Elpida, Powertech, UMC team on 3-D at 28-nm Research 5/31/2011 2 comments Elpida Memory Inc. of Japan, Powertech Technology Inc. and United Microelectronics Corp. of Taiwan have announced that they have finalized a three-way collaboration to deliver 3-D IC integration technologies for advanced manufacturing processes including 28-nm.
MOST150 optimizes data bus efficiency Design How-To 5/9/2011 Post a comment The MOST150 infotainment bus system is about to take the place of earlier MOST systems. With its high bandwidth which can be utilized up to nearly 100%, MOST150 is a viable platform for advanced next-gen infotainment systems. Daimler already has gathered experience with the new bus.
Spec turns USB3 into chip link News & Analysis 5/3/2011 8 comments The USB 3.0 Promoters Group and the MIPI Alliance are pooling technologies to define a high speed, low power chip-to-chip interface for chips used in mobile systems.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.