Why Intel-Rockchip Tie-Up Matters
Blog 5/28/2014 11 comments
After Miya Kong discussed the latest Intel-Rockchip announcement with China's industry insiders, we know the two companies have agreed on three points: X86 architecture, 3G modem license, and 14-nm capacity support.
NXP Car Plan Teams NFC, Bluetooth
News & Analysis 5/15/2014 5 comments
The biggest issue for the current version of Bluetooth Low Energy may be "its security and pairing mechanism." NXP is proposing NFC for secure transactions, while BLE offers a data link.
Rambus Rejoins Jedec
News & Analysis 5/14/2014 5 comments
Rambus has been invited to rejoin the memory standards group Jedec after a nearly 20-year absence marked by suits with major DRAM suppliers.
Managing Vehicle Networking
Blog 5/13/2014 1 comment
The AUTOSAR alliance has been changing the way vehicle networks and ECUs are designed. Different domains in the car have different safety and performance requirements, and the in-vehicle networks must have predictable and secure performance.
Teardown Compares Combo Sensors
Blog 5/12/2014 3 comments
The latest nine-axis combo sensors from Bosch, InvenSense, and STMicro have similar costs despite different designs, according to a System Plus Consulting chip teardown.
$6 Billion Problem for Mobile Carriers
Blog 5/8/2014 10 comments
The real issue of the three-device (smartphone, tablet, and notebook) endgame is not the form factor but a $6 billion revenue loss for carriers -- and potentially a huge problem for device manufacturers.