NEC, In-System to develop ICs for USB 2.0 spec News & Analysis 8/31/2000 Post a comment BOISE, Idaho -- In-System Design Inc. (ISD) today announced a partnership with NEC Corp. to co-develop a family of devices based on a new Universal Serial Bus (USB) 2.0 standard. Under a partnership agreement, ISD's digital expertise will be combined with NEC's analog capabilities to create what the companies claim will be the world's first single-chip solutions for the USB 2.0 specification.
Innocomm shifts to fabless model from wireless-IC design house News & Analysis 8/31/2000 Post a comment SAN DIEGO -- Two-year-old Innocomm Wireless Inc. here has turned itself into a fabless chip company from its start as an IC design house for radio-frequency and mixed-signal devices. The San Diego startup said it now specializes in chip sets for wireless PCs and automation products in the home and office.
On Semi to triple R&D and target power management, broadband ICs News & Analysis 8/31/2000 Post a comment PHOENIX -- On Semiconductor today announced plans to triple spending on research and development by 2001, compared to 1999 levels, with a long-term target of R&D expenditures set at 5-to-6% of revenues after next year. The year-old spin-off from Motorola Inc. spent about $37 million on R&D in 1999, which represented 2.3% of its revenues.
Anadigics enters new wireless net arena, invests in Embedded Wireless News & Analysis 8/30/2000 Post a comment Warren, N.J. -- Anadigics Inc. here entered the emerging personal area networking market, announcing that it has made an undisclosed equity investment in Embedded Wireless Devices Inc. of Pleasanton, Calif. Anadigics and Embedded Wireless plan to co-develop a range of chips, based on several new-but-incompatible 2.4-GHz wireless standards, such as Bluetooth, 802.11, and others.
Alliance to invest $75 million in Tower's new foundry fab in Israel News & Analysis 8/30/2000 Post a comment MIGDAL HAEMEK, Israel -- U.S. memory supplier Alliance Semiconductor Corp. today announced it will invest $75 million in a planned 8-inch wafer fab planned by silicon foundry supplier Tower Semiconductor Ltd. here. Alliance, based in Santa Clara, Calif., joins SanDisk Corp. in nearby Sunnyvale as investment partners in Tower's planned second fab. Tower expects to start construction on the long-planned fab this year after securing government funding.
inSilicon licenses Arm's system-on-chip peripherals News & Analysis 8/29/2000 Post a comment SAN JOSE -- inSilicon Corp. today announced it has licensed Arm Ltd.'s MicroPack design kit and PrimeCell peripherals for use in system-on-chip (SoC) development. The San Jose company plans to offer Arm's peripheral functions in sub-licensing agreements with customers, who are designing SoC chips using inSilicon's communications intellectual property.
Conexant offers chip set for V.90 modem, Ethernet on single card News & Analysis 8/29/2000 Post a comment NEWPORT BEACH, Calif.--Conexant Systems Inc. today rolled out a new V.90/Ethernet chip set for mobile computing, based on a mini-peripheral component interconnect form factor, called mini-PCI. The solution puts both the V.90 modem and Ethernet connection on a single card, saving costs in notebook PCs, said the company.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments