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Content tagged with Logic/Interface
posted in June 2013
PLX Rewires Datacenter for Express
News & Analysis  
6/28/2013   6 comments
PLX Technology showed a development system that uses PCI Express instead of Ethernet or Infiniband to link servers in a rack, saving cost.
ST preps ST75MM smart meter chip supporting METERS AND MORE spec
Product News  
6/27/2013   4 comments
ST’s SoC with turn-key hardware supporting METERS AND MORE open communication standard enables broad smart-meter deployment.
Microchip Technology's MCP2561/2 series of transceivers
Product News  
6/27/2013   Post a comment
The MCP2561/2 series of transceivers meets the stringent EMC requirements of global automotive OEMs.
Slideshow: PCIe takes on mobile, Thunderbolt, more
News & Analysis  
6/26/2013   3 comments
PCI Express Gen 3 will ride the MIPI M-PHY in tablets and smartphones thanks to one of several new specs from the PCI SIG.
IBM, Oracle battle over big iron at Hot Chips
News & Analysis  
6/25/2013   8 comments
IBM’s Power 8 will go up against Oracle’s M6 and Bixby chips in a battle of next-gen server processors at the event in August.
Qualcomm plugs wireless charging into cars, desks
News & Analysis  
6/21/2013   19 comments
Qualcomm licensed Gill to sell its wireless charging technology based on the A4WP spec into products for cars and office equipment.
Diodes 74HC, 74HCT, 74AHC and 74AHCT CMOS logic families.
Product News  
6/20/2013   Post a comment
Diodes has added standard shift register and decoder logic ICs to its enhanced 74HC, 74HCT, 74AHC and 74AHCT CMOS logic families.
FDSOI helps ST, Rambus reach IP settlement
News & Analysis  
6/18/2013   Post a comment
Agreement covers FDSOI design, security, memory and interface technologies and settles all outstanding claims.
Intel's Haswell gets mixed reviews from analysts
Blog  
6/6/2013   28 comments
Intel’s new microprocessor, Haswell, won’t revive a sagging PC market or give Intel a huge leg up in tablets from what I hear.
Maxim’s CEO on analog, Intel, Samsung and more
News & Analysis  
6/4/2013   4 comments
Maxim chief executive Tunc Doluca talks about his new 90nm analog process, his integration strategy, Intel, Samsung and China.
SMIC forms joint venture for 28-nm chip production
News & Analysis  
6/3/2013   11 comments
Some $3.6 billion funding has been earmarked for SMIC joint-venture to focus on 45-nm and finer geometry manufacturing.


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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
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