Western Digital Claims First 64-layer 3D NAND Memory News & Analysis 7/27/2016 2 comments Disk drive vendor Western Digital Corp. has claimed that it -- with Toshiba Corp. -- has developed the world's first 64-layer 3D NAND memory and that it is in pilot production at joint-venture production facilities at Yokkaichi, Japan.
Intel a Bear on PCs, a Bull on Flash News & Analysis 7/20/2016 1 comment Amid second-quarter results, Intel said it expects a double-digit PC decline this year but sees flash picking up as it continues a 14nm rollout and starts a 10nm ramp.
AMD Details Next-Gen APUs News & Analysis 6/8/2016 4 comments AMD still believes in PCs and recently announced its seventh generation of A-series processors targeted for that market. Code-named Bristol Ridge and Stony Ridge, the processors are designed to boost productivity, enhance multimedia, and improve energy efficiency.
Why ReRAM/RRAM Is Like Lightning Blog 6/6/2016 2 comments What must be considered is the possibility that the filaments-in-waiting have another role to control and keep a constant current density in the switching region.
Former Intel Exec Perlmutter to Chair ReRam Startup News & Analysis 5/4/2016 5 comments David Perlmutter, a former executive vice president and chief product officer at Intel, has agreed to be non-executive chairman of Weebit Nano, a startup formed to commercialize silicon dioxide resistive RAM technology.
Intel Reorg Shows Clouds Ahead News & Analysis 4/20/2016 11 comments Intel's $1.2 billion plan to cut 12,000 employees amid an accelerating PC decline got a mixed reception from market watchers noting issues in memory, IoT and data center markets.
Sayonara, Japan Semiconductor Inc. News & Analysis 4/12/2016 20 comments The Japanese semiconductor industry’s downfall is undeniable. EE Times went back to Japan and explored what remains of Japanese chip vendors, how Japan Inc. has crumbled and if we grade recent restructuring programs, who comes out on top.
China Facing Long-Term Memory Gap News & Analysis 4/8/2016 1 comment China, Inc.’s rush to build its own memory business is real. But just how — and how soon — remains a complete mystery. But XMC claims its first 3D NAND flash memory test chip “passed the electrical verification” a year ago.
10nm DDR4 DRAM Could Defy Moore News & Analysis 4/7/2016 5 comments Samsung said it has overcome scaling challenges to address scaling challenges that were previously thought to mean the end of Moore's Law.
Google Preps for IBM, ARM Shift Slideshow 4/7/2016 3 comments Google has ported much of its data center code to IBM Power and ARM server architectures and will co-design a server on the upcoming Power9 chip which will sport 24 cores and a new interconnect.
Flash Rides HPE’s Memory Bus News & Analysis 3/29/2016 2 comments Hewlett Packard Enterprise is shipping NVDIMM-N modules, the first in a new line of persistent memory cards analysts say will bolster servers.
3D NAND Fab Seen as Milestone for China News & Analysis 3/22/2016 3 comments Breaking of ground for construction of XMC fab that will eventually produce 200,000 wafers per month signals new phase in development of China's domestic semiconductor manufacturing industry, says analyst.
Facebook Likes Intel's 3D XPoint Slideshow 3/10/2016 7 comments Facebook endorsed Intel’s 3D XPoint memories and got Google to join its Open Compute Project at its annual event that included new processors from Intel and networking code from Microsoft.
Micron, Samsung in Flash Battle News & Analysis 2/5/2016 15 comments Micron described a 768Gbit 3D NAND flash chip that is twice as dense as Samsung’s current vertical NAND, but it’s not clear it will come to market.
16 Insights on ICs Slideshow 1/29/2016 5 comments At a talk in Silicon Valley semiconductor market guru Bill McClean predicted 4% growth in 2016 for the consolidating industry, but said China is a wild card.
3D XPoint Steps Into the Light News & Analysis 1/14/2016 10 comments With its 3D XPoint memories moving into the fab, an IM Flash executive revealed details of the technology and challenges making the devices.
Cypress Unveils Traveo OTA Update MCUs News & Analysis 1/12/2016 Post a comment Cypress Semiconductor Corp. rolled out the first series of Traveo MCUs with embedded flash on the 40nm process technology node, designed to enable mid-range to mass-market cars to implement over-the-air software updates.
AMD Tips Next Graphics Chip News & Analysis 1/4/2016 1 comment Advanced Micro Devices said its next-generation graphics processor, Polaris, will deliver nearly twice the performance/Watt of today’s Nvidia GPUs.
Toshiba Reorg Cuts Consumer Unit News & Analysis 12/21/2015 2 comments Toshiba will exit an ailing consumer notebook market but hang on to its profitable NAND flash business in a reorganization that includes 6,800 layoffs.
HPE Melds Servers, Storage News & Analysis 12/1/2015 1 comment Hewlett Packard Enterprise announced Synergy, a server blade system with integrated software to ease the job of managing jobs across arrays of processors and hard and solid-state disks.
Why Japan Hasn't Led IoT News & Analysis 11/19/2015 8 comments Germany has Industry 4.0. The U.S. is running with Industrial Internet Consortium. Where is Japan? Ken Sakamura, creator of TRON, Japan’s home-grown RTOS, blasted Japanese embedded designers for their inability to lead the Internet of Things on the world stage.
Parrot Unveils Bebop 2 Drone News & Analysis 11/17/2015 1 comment French drone company Parrot unveiled its next-generation consumer drone, Bebop 2. The 500 gram, four propeller device is designed to take photos and video with 25 minutes of fly time.
A Look at Metal eFuses Blog 11/8/2015 4 comments TechInsights reverse engineers chips to understand how they are made and in some cases why certain structures are the way they are. This article examines two electrically blown fuse structures (eFuse) used in metal gate logic processes. This first eFuse structure that we look at is made by Intel and the second by TSMC.
Further Details of FinFET ReRAM Released News & Analysis 10/22/2015 1 comment Further details have been released of the resistive RAM made using a 16nm logic FinFET manufacturing process. A full paper is due to be presented on a 1-kbit memory array of such devices at this year's International Electron Devices Meeting (IEDM) coming up in December.
Dell Preps Semi-Custom Servers News & Analysis 10/22/2015 Post a comment Dell unveiled new servers for the data center market and enterprise at its annual DellWorld conference, targeting custom and semi-custom network infrastructure and storage for tier two cloud providers and others.
Intel Rides Servers, Flash in Q3 News & Analysis 10/13/2015 2 comments Intel today reported third quarter revenue of $14.5 billion, a 10% increase from the second quarter of 2015, and flat year-over-year. Growth in its data center, non-volatile memory, and Internet of Things businesses offset lower client revenue.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.