REVIEW: PMBus point-of-load DC-to-DC chip has 500-mV to 8-V output ranges Product News 5/30/2007 Post a comment Here's a nifty power conversion and power management IC for synchronous DC-to-DC converter designs. The chip is configured to regulate two independent outputs, or two phases in a single output mode, and supports two types of current-sense topologies. Output range spans 500-mV to 8-V. eeProductCenter Senior Tech Editor Alex Mendelsohn reports.
RF packaged multi-function circuits ease manufacturing Product News 5/30/2007 Post a comment Check out TriQuint's first three packaged devices in its Multi-Function Circuit (MFC) family that it says offer manufacturing ease and cost advantages. The devices address OEM needs for frequency upconversion (amplification) in the transmit and local oscillator chains for digital radio and satellite communications systems.
Teridian launches single-package DAA modem device Product News 5/23/2007 Post a comment Check out Teridian's pair of modem chipsets, one of which it claims is the first single package silicon direct access arrangement (DAA) product that uses an inexpensive common pulse transformer to form a digital isolation barrier.
Intel-ST deal: What it means News & Analysis 5/23/2007 Post a comment Now that Intel and STMicroelectronics have finally sealed the deal, here's a look at how the deal measures up and what it may mean for the rest of the industry.
NHK demos image sensor for full 8K resolution Product News 5/22/2007 Post a comment Japan Broadcasting Corp. (NHK) has developed a 33-million pixel CMOS image sensor to deliver "8K by 4K" video resolution, which Japan's largest broadcaster is promoting as Super Hi-Vision for future broadcast services.
PCI group makes steady progress on Express specs News & Analysis 5/22/2007 Post a comment The PCI Express train is making slow, steady progress forward increasing data rates and expanding into new uses, based on briefings and demonstrations of PCI Express versions 2.0 and 3.0 at the annual PCI Special Interest Group's developer's conference.
Chip brands failing Intel, AMD News & Analysis 5/22/2007 Post a comment What's in a name? Apparently not much, according to one survey that finds chip brands don't register as well with consumers as companies might think.
Pericom jumps on 5 GHz Express train News & Analysis 5/21/2007 Post a comment Pericom Semiconductor Corp. is launching two switches it claims are the first devices supporting the second generation PCI Express specification that runs at data rates up to 5 GHz, as the PCI Special Interest Group convenes its annual meeting here.
H.264 video encoder motion search implementation on a programmable accelerator Design How-To 5/18/2007 Post a comment H.264 video encoding supports the movement of a reference block in 41 possible motion vectors, but calculating all possibilities requires significant number crunching. Stretch's high-performance motion search engine computes all 41 possible H.264 motion vectors for a 16x16 macroblock at a sustainable rate of 250 MB-SADs (macroblock sum-of-absolute-differences computations) per second. How it works.
AMD's Puma chases Intel Centrino sockets News & Analysis 5/18/2007 Post a comment Advanced Micro Devices announced today its Griffin CPU, the first processor it has designed from the ground up for notebooks. AMD is pairing its new CPU with a chip set in a Puma platform that aims to take on Intel's Centrino chips for sockets in high-end notebooks.
REVIEW: Power management chip throttles USB source Product News 5/15/2007 Post a comment USB battery charging gets easier, thanks to a new power management chip from IC maker Linear Technology. Its bus controlled LTC3555 multi-function power management device for li-ion/polymer battery applications, integrates a switching manager, battery charger, and multiple synchronous buck regulators, plus an always-on LDO, all in a QFN surface-mount package. eeProductCenter Senior Tech Editor Alex Mendelsohn checks it out.
Five BenQ executives indicted News & Analysis 5/9/2007 Post a comment Another blow reigns down on Taiwan's BenQ Corp. as prosecutors indict five top executives, including the chairman and president, for insider trading.
UMC targets CPUs, mulls commodity flash News & Analysis 5/7/2007 Post a comment As IDMs push to go fabless or fab-lite, UMC chief executive Jackson Hu says there will be more opportunities for the foundry to push into microprocessors and flash memory, a market he said the foundry "cannot ignore."
ARM nudges mobile Java forward News & Analysis 5/7/2007 Post a comment ARM Ltd. is upgrading its mobile Java software stack, turning what was essentially a tool kit into a turnkey Java virtual machine (JVM) for cellphones as the JavaOne Conference opens today.
Bandlet de-interlace and up-conversion for HDTV via "super-resolution" framework Design How-To 5/4/2007 Post a comment Up-converting and de-interlacing standard definition television into high-quality HD raises deep image processing, mathematical and real time processing problems. The Let It Wave approach, using FPGA technology, is based on a full exploration of the 3-D environment of a missing pixel to compute it, by interpolating one or more available pixels located close to a line going through the missing pixel with a particular spatio-temporal direction. This "super-resolution" framework includes the previo
Zarlink transceiver helps implants go broadband Product News 5/2/2007 Post a comment Taking a step closer to the vision of the bionic man, Zarlink Semiconductor Inc. is rolling out today a wireless transceiver for medical implants optimized for an emerging 400 MHz standard, paving the way for a broader and easier to use class of implants that support broadband, automated communications.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.