Why Intel-Rockchip Tie-Up Matters Blog 5/28/2014 11 comments After Miya Kong discussed the latest Intel-Rockchip announcement with China's industry insiders, we know the two companies have agreed on three points: X86 architecture, 3G modem license, and 14-nm capacity support.
NXP Car Plan Teams NFC, Bluetooth News & Analysis 5/15/2014 5 comments The biggest issue for the current version of Bluetooth Low Energy may be "its security and pairing mechanism." NXP is proposing NFC for secure transactions, while BLE offers a data link.
Rambus Rejoins Jedec News & Analysis 5/14/2014 5 comments Rambus has been invited to rejoin the memory standards group Jedec after a nearly 20-year absence marked by suits with major DRAM suppliers.
Managing Vehicle Networking Blog 5/13/2014 1 comment The AUTOSAR alliance has been changing the way vehicle networks and ECUs are designed. Different domains in the car have different safety and performance requirements, and the in-vehicle networks must have predictable and secure performance.
Teardown Compares Combo Sensors Blog 5/12/2014 3 comments The latest nine-axis combo sensors from Bosch, InvenSense, and STMicro have similar costs despite different designs, according to a System Plus Consulting chip teardown.
$6 Billion Problem for Mobile Carriers Blog 5/8/2014 10 comments The real issue of the three-device (smartphone, tablet, and notebook) endgame is not the form factor but a $6 billion revenue loss for carriers -- and potentially a huge problem for device manufacturers.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.