EC report discusses increased support for electronics News & Analysis 9/30/2009 Post a comment The European Commission has identified nanotechnology, electronics and photonics as key enabling technologies (KETs) that are of strategic interest to the European Union. Advanced materials and biotechnology are also listed in a report that goes on to discuss ways in which greater support should be offered to these disciplines.
ADI to upstage Silicon Image with new HDMI 1.4 IC Product News 9/29/2009 5 comments Some new AV receivers or sound bars -- scheduled for Christmas launch -- may come with HDMI 1.4 features including audio return channel and 3D processing, but they will be powered by Analog Devices' new HDMI 1.4 transceiver IC, rather than those by Silicon Image.
Analysis: What's behind Taiwan's decision to ease investment rules? News & Analysis 9/29/2009 Post a comment Comments reported by local media from Taiwan's economic minister Shih Yen-shiang on the easing investment restrictions with regard to mainland China were enough to send the share prices of Taiwan Semiconductor Manufacturing Co. and United Microelectronics Corp. shooting upwards, but the devil could yet be in the detail.
Powerful problems seen for mobile handsets News & Analysis 9/29/2009 Post a comment Emerging solutions for bridging the power gap required by a growing number of handset features and available handset battery capacity are unlikely to solve the increasing and worrying problem, according to market trackers at IMS Research.
TSMC, UMC boosted by lifting of Taiwan investment ban News & Analysis 9/29/2009 Post a comment The Taiwan government is set to lift a long-running ban on investment by Taiwanese companies in Chinese counterparts, according to reports. The result is likely to benefit foundry chipmakers Taiwan Semiconductor Manufacturing Co. Ltd. and United Microelectronics Corp.
Drive makers at crossroads over next generation News & Analysis 9/29/2009 Post a comment Hard disk makers will have to decide in the next year which of two major paths they will take to tomorrow's drives that will pack a terabit or more per square inch, according to a leading consultant—heat-assisted recording or patterned media.
SMIC licenses non-volatile memory from Virage, Kilopass News & Analysis 9/25/2009 Post a comment Chinese foundry Semiconductor Manufacturing International Corp. (Shanghai, China) has said it is working with two non-volatile memory IP providers for future applications and process nodes; Virage Logic Corp. (Fremont, Calif.) and Kilopass Technology Inc. (Santa Clara, Calif.)
Fast interfaces overlap at IDF News & Analysis 9/24/2009 1 comment The buzz in fast interconnects at Intel Developer Forum was supposed to be around SuperSpeed USB, the 3.0 version of the omnipresent interface coming to systems in 2010, but somewhere on the road to San Francisco's Moscone Center, Intel decided to roll out Light Peak, the next next big thing in fast interconnects.
Premier Farnell to offer EDA to get closer to engineers News & Analysis 9/24/2009 Post a comment Component distributor Premier Farnell plc (Leeds, England) wants to become a vendor of PCB layout software, including a free-of-charge lightweight edition. This should allow the company to get closer to engineers and to be able to sell chips direct to them from the design tool as it is in use.
Standards bodies seek common ground for powerline nets News & Analysis 9/24/2009 Post a comment A senior director of DS2, the Valencia, Spain based specialist in silicon for broadband power line gear, has warned of confusion and frustration in the industry and amongst consumers if forthcoming votes on a standard for the technology fail to resolve the problem of a fragmented powerline networking industry.
Update: Intel debuts optical link for PCs News & Analysis 9/23/2009 2 comments Intel Corp. wants to consolidate all the wired connections on your PC to a single 10 Gbit/second optical cable it calls Light Peak that it plans to support in silicon sometime next year working with Sony Corp.'s Viao group and other unnamed partners.
Samsung semis chief sees signs of recovery News & Analysis 9/23/2009 Post a comment Samsung Electronics is ramping up production of DDR3 memories and shifting manufacturing to a 40-nm process to meet what it anticipates will be increased demand as companies start rebuilding inventories.
Melexis keeps cutting jobs as it raises guidance News & Analysis 9/23/2009 Post a comment Melexis Microelectronic Integrated Systems NV (Ieper, Belgium), a supplier of automotive ICs and subsystems, has said it now expects 2009 sales to be towards the top of the range given in July, of between 118 million euro (about $175 million) and 123 million euro (about $182 million). Nonetheless the company has announced job cuts at a newly-opened facility in Erfurt, Germany.
AT&T to unleash femtocell for 3G News & Analysis 9/22/2009 1 comment AT&T's long-awaited entry into the femtocells market is believed to rely on home basestations supplied by ip.access (Cambridge, England), powered by silicon from picoChip (Bath, England) and Cisco acting as systems integrator.
Medical electronics seeks role in health care debate News & Analysis 9/22/2009 1 comment The medical electronics sector is under pressure to prove its value in the debate over the high costs of health care, believing its biggest contribution could be developing devices and networks that drive a shift to lower cost care at home, but market hurdles have stymied early efforts.
40Gb Ethernet set to be major feature at ECOC Product News 9/21/2009 Post a comment 40GbE transceivers and other parts, including testers, are set to be a major talking point at both the exhibitor stands and conferences at this week's European Conference and Exhibition on Optical Communication (ECOC) in Vienna, Austria.
Long, bumpy transition seen for USB 3.0 News & Analysis 9/21/2009 1 comment The Intel Developer Forum is expected to generate buzz around SuperSpeed USB this week, but the transition to the 5 GHz interface may be slower and bumpier than many would hope due to cost, power and support issues.
DisplayLink raises a further $8 million News & Analysis 9/16/2009 Post a comment DisplayLink Corp., the start-up developing semiconductors and software for network display applications, has raised $8 million in fourth-round funding, according to a regulatory filing.
Ethernet caught in demand/cost squeeze News & Analysis 9/16/2009 1 comment In one of the central ironies of the Internet era, popular Web sites and service providers are driving bandwidth requirements through the roof while pushing the costs of systems through the floor, according to presentations from Facebook engineers and others at a meeting of the Ethernet Alliance.
SiPort brings HD radio to Micosoft's Zune News & Analysis 9/15/2009 Post a comment Fabless chip group SiPort (Santa Clara, Calif.) is trying to give a much needed boost to HD radio in the U.S., and has persuaded Microsoft to include it in the latest version of the software giant’s Zune portable media player, which goes on sale this week.
Verifying next-generation system-on-chip designs Design How-To 9/14/2009 Post a comment The first EETimes System on Chip Virtual Conference this week looked at next-generation SoC design, with a special session on verification, a topic that has stymied the best designers at a time of rapid time to market, multiple heterogeneous IP blocks and ever-more-complex designs. This series of features and courses will set the stage for that session, so use them to catch up and join in what is sure to be a fascinating discussion.
Element CXI targets 4G apps with computing array News & Analysis 9/14/2009 Post a comment Element CXI, the Milpitas, California based fabless group developing reconfigurable processors, is launching at this week's 4G World Forum in Chicago its nGEN Elemental Computing Array (ECA) platform targeting multi-mode and multi-band wireless applications.
Cypress expands PSoC family for sophisticated applications Product News 9/14/2009 Post a comment Cypress Semiconductor Corp. expands the family of its Programmable System-on-Chips (PSoCs) towards the high end. With the move, the company seeks to gain acceptance in power-hungry embedded applications such as industrial embedded controls, automotive in-cabin devices, digital entertainment and portable medical implementations.
ST ref platform targets hybrid set-top boxes Product News 9/10/2009 Post a comment STMicroelectronics is demonstrating at this week's IBC in Amsterdam a reference platform for set-top boxes that will be able to receive interactive digital television services via broadcast or broadband connections.
EC set to decide on long-running Qualcomm probe News & Analysis 9/10/2009 Post a comment Antitrust regulators in the European Commission are understood to be considering setting up a special panel to unravel the long-drawn out case pending against wireless chip group Qualcomm concerning patent royalty payments.
picoChip targets small-cell LTE femto designs News & Analysis 9/10/2009 Post a comment Wireless chip design group picoChip (Bath, England) is continuing to extend its range of development systems for the emerging femtocells market, with a hardware and software platform targeting "small cell" LTE basestations.
NXP integrates NDS access software on STB chip Product News 9/10/2009 Post a comment Dutch chip company NXP BV (Eindhoven, The Netherlands), has announced the integration of NDS MediaHighway set-top box software onto the CX2450x chip for high-definition set top boxes. The integration supports digital pay-TV services and will be demonstrated at IBC 2009.
TI bumps up Q3 guidance News & Analysis 9/9/2009 Post a comment Texas Instruments said the company's revenue for the third quarter is expected to be in the range of $2.73 billion to $2.87 billion, an increase from the firm's prior target of $2.5 billion to $2.8 billion.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.