High flex cables target demanding C-Track, robotic applications
Product News 8/31/2008 Post a comment
Designed for demanding continuous flexing applications, Weidmuller's SAI High Flex cables include PUR/PVC cables and halogen free PUR/PUR cables that are rated for C-track applications, as well as weld slag-resistant PUR cables designed to endure the twisting motion of robotic applications.
Multi-channel surveillance DVR design
Design How-To 8/29/2008 Post a comment
With the convergence of SoC and DSP, many processors now come with hardware accelerators, enabling DSPs to handle multiple channels of video compression on a single chip. How a multi-channel video encoder can be designed to leverage the extra cycles provided by hardware accelerators.
Industrial motors power chip market shows 9% annual growth
News & Analysis 8/25/2008 Post a comment
The market for power semiconductors in industrial motor drives is set to grow from $1 billion in 2007 to $1.3 billion in 2010, with the growth mainly driven by an increasing fraction of motors electronic drives, according to IMS Research (Wellingborough, England). Those figures imply a annual growth rate of about 9.1 percent.
Inside Canmore: Intel plugs x86 into TVs
Design How-To 8/21/2008 Post a comment
Intel Corp.'s first x86-based chip for consumer electronics the CE 3100, aka Canmore, represents an initiative that speaks to everything from Intel's growing system-on-chip capabilities to its drive toward Internet TV, a concept that has left many pioneers dead by the roadside.
Serial ATA doubles data rate to 6 Gbits/s
News & Analysis 8/18/2008 Post a comment
The serial ATA interface is doubling its maximum data rate to support transfers up to 6 Gbits/second, and the group marshalling the spec has also started a logo program to help ensure interoperability among the expanding group of hard, optical and solid-state drives using the link.
HyperTransport, PCI Express move forward
Design How-To 8/18/2008 Post a comment
The HyperTransport Consortium is giving a speed boost both to its chip-to-chip interconnect as well as a board-to-board version that has yet to gain market traction at a time when the PCI Special Interest Group is in the middle of its next big leap, the definition of a PCI Express 3.0 standard.
HDMI's Lip Sync and audio-video synchronization for broadcast and home video
Design How-To 8/15/2008 6 comments
HDMI 1.3 includes a Lip Sync feature to address the rising problem of poor audio-video synchronization resulting from numerous digital video processing steps in the television signal chain. But compliance is voluntary, and for a variety of reasons, CE devices and HDTVs may vary significantly in their synchronization performance.
Intel releases controller spec for USB 3.0
News & Analysis 8/14/2008 1 comment
Intel Corp. has released a draft version 0.9 of its Extensible Host Controller Interface for USB 3.0 also called SuperSpeed USB that aims to deliver data rates up to 300 Mbytes/second at the application level.
NetXen takes flexible approach to 10G Ethernet
News & Analysis 8/12/2008 Post a comment
NetXen Inc. will support three physical interfaces in the third-generation 10Gbit Ethernet controller it is rolling out, underlying the fragmented nature of cable support that has slowed the roll out of 10G technology.
Reliability of IEC 61000-4-2 ESD testing on components
Design How-To 8/10/2008 Post a comment
Testing using the IEC systems-level standard tends to provide ambiguous results for components; here's some info on understanding how to reconcile device-level checks with this spec, especially when it comes to the reliability of air discharge results.
Xilinx supports APIX interface
Product News 8/6/2008 Post a comment
The APIX interface for in-car graphics displays has found a new supporter: FPGA vendor Xilinx now has included APIX into the list of the interfaces supported by its Automotive Spartan 3E device.
Transceiver nudges 10G Ethernet forward
News & Analysis 8/5/2008 Post a comment
Startup Teranetics Inc. will nudge the emerging market for 10 Gbit Ethernet forward when it announces availability of the first dual-ported transceivers for copper, raising hopes for dense, lower cost switches that could drive market uptake.