Elpida, Powertech, UMC team on 3-D at 28-nm Research 5/31/2011 2 comments Elpida Memory Inc. of Japan, Powertech Technology Inc. and United Microelectronics Corp. of Taiwan have announced that they have finalized a three-way collaboration to deliver 3-D IC integration technologies for advanced manufacturing processes including 28-nm.
MOST150 optimizes data bus efficiency Design How-To 5/9/2011 Post a comment The MOST150 infotainment bus system is about to take the place of earlier MOST systems. With its high bandwidth which can be utilized up to nearly 100%, MOST150 is a viable platform for advanced next-gen infotainment systems. Daimler already has gathered experience with the new bus.
Spec turns USB3 into chip link News & Analysis 5/3/2011 8 comments The USB 3.0 Promoters Group and the MIPI Alliance are pooling technologies to define a high speed, low power chip-to-chip interface for chips used in mobile systems.
Drones are, in essence, flying autonomous vehicles. Pros and cons surrounding drones today might well foreshadow the debate over the development of self-driving cars. In the context of a strongly regulated aviation industry, "self-flying" drones pose a fresh challenge. How safe is it to fly drones in different environments? Should drones be required for visual line of sight – as are piloted airplanes? Join EE Times' Junko Yoshida as she moderates a panel of drone experts.