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Content tagged with Logic/Interface
posted in June 2010
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SiLabs breaks low-power record for touch-sense microcontrollers
Product News  
6/30/2010   Post a comment
Silicon Laboratories claims to have broken its own record for the industry's lowest-power capacitive touch sensor microcontrollers with the new F9xx family.
Micron's results: What analysts are saying
News & Analysis  
6/30/2010   Post a comment
Micron Technology Inc. roared past analysts’ consensus estimate in its recent quarter.
Qualcomm brews apps store for mobile OS
News & Analysis  
6/30/2010   Post a comment
Qualcomm Inc. is expanding its efforts in the mobile operating system and connectivity arenas.
Price hikes, shortages seen in hot solar biz
News & Analysis  
6/30/2010   2 comments
Photovoltaic demand is projected to double over last year.
Gyro vendor InvenSense files IPO
News & Analysis  
6/30/2010   Post a comment
InvenSense Inc., a provider of motion processing solutions or gyroscopes, is filing for an IPO.
The Inefficiency of C++, Fact or Fiction?
Design How-To  
6/30/2010   1 comment
This article will attempt to sort out the facts from the fiction in this statement. By better understanding the underlying mechanisms of the language, a designer can avoid code bloat.
Microchip integrates USB, large RAM in PIC MCUs
Product News  
6/29/2010   Post a comment
In an effort to improve throughput and data buffering in Ethernet connectivity, remote sensing, data logging and audio streaming applications, Microchip Technology has integrated USB for Embedded Host/Peripheral/On-the-Go and 96 Kbyes of RAM into its latest microcontrollers.
Intel, Israel discuss next fab, says report
News & Analysis  
6/29/2010   Post a comment
Intel is discussing locating a wafer fab in Kiryat Gat, Israel, with the Ministry of Industry, Trade and Labor, according to The Media Line.
TSMC given OK to take 10% SMIC stake
News & Analysis  
6/29/2010   Post a comment
The Taiwanese Ministry of Economic Affairs has approved an application by TSMC to take up a 10 percent stake in Chinese foundry rival SMIC, according to reports.
TI offers USB 3.0 IC for 5-Gbit/s transfers
Product News  
6/29/2010   Post a comment
Texas Instruments has introduced to the market a USB 3.0 transceiver capable of 5-Gbits-per-second data transmission rates.
Power-saving low-voltage comparator has tiny dimensions, extended temp range
Product News  
6/29/2010   Post a comment
ST's low-voltage comparator can operate with a supply voltage ranging from 1.6 to 5 V with only 20µA current consumption, and features rail-to-rail inputs for low-voltage applications.
Low-power ADCs extend battery life
Product News  
6/29/2010   Post a comment
Maxim's new family of ADCs consumes only 9.9mW, operates down to 2.2V, and offers burst-mode operation to deliver maximum power savings.
Freescale plans basestation-on-chip
News & Analysis  
6/29/2010   2 comments
Freescale Semiconductor plans to best its embedded communications competitors not just by depending on raw computing speed for its processors but by reaching the higher integration levels needed to put a "basestation on a chip," according to Lisa Su, senior vice president and general manager for networking and multimedia.
Samsung, TSMC hit by ITC complaint
News & Analysis  
6/28/2010   3 comments
STC.UNM (STC)--the technology-transfer arm of the University of New Mexico (UNM)--said that it is charging Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Samsung Electronics Co. Ltd. with alleged patent infringement.
CoorsTek buys ceramics unit for $245M
News & Analysis  
6/28/2010   Post a comment
CoorsTek Inc., a manufacturer of ceramic and specialty material components, has signed a definitive agreement to purchase the advanced ceramics business of Saint-Gobain for about $245 million.
Obducat CEO resigns amid losses
News & Analysis  
6/28/2010   1 comment
Amid losses and order delays, Patrik Lundstrom has been named acting CEO of Obducat AB (Malmo, Sweden), a supplier of nano-imprint lithography tools.
Report: Firms buy stake in PSi
News & Analysis  
6/28/2010   Post a comment
Integrated Micro-Electronics Inc. (IMI)and Narra Venture Capital II have acquired a 67 percent stake in PSi Technologies Inc. (PSi) of the Philippines for $30 million.
Which type of "analog" designer are you?
Blog  
6/28/2010   4 comments
There are engineers doing circuits the analog way, because they absolutely want to, or because they are forced to, or somewhere in-between; judging how much analog makes sense means stepping back and making objective assessments
Russia's Sistema still pursuing Infineon, says report
News & Analysis  
6/28/2010   Post a comment
Infineon has denied it is in discussions with diversified Russian holding company AFK Sistema, according to a report, in a rerun of denials from September 2009 and earlier. Another report has said that Sistema
PLX samples USB SuperSpeed 3.0 controllers
Product News  
6/28/2010   Post a comment
PLX Technology Inc. has started to sample three USB SuperSpeed 3.0-to-SATA controllers targeting the rapidly expanding consumer storage market.
Top Embedded Internet How-To's of 2010 (so far)
Design How-To  
6/28/2010   Post a comment
With the year half-way through, here are the ten most popular Embedded Internet how-to articles so far for 2010.
Reduce parallel programming pain with dataflow languages
Design How-To  
6/27/2010   12 comments
Whether modifying an existing application or writing entirely new code, parallel applications can be much more challenging to work with than their sequential counterparts.
Infineon aims to beat 30% annual growth, says report
News & Analysis  
6/25/2010   Post a comment
German chip vendor Infineon Technologies AG is predicting revenue growth for its 2010 financial year in the "high 30 percent range" compared with the previous fiscal year that ended on Sept. 30, 2009, according to a Bloomberg report.
Atmel completes sale of fab in France
News & Analysis  
6/24/2010   Post a comment
Germany's LFoundry GmbH, an analog and mixed-signal foundry, has completed its previously-announced acquisition of Atmel Corp.’s wafer fabrication operation in Rousset, France.
Can Nikon regain its focus?
News & Analysis  
6/24/2010   Post a comment
Can Nikon Corp. regain its focus?
IBM 'fab club' aligns 28-nm process, jabs rival
News & Analysis  
6/24/2010   1 comment
IBM, Samsung, GlobalFoundries and STMicroelectronics said that they are in collaboration to ''synchronize’’ the production of chips, based on its previously-announced, 28-nm low-power process.
DRAM makers to pay $173M in price-fixing case
News & Analysis  
6/24/2010   Post a comment
Some 32 states in the United States announced a $173 million settlement with six DRAM manufacturers who "conspired in an illegal global scheme to fix prices."
5 kV digital isolators replace traditional optocouplers in harsh application environments
Product News  
6/24/2010   Post a comment
Silicon Laboratories introduced a line of 5 kV digital isolators designed to replace traditional optocouplers in harsh application environments and systems powered from universal mains supplies.
SerDes provides real-time bidirectional control for driver-assist cameras
Product News  
6/24/2010   Post a comment
National Semiconductor unveiled its FPD-Link III family of automotive-grade serializer and deserializer (SerDes) chipsets featuring the industry's first real-time, bidirectional control channel for driver-assist video cameras.
China's $25 billion to boost domestic production, says analyst
News & Analysis  
6/24/2010   2 comments
LONDON — The Chinese government is preparing to spend $25 billion on wafer fabs to boost domestic chip manufacturing over the next five years, according to market research company The Information Network. This is set to boost the proportion of local demand met by domestic wafer fabs and diminish Chinese chip imports, the analysis firm said
May chip sales show World Cup effect, says analyst
News & Analysis  
6/24/2010   Post a comment
The three-month average of global chip sales for May is set to be called at $24.5 billion, compared with $23.3 billion in April and an all time record, according to Bruce Diesen, an analyst at Carnegie Group.
Serial RapidIO Gen2 switches double embedded interconnect performance
Product News  
6/24/2010   Post a comment
Designed for use in the wireless infrastructure, defense, medical and industrial imaging, and professional video markets, IDT's Serial RapidIO Generation 2 (Gen2) switches double the data rate up to 20-Gbps, while reducing power by 40 percent and improving latency to 100 nanoseconds in cut-through mode.
PCI Express 3.0 delayed until 2011
News & Analysis  
6/24/2010   3 comments
The PCI SIG has released an interim 0.71 version of the PCI Express 3.0 specification that supports up to 8 GigaTransfers/second and aims to start testing products for compliance in early 2011, about a year later than originally anticipated.
AMD x86 cores at Hot Chips
News & Analysis  
6/24/2010   Post a comment
AMD is expected to steal the limelight at the annual Hot Chips conference when it describes two new x86 cores that mark the first major architectural advance for the company in several years.
Group forms another 3-D chip alliance
News & Analysis  
6/23/2010   Post a comment
Another three-dimensional (3-D) chip alliance has been hatched.
VLSI ups fab tool outlook in hot market
News & Analysis  
6/23/2010   Post a comment
The fab tool and materials industries are hot.
Will Spansion succeed or fail again?
News & Analysis  
6/23/2010   Post a comment
Spansion Inc. is looking to make a big comeback.
ISuppli: IC inventories still below average
News & Analysis  
6/22/2010   Post a comment
Semiconductor vendors' chip inventory levels remain at low levels despite a small increase in the first quarter of the year, according to market research firm iSuppli.
Freescale CEO: 'Connected intelligence' beating recession
News & Analysis  
6/22/2010   Post a comment
Freescale Semiconductor revealed its vision of the future of semiconductor technology at the Freescale Technology Forum, where CEO Richard Beyer predicted that the recession will continue to fade by virtue of the commercial success of what he called "connected intelligence."
IAR Systems supports new Freescale MCU families
Product News  
6/22/2010   1 comment
Freescale's newest Kinetis, ColfFire and i.MX microcontrollers can now all use a common software development environment from IAR Systems, the company announced.
Intel, FTC in settlement talks
News & Analysis  
6/22/2010   2 comments
The U.S. Federal Trade Commission (FTC) and Intel Corp. have filed a joint motion to ''suspend administrative trial proceedings.''
Sensors integrate ColdFire processor, MEMS accelerometer
Product News  
6/22/2010   1 comment
Freescale Semiconductor new Xtrinsic family of smart MEMS sensors combine a 32-bit ColdFire microcontroller with on-chip algorithms for all the common operations like tap, touch, tilt and orientation, thereby streamlining designs and offloading the application processor, the company said.
40MHz to 10GHz RMS detector provides 57dB dynamic range
Product News  
6/22/2010   Post a comment
Linear Technology has introduced the LTC5582, a high dynamic range 10GHz RMS detector that measures RF signals with high accuracy.
Image sensor sales forecast to grow 31% in 2010
News & Analysis  
6/22/2010   Post a comment
Sales of image sensors will grow by 31 percent in 2010, reaching a new record of $8.5 billion, according to projections from market research firm IC Insights.
ST chip measures power line current up to 70V
Product News  
6/22/2010   Post a comment
ST's latest high-side current-sense amplifier simplifies the design of power management, monitoring and safety equipment by allowing direct and accurate measurement of current in power lines operating at up to 70V.
Chengdu: Spicy city faces hi-tech hurdles
News & Analysis  
6/21/2010   3 comments
Chengdu is fast becoming the next major biotechnology, chip, information technology (IT), LED and renewable energy hub in China.
National Semi buys GTronix
News & Analysis  
6/21/2010   Post a comment
National Semiconductor Corp. has acquired the technology of GTronix Inc.
Trio forms 3-D chip alliance
News & Analysis  
6/21/2010   2 comments
Elpida Memory Inc., Powertech Technology Inc. and United Microelectronics Corp. (UMC) have formed an alliance to speed up the development of three-dimensional (3-D) chips.
Source Measure Units tame challenges of assessing battery drain, functional test
Product News  
6/21/2010   Post a comment
Source Measure Units tame challenges of assessing battery drain, functional test
Convert parallel impedances to series impedances
Design How-To  
6/21/2010   4 comments
Understand how impedance-topology conversion can simplify transformer equivalent circuits or filter networks
Page 1 / 2   >   >>


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