Fairchild cuts delivery cycle times for logic, interface chips News & Analysis 9/27/2000 Post a comment SOUTH PORTLAND, Maine -- Fairchild Semiconductor International Corp. today said it has trimmed cycle times for deliveries of logic and interface products by 65% to 90 days. "New tools and processes will further reduce our cycle time on selected products to 75 days by the end of this year," promised W.T. Greer, senior vice president and general manager of Fairchild's Interface & Logic Group.
Marvell enters switch-chip market with DSP-embedded device News & Analysis 9/26/2000 Post a comment SUNNYVALE, Calif. -- Marvell Semiconductor Inc. here has entered the switch-chip business, rolling out an integrated solution for low-cost systems in Ethernet- and Fast Ethernet-based networks. Built around Marvell's digital signal processor (DSP) technology, the new 88E6050 is a five-port product that integrates several components on the same device.
LSI Logic to enter read-channel IC market following Datapath acquisition News & Analysis 9/22/2000 Post a comment MILPITAS, Calif. -- LSI Logic Inc. is preparing to enter the read-channel IC market for hard-disk drives as one major player--Texas Instruments Inc.--pulls out of the business. At this week's Diskcon trade show in San Jose, LSI Logic dislosed plans to use read-channel technology from recently acquired DataPath Systems Inc. to offer both standard products and customized ASICs for disk-drive applications, starting in the third quarter of 2001.
Macronix grows sales to $1 billion, inks pacts with Analog Devices, Nintendo News & Analysis 9/22/2000 Post a comment HSINCHU, Taiwan -- Closing in on $1 billion in sales this year, Taiwan's Macronix International Co. Ltd. is pushing to expand its chip portfolio by quietly forging separate deals with Analog Devices Inc. and Nintendo Ltd. Macronix is working on a deal with Analog Devices to develop system-on-a-chip products based digital signal processor technology and flash memory. The company is also expanding its ties with Japan's Nintendo, its largest chip customer, to create a new line of chips for a next-g
AMCC buys developer of I/O, transceivers for optical IC thrust News & Analysis 9/21/2000 Post a comment SAN DIEGO--Applied Micro Circuits Corp. (AMCC) here today announced it has acquired privately-held SiLutia of Fort Collins, Colo., a digital and mixed-signal company focused on high-speed, low-power I/O and transceiver designs for broadband communications. The acquisition is part of AMCC's efforts to expand its integration and serial backplane technologies for networking products.
TI sets $5 target for ROM-based Bluetooth chip set in high volumes News & Analysis 9/19/2000 Post a comment DALLAS--Texas Instruments Inc. here has introduced a new low-cost chip set for Bluetooth wireless connections using a new 0.18-micron baseband controller, which contains a fully integrated software stack in read-only memory. The ROM-based controller eliminates the need for a separate flash memory device in Bluetooth system designs.
TI ends read-channel chip efforts for hard-disk drives News & Analysis 9/19/2000 Post a comment SAN FRANCISCO -- Texas Instruments Inc. is pulling the plug on its read-channel IC development efforts for hard-disk drives and reassigning more than 100 analog design engineers from those projects to high-growth communications chip applications, said Tom Engibous, TI president and chairman, during a speech here today.
Infineon aims integrated line driver/analog frontend at ADSL ramp News & Analysis 9/18/2000 Post a comment MUNICH -- In a move to fill out its "one-to-shop" for digital subscriber line (DSL) systems, Infineon Technologies AG today introduced a single-chip line driver/analog frontend device for asymmetric DSL modems. The new 80-pin chip boosts integration and cuts power consumption in ADSL systems, which are beginning to grow in high volumes, said the Munich-based company.
Startup rivals Atheros, Radiata launch CMOS radio chips for 5-GHz wireless LANs News & Analysis 9/18/2000 Post a comment SUNNYVALE, Calif. -- The race to build a better radio-on-chip for high-speed wireless data networks is heating up. Atheros Communications Inc. here today unveiled what it claims is a true radio-on-a-chip, or "RoC", in a two-chip solution that uses standard CMOS processes, without the need for a separate power amplifier made with more expensive gallium-arsenide or silicon-germanium technologies. Atheros' announcement comes at the same time when rival-startup Radiata Inc. in San Jose, is disclosin
Atmel rolls out single-chip DAB processor for digital radios News & Analysis 9/15/2000 Post a comment HEILBRONN, Germany--Atmel Corp. today announced a single-chip baseband processor for Digital Audio Broadcasting (DAB) radios. The European unit of Atmel here said the new IC U2739M processor is the industry's first one-chip decoder, featuring full decoding rate capability.
S3, Via offer chip set for low-cost PCs based on AMD processors News & Analysis 9/15/2000 Post a comment SANTA CLARA, Calif.--S3 Inc. and Via Technologies Inc. today announced a fully integrated core logic chip set supporting the Athlon and Duron microprocessors from Advanced Micro Devices Inc. The ProSavage KM133 chip set, aimed at the "value PC" market segment, is coming from a joint venture being set up by S3 and Via in Taiwan.
Infineon claims to offer most secure chip-card controller News & Analysis 9/14/2000 Post a comment MUNICH -- Infineon Technologies AG here today announced certification of a new 16-bit chip-card controller as compliant with the most severe security criteria currently defined for ICs in smart-card applications. Infineon said its SLEC66CX320P controller received the E4 high-security rating from the Information Technology Security Evaluation Criteria (ITSEC) group.
Quake aims to shake up optical network arena with faster ICs News & Analysis 9/14/2000 Post a comment OTTAWA -- Quake Technologies Inc. here today announced plans to enter the market for optical networking ICs with the development of physical-layer devices for high-speed communications applications. The five-month-old company said it will offer mixed-signal ICs capable of supporting 10-gigabit-per-second and higher-speed networks based on Ethernet, Infininband, Fibre Channel and Sonet/SDH applications.
How Conexant's split up aims to make two huge chip companies News & Analysis 9/14/2000 Post a comment NEWPORT BEACH, Calif. -- Analysts believe Conexant Systems Inc.'s bold new plan to split itself into two separate chip companies is a daring, innovative move to accelerate growth in the communications IC business. The company here on Wednesday announced it will divide itself next year into two companies, which will share some resources under a multi-year alliance, to serve Internet infrastructure and "personal networking" applications.
Dallas Semi packs three potentiometers on CPU supervisor News & Analysis 9/11/2000 Post a comment DALLAS -- Dallas Semiconductor Corp. here today expanded its line of digital control devices for gigabit optical transceivers with the launch of the DS1846 NV device, which integrates three linear taper potentiometers, nonvolatile memory, and a central-processor supervisor in reduced TSSOP packaging.
IDT moves into Internet protocol co-processors, ships units to Cisco News & Analysis 9/11/2000 Post a comment SANTA CLARA, Calif.-- Integrated Device Technology Inc. today announced its entry into the Internet protocol (IP) co-processor business with a new device that combines content-addressable memory (CAM) technology with specialized logic and high-speed control interface circuits. IDT's first product is a customized IP co-processor, which will be shipped to Cisco Systems Inc. for use in the company's Catalyst series of multi-layer switches.
National, Proxim to develop home-networking wireless chips News & Analysis 9/7/2000 Post a comment SANTA CLARA, Calif. -- National Semiconductor Corp. here today jumped in a new wireless-chip market, announcing a deal with Proxim Inc. to co-develop ICs and other products for an emerging home-networking standard.
The two companies will combine their expertise to co-develop products based on the HomeRF standard , which enables systems to obtain wireless data over a 2.4-GHz frequency-hopping, spread-spectrum technology.
Infineon rolls out samples of tunable Bluetooth chip set News & Analysis 9/7/2000 Post a comment MUNICH -- Infineon Technologies AG here today announced sampling of its first Bluetooth chip set--called BlueMoon I--which includes an integrated controller with baseband, link manager and host interface functions, and a separate radio-frequency transceiver chip. The solution is fully software tunable and adaptable to any modifications made to the Bluetooth specification, said Infineon managers.
Lucent, PacketVideo to optimize software for multimedia wireless ICs News & Analysis 9/7/2000 Post a comment ALLENTOWN, Pa.--Lucent Technologies Inc.'s Microelectronics Group here and PacketVideo Corp. of San Diego today announced plans to jointly optimize products for next-generation devices used in multimedia wireless products. PacketVideo's wireless media software will be optimized for higher performance and low-power consumption when running on Lucent chip sets, including DSP platforms based on StarCore digital signal processors.
ESS licenses Fast Ethernet technology from Davicom in Taiwan News & Analysis 9/7/2000 Post a comment FREMONT, Calif. -- ESS Technology Inc. today announced it has licensed Fast Ethernet technology from Davicom Semiconductor Inc. of Taiwan for integration in ICs for broadband communications and Internet appliance products. The licensed technology includes 10/100-megabit-per-second media access control (MAC) and physical layer (PHY) transceiver functions.
Microsemi to expand fab for GaAs, other compound semiconductors News & Analysis 9/6/2000 Post a comment GARDEN GROVE, Calif.-- Microsemi Corp. today announced it will invest $75-to-$100 million in a major expansion of an 4-inch wafer fab here to increase production of compound semiconductors for power management, radio-frequency, microwave, and optoelectronics applications. The expansion to increase production of devices with gallium-arsenide (GaAs), indium gallium phosphide (InGaP), heterojunction bipolar transistors (HBT), InGaAs, and other materials and processes, said the company.
Samsung targets $30 billion in semiconductor sales by 2005 News & Analysis 9/6/2000 Post a comment SEOUL -- Samsung Electronics Co. Ltd. today set an aggressive target of increasing its semiconductor sales to $30 billion by 2005--triple the chip revenues expected by the company this year. The sales target includes IC products as well as liquid crystal displays (LCDs) produced by Samsung. To reach this goal, the Korean chip maker said it will continue to emphasize memory products, and it has organized its System LSI business operation around eight strategic product areas with the target of bec
Motorola sets up chip R&D center in Scotland News & Analysis 9/5/2000 Post a comment SCHAUMBURG, Ill. -- Motorola Inc. here today announced that it has chosen Scotland as the location for a major semiconductor research and development center.
The $30 million center, to be located in the Alba Campus in Livingston, will focus on embedded software and systems-on-a-chip design technology. The site will create up to 550 new jobs by 2005.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.