RF components to see few benefits from basestation growth News & Analysis 9/30/2008 Post a comment The global market for RF components for cellular basestations will remain flat at $1.1 billion through 2013 according to market research group Strategy Analytics. This despite the fact that actual shipments of basestations are forecast to grow to 13.4 million units in 2013, a CAAGR (compound annual average growth rate) of nearly 70 percent.
Evolution: 20 years of switching fabric Design How-To 9/29/2008 Post a comment Into a look at the evolution of switching fabrics, this article discusses the shortcomings of each previous fabric genration and the evolution of dominant standards and design longevity.
DS2 demos 280-Mbps powerline communications News & Analysis 9/29/2008 Post a comment Diseno de Sistemas en Silicio SA (Valencia, Spain), also known as DS2, has demonstrated technology being developed for 400-Mbit per second powerline communications, at the Broadband World Forum, which opened in Brussels, Monday (Sept. 29).
Underwater helicopter surfaces News & Analysis 9/29/2008 1 comment Undersea robots have until now operated like fixed-wing aircraft, requiring motion to maneuver. Massachusetts Institute of Technology researchers now say they have created the helicopter-of-the-sea, the Odyssey IV.
Opinion: Three ways Wall Street hurts tech News & Analysis 9/25/2008 1 comment The debacle on Wall Street will cool a hot beta market once hungry for the latest high end computer and communications gear, tighten a source of financing that has helped companies soldier through tough times and create a difficult economic climate that will color all markets and initiatives.
SoC 'will shatter' $100 barrier for WiMax femtocells Product News 9/22/2008 Post a comment Fabless wireless chip designer DesignArt Networks (Raanana, Israel) has introduced the second chip in its SoC "platform architecture", a part targeted at WiMAX femtocells. The company says the single-chip femtocell SoC, dubbed the the DAN2200, will allow equipment vendors to "shatter" the unit price barrier of femtocells to below the elusive $100.
IC Insights cuts '08 forecast; sees ASPs firming News & Analysis 9/18/2008 Post a comment Market research firm IC Insights has cut its semiconductor industry revenue forecast for 2008 by $6 billion, but believes that long-term trends will support pricing stabilization that will enable the industry to achieve a compound annual growth rate of 10.6 percent between 2007 and 2012.
Cisco beefs up virtualization products News & Analysis 9/16/2008 Post a comment Cisco Systems rolled out a set of boards, systems and software to upgrade its support for virtualization in storage-area networks along with support for 8 Gbit/second Fibre Channel switching.
Broadcom DTV SoCs target connected home Product News 9/16/2008 Post a comment Broadcom introduced a pair of digital system-on-chip devices for the U.S. digital television market that include a multi-format decoder, Ethernet network connectivity, a 3D graphical user interface, and 3D color management.
Zoran introduces pay satellite and cable STB processors Product News 9/14/2008 Post a comment The SupraTV 260 family of processors is optimized for pay cable and satellite set-top boxes using standard definition MPEG-2. Advanced features include: 10/100 Ethernet MAC, digital video recording hardware and software including picture-in-picture based on USB 2.0 hard drives, MPEG-4 Advanced Simple Profile and JPEG hardware decoding.
Ceva lines up licenses for portable multimedia Product News 9/9/2008 Post a comment DSP cores licensor Ceva, Inc. has linked with French design and manufacturing services group TES Electronic Solutions (TES), to enable 2D/3D graphics applications on Ceva's MM2000 portable multimedia engine using TES' eVRU (embedded Vector Rendering Unit) technology.
Startup details video-grade Wi-Fi chip Product News 9/8/2008 Post a comment Startup Celeno Communications Ltd. is providing the first details of its 5 GHz Wi-Fi chip that it claims can manage up to four simultaneous high definition streams over 50 meters though multiple walls and floors without losing packets.
UWB to ship in wireless HD-video role Product News 9/4/2008 1 comment UWB isn't about to distribute video around a home via a wireless link, but it may finally offer an alternative to the HDMI cable. While the wireless alternative can enhance functionality compared to a cable, in terms of inputs and distance between source and destination, the technology remains very expensive for now.
Analyst: More 3G baseband consolidation on the line News & Analysis 9/4/2008 Post a comment There may be further consolidation amongst suppliers of UMTS/HSPA baseband chips but the possibilities are limited, with Infineon Technologies AG and Icera Inc. now the only independent sources for the parts (other than Qualcomm), following the pending merger between NXP Semiconductors/STMicroelectronics and Ericsson Mobile Platforms (EMP), according to market research analyst Will Strauss, president of Forward Concepts.
Gartner lowers 2008 IC forecast News & Analysis 9/3/2008 Post a comment Market research firm Gartner has revised its 2008 and 2009 semiconductor forecasts downward, saying macroeconomic trends, the collapse of the flash memory market and disturbing reports of slowing revenue growth from the industry's No. 1 foundry are weighing on the sector even as individual chip markets remain strong.
IBM, EMC storage gurus debate future of flash Product News 9/3/2008 Post a comment In a candid online exchange, storage gurus from IBM Corp. and EMC Corp. agreed solid-state drives will rewrite the rules for system storage, but took significantly different views on how to implement solid state disks in servers.
Ultrawideband chip debuts at tough time for wireless USB Product News 9/2/2008 Post a comment Staccato Communications aims to escape a predicted shakeout in ultrawideband chips for wireless USB with its Ripcord2 that uses 65 nm process technology to hit size, power and cost levels it hopes will attract the kinds of volume uses that have eluded the technology to date.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.