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Content tagged with Logic/Interface
posted in June 2013
PLX Rewires Datacenter for Express
News & Analysis  
6/28/2013   6 comments
PLX Technology showed a development system that uses PCI Express instead of Ethernet or Infiniband to link servers in a rack, saving cost.
ST preps ST75MM smart meter chip supporting METERS AND MORE spec
Product News  
6/27/2013   4 comments
STís SoC with turn-key hardware supporting METERS AND MORE open communication standard enables broad smart-meter deployment.
Microchip Technology's MCP2561/2 series of transceivers
Product News  
6/27/2013   Post a comment
The MCP2561/2 series of transceivers meets the stringent EMC requirements of global automotive OEMs.
Slideshow: PCIe takes on mobile, Thunderbolt, more
News & Analysis  
6/26/2013   3 comments
PCI Express Gen 3 will ride the MIPI M-PHY in tablets and smartphones thanks to one of several new specs from the PCI SIG.
IBM, Oracle battle over big iron at Hot Chips
News & Analysis  
6/25/2013   8 comments
IBMís Power 8 will go up against Oracleís M6 and Bixby chips in a battle of next-gen server processors at the event in August.
Qualcomm plugs wireless charging into cars, desks
News & Analysis  
6/21/2013   19 comments
Qualcomm licensed Gill to sell its wireless charging technology based on the A4WP spec into products for cars and office equipment.
Diodes 74HC, 74HCT, 74AHC and 74AHCT CMOS logic families.
Product News  
6/20/2013   Post a comment
Diodes has added standard shift register and decoder logic ICs to its enhanced 74HC, 74HCT, 74AHC and 74AHCT CMOS logic families.
FDSOI helps ST, Rambus reach IP settlement
News & Analysis  
6/18/2013   Post a comment
Agreement covers FDSOI design, security, memory and interface technologies and settles all outstanding claims.
Intel's Haswell gets mixed reviews from analysts
Blog  
6/6/2013   28 comments
Intelís new microprocessor, Haswell, wonít revive a sagging PC market or give Intel a huge leg up in tablets from what I hear.
Maximís CEO on analog, Intel, Samsung and more
News & Analysis  
6/4/2013   4 comments
Maxim chief executive Tunc Doluca talks about his new 90nm analog process, his integration strategy, Intel, Samsung and China.
SMIC forms joint venture for 28-nm chip production
News & Analysis  
6/3/2013   11 comments
Some $3.6 billion funding has been earmarked for SMIC joint-venture to focus on 45-nm and finer geometry manufacturing.


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Betajet
5 comments
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Make This Engineering Museum a Reality
Martin Rowe
Post a comment
Vincent Valentine is a man on a mission. He wants to make the first house to ever have a telephone into a telephone museum. Without help, it may not happen.

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Making the Grade in Industrial Design
Rich Quinnell
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As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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