AMD, HP propose extensions for PCI Express 3.0 News & Analysis 7/31/2009 Post a comment Researchers from Advanced Micro Devices and Hewlett-Packard have written two extensions to the PCI Express 3.0 specification which aims to enable lower cost chips that could support multiple protocols and reduce processor overhead.
Silicon Valley, Wall Street meet at interconnect event News & Analysis 7/30/2009 Post a comment The Hot Interconnects conference will move from its longstanding home on the Stanford campus to Lower Manhattan next month as organizers try to bring together Silicon Valley technologists and bleeding edge systems users on Wall Street, in part to debate the competition between 10 Gbit Ethernet and Infiniband.
Freescale CEO claims progress, but firm posts loss News & Analysis 7/23/2009 Post a comment Freescale Semiconductor posted a net loss of $484 million on revenue of $824 million for the quarter ended July 3, but the company's top executive said the firm continues to make solid progress on its ongoing restructuring and goal of returning to profitability.
ISuppli: IC inventories down to appropriate levels News & Analysis 7/20/2009 Post a comment Global semiconductor inventories have declined to appropriate levels following four consecutive quarters of reductions, clearing the way for stockpile rebuilding and higher sales in the second half of the year, according to market research firm iSuppli.
When good grounds turn bad--isolate! Design How-To 7/17/2009 Post a comment
To make designers aware of these design pitfalls, this article explains where ground potential differences originate in the electrical installation, how ground loops are created unintentionally, and how isolation circumvents both conditions to yield a robust data-transmission system.
Cypress beats Q2 expectations News & Analysis 7/16/2009 Post a comment Cypress Semiconductor said second quarter revenue increased 12 percent sequentially, while President and CEO T.J. Rodgers said company management is "cautiously optimistic" on the pace of the chip industry recovery.
PCI Express will scale to 8 GHz by next June News & Analysis 7/15/2009 1 comment The final specification for PCI Express 3.0 will be released by next June, the PCI Special Interest Group announced at its annual conference, providing more detail about the 8 GHz interconnect and challenges implementing it.
Deinterlacing with FPGA for HDTVs Design How-To 7/15/2009 2 comments Interlaced video is a succession of 50 or 60 fields per second, where each field carries only half of the rows that are displayed in each frame of video. This article explores different deinterlacing techniques and examines how FPGAs are increasingly being used for complex deinterlacing functions required for HDTVS.
CEA may set wireless charging standard News & Analysis 7/14/2009 1 comment The Consumer Electronics Association is investigating whether it should create a wireless charging standard for devices such as cellphones at a time when many competing technologies are emerging including one used in the Palm Pre Touchstone that has analysts scratching their heads.
Tensilica to power Blue Wonder's LTE designs Product News 7/14/2009 Post a comment Design house Blue Wonder Communications (Dresden, Germany), which specializes in baseband chips and IP for mobile broadband applications such as LTE, is to use Tensilica's Xtensa dataplane processors for an LTE broadband modem design.
Report sees WiMax slowdown, LTE concerns Product News 7/13/2009 Post a comment WiMax networks are facing a slowdown in revenue and subscriber growth this year, and many carriers still harbor concerns about whether the rival fourth generation wireless technology, Long Term Evolution, is ready for deployment, according to a new report from Maravedis Research.
Renesas touts faster SiP design process Product News 7/13/2009 Post a comment Renesas has started using new tools that the company says can halve system-in-package (SiP) design time since they rely on a top-down (predictive) design approach in which key characteristics, such as design quality and heat dispersion, are verified during the initial design stage.
Groups partner on LTE reference design Product News 7/9/2009 Post a comment Lime Microsystems (Guildford, England) and Blue Wonder Communications (Dresden, Germany) are partnering on the development of an LTE reference design using Lime's single chip LTE transceiver alongside the German group's baseband.
Selection and integration of MEMS-based motion processing devices Design How-To 7/8/2009 1 comment Measuring and intelligently processing the movements of devices in three dimensional spaces is the next major disruptive technology that will drive innovation in consumer electronics. This feature will examine four critical factors involved in the selection and integration of this technology.
Infineon sells wireline group for $350 million News & Analysis 7/7/2009 Post a comment Struggling German chip group Infineon Technologies AG is selling its wireline communications operation to an affiliate of U.S. based private equity firm Golden Gate Capital for 250 million euro (about $250 million).
MediaTek the latest to take to ARM Mali News & Analysis 7/7/2009 Post a comment MediaTek, the fast-growing Taiwanese group developing SoCs for wireless communications devices, has become the latest to take a license on ARM's Mali-400 MP multicore graphics processing unit (GPU) for its system-on-chips.
Skyworks said to have pipped RFMD in cellphone PA stakes News & Analysis 7/7/2009 Post a comment The two leading suppliers of power amplifiers for the mobile communications sector, Skyworks and RFMD, ended last year with close to one-third of the market, but Skyworks has for the first time edged slightly ahead of RFMD, according to market trackers Strategy Analytics.
Via Licensing signals progress with NFC patent pool News & Analysis 7/1/2009 Post a comment The formation of a patent pool for technologies related to near field communications (NFC) is gathering steam with one of the major players in the field, Via Licensing Corporation, signing up Motorola Inc. for its joint licensing program.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.