Texas Instruments presents 3-D DLP technology Product News 8/31/2007 Post a comment On the IFA consumer electronics show in Berlin, Texas instruments has introduced an enhancement to its DLP projection technology that enables TV sets to display three-dimensional images. Mitsubishi and Samsung are among the first OEMs to implement the technology in their products, TI said.
HDMI transmitter claims to be first to feature on-chip consumer electronic control support Product News 8/27/2007 Post a comment Analog Devices' ADV7520NK is a low-power HDMI(TM) v1.3 (High-Definition Multimedia Interface(TM)) transmitter for portable media and DVD players, video recorders, and other mobile multimedia devices capable of supporting high-definition audio and video content. The ADV7520NK is the first HDMI transmitter to incorporate a CEC (Consumer Electronic Control) buffer on-chip, which reduces component count, eases design complexity and speeds time to market for portable high-definition (HD) devices by e
TI rolls out pair of HDMI switches Product News 8/27/2007 Post a comment These switches connect either two or three digital video signals coming from devices such as game consoles, digital video switch boxes, set-top boxes or DVD players to a single HDTV display.
Compromise blends Ethernet, Fibre Channel News & Analysis 8/20/2007 Post a comment Rivals Brocade Communications and Cisco Systems agreed on a frame format for running Fibre Channel over Ethernet, clearing a major hurdle in the effort to develop a standard for the converged network and opening the door for work to begin on chips that implement the standard.
USB audio controller targets VoIP telephony Product News 8/19/2007 Post a comment Check out Winbond's latest addition to its audio controller line. The USB2.0-compabile device is aimed at Skype or other PC-based VoIP applications and integrates an 8051 MCU that enables feature-rich applications.
Sun advances work on novel chip interconnect News & Analysis 8/17/2007 Post a comment Sun Microsystems will demonstrate at the Hot Chips conference it has solved one of the key problems of its Proximity technology, a novel chip interconnect that someday could enable a new level of ultra-dense, high speed computer and communications systems.
Emulex, Qlogic tip 8G Fibre Channel products News & Analysis 8/9/2007 Post a comment Both Emulex Corp. and QLogic Corp. announced prototype chips and cards supporting the 8Gbit/second version of Fibre Channel expected to roll out in storage networks starting next year, doubling throughput of today's 4 Gbit/s nets.
Codec cranks for wireless stereo headsets Product News 8/1/2007 Post a comment Open Interface North America is rolling out a lossless audio codec that provides better performance than its competitors without requiring new hardware, targeted at enabling low cost, high quality Bluetooth stereo headsets.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.