The Inefficiency of C++, Fact or Fiction? Design How-To 6/30/2010 1 comment This article will attempt to sort out the facts from the fiction in this statement. By better understanding the underlying mechanisms of the language, a designer can avoid code bloat.
Microchip integrates USB, large RAM in PIC MCUs Product News 6/29/2010 Post a comment In an effort to improve throughput and data buffering in Ethernet connectivity, remote sensing, data logging and audio streaming applications, Microchip Technology has integrated USB for Embedded Host/Peripheral/On-the-Go and 96 Kbyes of RAM into its latest microcontrollers.
Freescale plans basestation-on-chip News & Analysis 6/29/2010 2 comments Freescale Semiconductor plans to best its embedded communications competitors not just by depending on raw computing speed for its processors but by reaching the higher integration levels needed to put a "basestation on a chip," according to Lisa Su, senior vice president and general manager for networking and multimedia.
Samsung, TSMC hit by ITC complaint News & Analysis 6/28/2010 3 comments STC.UNM (STC)--the technology-transfer arm of the University of New Mexico (UNM)--said that it is charging Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Samsung Electronics Co. Ltd. with alleged patent infringement.
CoorsTek buys ceramics unit for $245M News & Analysis 6/28/2010 Post a comment CoorsTek Inc., a manufacturer of ceramic and specialty material components, has signed a definitive agreement to purchase the advanced ceramics business of Saint-Gobain for about $245 million.
Obducat CEO resigns amid losses News & Analysis 6/28/2010 1 comment Amid losses and order delays, Patrik Lundstrom has been named acting CEO of Obducat AB (Malmo, Sweden), a supplier of nano-imprint lithography tools.
Report: Firms buy stake in PSi News & Analysis 6/28/2010 Post a comment Integrated Micro-Electronics Inc. (IMI)and Narra Venture Capital II have acquired a 67 percent stake in PSi Technologies Inc. (PSi) of the Philippines for $30 million.
Which type of "analog" designer are you? Blog 6/28/2010 4 comments There are engineers doing circuits the analog way, because they absolutely want to, or because they are forced to, or somewhere in-between; judging how much analog makes sense means stepping back and making objective assessments
Atmel completes sale of fab in France News & Analysis 6/24/2010 Post a comment Germany's LFoundry GmbH, an analog and mixed-signal foundry, has completed its previously-announced acquisition of Atmel Corp.’s wafer fabrication operation in Rousset, France.
China's $25 billion to boost domestic production, says analyst News & Analysis 6/24/2010 2 comments LONDON — The Chinese government is preparing to spend $25 billion on wafer fabs to boost domestic chip manufacturing over the next five years, according to market research company The Information Network. This is set to boost the proportion of local demand met by domestic wafer fabs and diminish Chinese chip imports, the analysis firm said
PCI Express 3.0 delayed until 2011 News & Analysis 6/24/2010 3 comments The PCI SIG has released an interim 0.71 version of the PCI Express 3.0 specification that supports up to 8 GigaTransfers/second and aims to start testing products for compliance in early 2011, about a year later than originally anticipated.
AMD x86 cores at Hot Chips News & Analysis 6/24/2010 Post a comment AMD is expected to steal the limelight at the annual Hot Chips conference when it describes two new x86 cores that mark the first major architectural advance for the company in several years.
Freescale CEO: 'Connected intelligence' beating recession News & Analysis 6/22/2010 Post a comment Freescale Semiconductor revealed its vision of the future of semiconductor technology at the Freescale Technology Forum, where CEO Richard Beyer predicted that the recession will continue to fade by virtue of the commercial success of what he called "connected intelligence."
Sensors integrate ColdFire processor, MEMS accelerometer Product News 6/22/2010 1 comment Freescale Semiconductor new Xtrinsic family of smart MEMS sensors combine a 32-bit ColdFire microcontroller with on-chip algorithms for all the common operations like tap, touch, tilt and orientation, thereby streamlining designs and offloading the application processor, the company said.
ST chip measures power line current up to 70V Product News 6/22/2010 Post a comment ST's latest high-side current-sense amplifier simplifies the design of power management, monitoring and safety equipment by allowing direct and accurate measurement of current in power lines operating at up to 70V.
Trio forms 3-D chip alliance News & Analysis 6/21/2010 2 comments Elpida Memory Inc., Powertech Technology Inc. and United Microelectronics Corp. (UMC) have formed an alliance to speed up the development of three-dimensional (3-D) chips.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments