Audio connectors shrink in size Product News 7/31/2008 1 comment ITT Interconnect Solutions has developed a miniature audio connector series, aimed at higher quality compact audio applications in video, broadcast and recording.
8th International Congress MID 2008 News & Analysis 7/29/2008 Post a comment On 24th and 25th of September, the 8th International Congress MID 2008 takes place at the congress center of Fuerth. This worldwide leading event about MID technology presents an international accepted forum that enables intensive exchange of experiences in the field of molded interconnect devices.
Report: DisplayPort wins in PCs, HDMI gets TVs Product News 7/25/2008 Post a comment DisplayPort will supplant VGA and the emerging High Definition Multimedia Interface in PCs after 2010, but HDMI will retain the lion's share of external links on digitial TVs and other consumer gear, according to a new report from market watcher iSuppli.
Consumer giants rally around Wi-Fi variant News & Analysis 7/23/2008 Post a comment Startup Amimon has rallied five consumer giants behind its variation of an 802.11n home network for high def video, and the resulting Wireless Home Digital Interface special interest group will define by the end of the year an ad hoc standard based on an update of the Amimon technology.
Oxford rolls controllers for home storage boxes Design How-To 7/21/2008 Post a comment : Oxford Semiconductor is rolling out four new controllers for consumer storage systems in its effort to expand into a growing field beyond its core competency in more mature 1394 and USB silicon with controllers that aim to raise performance while keeping costs low for digital home storage devices.
60-GHz group pushes back on Gbit Wi-Fi plan News & Analysis 7/16/2008 Post a comment An effort to create a standards group to define a Gbit/second version of Wi-Fi is getting significant push back from a separate group that sees conflict with its work in the 60 GHz space at an Ethernet standards meeting in Denver this week.
Solar thermal technology heats up Design How-To 7/15/2008 3 comments Solar thermal technology that attempts to harness the efficient phase change from water to steam is emerging as the preferred alternative energy technology in the race to replace fossil fuels with sustainable energy sources, experts agree.
RS232 radio interface board enables a 9600-baud wireless data link Product News 7/15/2008 Post a comment The TDi2 from Radiometrix is a RS232 interface board that combines a TDL2A 433-9 OEM multi-channel wireless modem module (operating at a half-duplex serial data rate of 9600bits/s ), an RS232 driver, a 9 way DB9F connector, helical SMA aerial and power connectors, and a local 5V voltage regulator.
Apple shuns leading chip makers in 3G iPhone News & Analysis 7/15/2008 2 comments Following the trend it set with its original iPhone, Apple has shunned top-tier chip makers such as Texas Instruments and Qualcomm for many of the major sockets its latest model released July 11, choosing instead Infineon, Samsung and TriQuint.
IDC sees uptick in 10G Ethernet News & Analysis 7/14/2008 Post a comment The market for 10 Gbit/second Ethernet is just starting to ramp and remains an open field for established companies and startups alike, according to a new report on the technology from International Data Corp. (Framingham, Mass.). which breaks out 10GE sales figures for the first time.
Under the Hood - Update: Apple iPhone 3G exposed Teardown 7/12/2008 7 comments A close analysis of iPhone 3G's insides shows major wins for Infineon and TriQuint, though it's clear that much of the emphasis this time around less on reinventing the wheel and more on user experience and applications development.
3-D chip stacks standardized News & Analysis 7/10/2008 Post a comment The Intimate Memory Interconnect Standard being promoted by the 3D-IC Alliance recently released its official specification for 3-D stacking memory chips.
"InstaPort" HDMI from SI speeds switching of A/V sources Product News 7/3/2008 Post a comment The SiI9251 and SiI9261 input processors incorporate InstaPort technology, a new innovation that enables high speed switching between HDMI input ports by adding intelligence to the inputs. By minimizing switching lag between HDMI technology enabled source devices, consumers can more quickly access and enjoy the content found on the ever increasing number of new mobile and broadband entertainment devices connected to the DTV.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.