Elpida, Powertech, UMC team on 3-D at 28-nm Research 5/31/2011 2 comments Elpida Memory Inc. of Japan, Powertech Technology Inc. and United Microelectronics Corp. of Taiwan have announced that they have finalized a three-way collaboration to deliver 3-D IC integration technologies for advanced manufacturing processes including 28-nm.
MOST150 optimizes data bus efficiency Design How-To 5/9/2011 Post a comment The MOST150 infotainment bus system is about to take the place of earlier MOST systems. With its high bandwidth which can be utilized up to nearly 100%, MOST150 is a viable platform for advanced next-gen infotainment systems. Daimler already has gathered experience with the new bus.
Spec turns USB3 into chip link News & Analysis 5/3/2011 8 comments The USB 3.0 Promoters Group and the MIPI Alliance are pooling technologies to define a high speed, low power chip-to-chip interface for chips used in mobile systems.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments