants optimized for an emerging 400 MHz standard, paving the way for a broader and easier to use class of implants that support broadband, automated communications.
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Rishabh N. Mahajani, High School Senior and Future Engineer

Future Engineers: Don’t 'Trip Up' on Your College Road Trip
Rishabh N. Mahajani, High School Senior and Future Engineer
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A future engineer shares his impressions of a recent tour of top schools and offers advice on making the most of the time-honored tradition of the college road trip.

Max Maxfield

Juggling a Cornucopia of Projects
Max Maxfield
19 comments
I feel like I'm juggling a lot of hobby projects at the moment. The problem is that I can't juggle. Actually, that's not strictly true -- I can juggle ten fine china dinner plates, but ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
39 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

Karen Field

July Cartoon Caption Contest: Let's Talk Some Trash
Karen Field
144 comments
Steve Jobs allegedly got his start by dumpster diving with the Computer Club at Homestead High in the early 1970s.

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