Infineon to cut capital spending in half during next fiscal year News & Analysis 9/26/2001 Post a comment MUNICH -- Infineon Technologies AG today described details of a previously announced initiative to save over 1 billion euros ($920 million) in costs from its semiconductor operations, including new plans to cut capital spending in half during the 2002 fiscal year, which begins Oct. 1.
Canada's IceFyre aims three-engine modem IC at 5-GHz wireless LANs News & Analysis 9/24/2001 Post a comment OTTAWA, Ontario -- Seven-month-old IceFyre Semiconductor Inc. here today disclosed plans to introduce the industry's first single-chip modem solution for 5-GHz wireless local area networks using a proprietary architecture of three signal-computational engines to simplify waveform processing and lower power consumption.
Via accuses Intel of violating patent for storage of formats in MPUs News & Analysis 9/20/2001 Post a comment TAIPEI, Taiwan -- Via Technologies Inc. today stepped up its legal counterattack against Intel Corp. by providing more details about a U.S. patent lawsuit filed against the microprocessor giant for infringement of patented MPU technology. Last week, Via said it has filed a counter suit against Intel, which is suing the Taiwan chip maker for infringement of its Pentium 4 technology.
SiGe Semi uses ASAT's chip-carrier to reduce size of Bluetooth amplifier News & Analysis 9/18/2001 Post a comment OTTAWA -- Hong Kong-based ASAT Holdings Ltd. today announced it will supply leadless plastic chip-carrier (LPCC) packages to SiGe Semiconductor Inc. here for Class 1 Bluetooth power amplifiers. The 3-by-1.6-mm form factor is the industry's smallest size for a fully encapsulated Class 1 Bluetooth power amplifiers, said the two companies.
Infrared Communication Controller for Wireless Communications Design How-To 9/18/2001 Post a comment Authors from Agilent Technologies describe an infrared transceiver, supporting IrDA standards, for communicating between computers and mobile devices such as PDAs and mobile phones. The transceiver operates in medium infrared (MIR) mode, using directed half-duplex serial infrared communication links.
Motorola unleashes its first complete 2.5G cell-phone chip solution News & Analysis 9/17/2001 Post a comment AUSTIN, Tex. -- In an effort to redefine its semiconductor business, Motorola Inc. today publicly disclosed details of its first complete solution for 2.5-generation cellular phones, including a highly integrated four-component chip set that reduces electronics parts count in 2.5G handsets from more than 250 devices (passives and active circuits) to as low as 125.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.