Design Con 2015
Breaking News
Content tagged with Logic/Interface
posted in May 2014
Why Intel-Rockchip Tie-Up Matters
Blog  
5/28/2014   14 comments
After Miya Kong discussed the latest Intel-Rockchip announcement with China's industry insiders, we know the two companies have agreed on three points: X86 architecture, 3G modem license, and 14-nm capacity support.
DesignCon Issues 2015 Call for Abstracts
News & Analysis  
5/22/2014   7 comments
The annual conference on high-speed digital design, signal integrity, and power integrity is now taking submissions for paper abstracts.
MIPS Rallies Open-Source Group
News & Analysis  
5/22/2014   13 comments
Imagination Technologies gathered 10 companies including Broadcom, Cavium, and Qualcomm to develop open-source code for MIPS CPUs.
Implant Gets Power Through Flesh
News & Analysis  
5/19/2014   9 comments
A Stanford team claims it has developed a new approach to sending wireless power through living tissue, enabling smaller, deeper implants.
Photons Coming Down Cloudy Path
Blog  
5/16/2014   8 comments
Systems designers see high-speed optical interconnect between chips coming soon, but there’s little agreement on how best to do it.
NXP Car Plan Teams NFC, Bluetooth
News & Analysis  
5/15/2014   6 comments
The biggest issue for the current version of Bluetooth Low Energy may be "its security and pairing mechanism." NXP is proposing NFC for secure transactions, while BLE offers a data link.
Rambus Rejoins Jedec
News & Analysis  
5/14/2014   5 comments
Rambus has been invited to rejoin the memory standards group Jedec after a nearly 20-year absence marked by suits with major DRAM suppliers.
Managing Vehicle Networking
Blog  
5/13/2014   1 comment
The AUTOSAR alliance has been changing the way vehicle networks and ECUs are designed. Different domains in the car have different safety and performance requirements, and the in-vehicle networks must have predictable and secure performance.
Teardown Compares Combo Sensors
Blog  
5/12/2014   3 comments
The latest nine-axis combo sensors from Bosch, InvenSense, and STMicro have similar costs despite different designs, according to a System Plus Consulting chip teardown.
$6 Billion Problem for Mobile Carriers
Blog  
5/8/2014   10 comments
The real issue of the three-device (smartphone, tablet, and notebook) endgame is not the form factor but a $6 billion revenue loss for carriers -- and potentially a huge problem for device manufacturers.
Post-Merger Spansion 'Integrates' With Big Move Into Auto
News & Analysis  
5/7/2014   3 comments
Synergy is no longer the stated goal behind Spansion’s acquisition of Fujitsu Semiconductor’s MCU and analog businesses. Shown in its Q1 results, Spansion is scoring design wins globally, especially in the automotive sector.
Fully Autonomous Car? Don't Buy Shotgun Yet
Blog  
5/6/2014   29 comments
I suspect what’s discussed today as an “autonomous car” is likely to emerge in phases. These cars in each phase will come with fine print stipulating the conditions under which they must be driven.


Top Comments of the Week
Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
<b><a href=Betajet">

The Circle – The Future's Imperfect in the Present Tense
Betajet
5 comments
The Circle, a satirical, dystopian novel published in 2013 by San Francisco-based writer Dave Eggers, is about a large, very powerful technology company that combines aspects of Google, ...

Max Maxfield

Recommended Reads From the Engineer's Bookshelf
Max Maxfield
22 comments
I'm not sure if I read more than most folks or not, but I do I know that I spend quite a lot of time reading. I hate to be idle, so I always have a book or two somewhere about my person -- ...

Martin Rowe

Make This Engineering Museum a Reality
Martin Rowe
Post a comment
Vincent Valentine is a man on a mission. He wants to make the first house to ever have a telephone into a telephone museum. Without help, it may not happen.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Doug Bailey, VP of marketing at Power Integrations, gives a ...
See how to ease software bring-up with DesignWare IP ...
DesignWare IP Prototyping Kits enable fast software ...
This video explores the LT3086, a new member of our LDO+ ...
In today’s modern electronic systems, the need for power ...