Elpida, Powertech, UMC team on 3-D at 28-nm
Research 5/31/2011 2 comments
Elpida Memory Inc. of Japan, Powertech Technology Inc. and United Microelectronics Corp. of Taiwan have announced that they have finalized a three-way collaboration to deliver 3-D IC integration technologies for advanced manufacturing processes including 28-nm.
MOST150 optimizes data bus efficiency
Design How-To 5/9/2011 Post a comment
The MOST150 infotainment bus system is about to take the place of earlier MOST systems. With its high bandwidth which can be utilized up to nearly 100%, MOST150 is a viable platform for advanced next-gen infotainment systems. Daimler already has gathered experience with the new bus.
Spec turns USB3 into chip link
News & Analysis 5/3/2011 8 comments
The USB 3.0 Promoters Group and the MIPI Alliance are pooling technologies to define a high speed, low power chip-to-chip interface for chips used in mobile systems.