Ethernet Still Reigns as King of Industrial-Control Universe Design How-To 8/27/2003 Post a comment Given the promise it holds for a myriad of applications, the hubbub over wireless technology, particularly in communications, is understandable. It's equally understandable that this excitement would spill over into the realm of industrial controls. We have not seen the upsurge in the use of wireless and optical technologies in the industrial-control universe that many experts have predicted. Vibren Technologies' Dave LeClair and Steve Hastings explain that the industrial control world still
The logic price wars News & Analysis 8/25/2003 Post a comment Despite tough market conditions and aggressive pricing tactics, suppliers of commodity standard logic remain committed to their products. A number of these companies appear well positioned to take advantage of the industry's next upswing as they continue to expand wafer manufacturing capabilities, shift to larger 6in. wafer sizes for cost advantages, and launch hundreds of new products targeting the growing wireless and handheld sectors.
Chip designers move back from bleeding edge News & Analysis 8/18/2003 Post a comment The Hot Chips conference has long been the showcase for processors that hit blistering speeds by way of advanced architecture, bleeding-edge processes and full-custom design. But new approaches are emerging based on unconventional semi-custom design methodologies that wring the same kind of speed from familiar architectures and ordinary processes. EE Times' Ron Wilson is on the scene.
PalmChip Bus Patent Threatens Most SoCs News & Analysis 8/5/2003 Post a comment A patent granted to PalmChip Corp. covers the techniques used to implement on-chip CPU bus structures in nearly
all modern system-on-chip (SoC) designs, the company said. CPU or system-interconnect intellectual-property vendors and most SoC design teams may be infringing the new patent, PalmChip warned.
PalmChip patent looms over SoC on-chip buses News & Analysis 8/4/2003 Post a comment A patent granted to PalmChip Corp. on July 29 covers the techniques used to implement on-chip CPU bus structures in nearly all modern system-on-chip designs, the company said. CPU or system-interconnect intellectual-property vendors and most SoC design teams may be infringing the new patent, PalmChip warned.
Flat June chip sales up 10% y-on-y, says SIA News & Analysis 8/4/2003 Post a comment Worldwide sales of semiconductors totalled $12.54 billion in June, 2003 up less than 1 percent from $12.50 billion in May 2003 and up 10.4 percent from $11.35 billion in June 2002, according to Global Sales Report (GSR) figures released by the Semiconductor Industry Association (SIA) on Monday (August 4, 2003).
Winbond narrows loss on falling sales News & Analysis 8/1/2003 Post a comment Winbond Electronics Corp. announced Friday (Augut 1, 2003) net sales for the 2003 second quarter of NT$6,228 million (about US$179 million), with the net loss totaling NT$791 million (about US$23 million).
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.