7nm SRAMs, 10nm SoC at ISSCC
News & Analysis 11/14/2016 3 comments
The annual International Solid State Circuits Conference will showcase advanced work on 7nm SRAMs, a 10nm SoC and an efficient AI SoC.
Supercomputer Aims for Exascale
News & Analysis 11/10/2016 Post a comment
U.S. researchers announced $34 million in software projects as part of their plan to build exascale supercomputers that may include new memory and programming technologies.
Microsoft Speeds Open Hardware
News & Analysis 11/1/2016 2 comments
Microsoft revealed early specs of ts next-generation data center server and said work on open hardware needs to become as fast and flexible as open source software.
IBM Weaves New 25G Link
News & Analysis 10/14/2016 5 comments
IBM announced OpenCAPI, a 25G interconnect for processors, accelerators and memories with backing from seven partners.
Amazon Echo & How It Resonates
News & Analysis 9/22/2016 4 comments
Amazon’s Echo-like smart speakers are on the rise. The voice interface is emerging as one of the most natural interface to control IoT devices. Analysts expect the voice interface in home automation hubs, TVs, set-top boxes, HVAC/environmental control hubs and more.
Persistent Memory Needs Apps
News & Analysis 9/20/2016 6 comments
A researcher from Hewlett Packard Enterprise called for apps that use persistent memory on servers although the chips are still more than a year away.
14 Views from the Flash Summit
Slideshow 8/12/2016 11 comments
The Flash Memory Summit showed shifts NAND flash and other persistent memories including 3D XPoint are making in arrays, accelerators and solid-state drives.
DRAMs to drag ICs to -2% in 2016
News & Analysis 8/11/2016 Post a comment
The latest version of The McClean Report projects a 19% decline in DRAMs due to falling PC and tablet sales, dragging total IC revenues to a 2% contraction in 2016.
Samsung Debuts 3D XPoint Killer
News & Analysis 8/11/2016 5 comments
Samsung announced Z-NAND, a 3D flash variant it says will have similar performance and lower cost in solid-state drives than Micron Quantx SSDs.
Micron demos 3D XPoint in drives
News & Analysis 8/9/2016 2 comments
Micron showed prototype solid-state drives using its 3D XPoint memories with data for their performance as Toshiba talked about NAND flash advances.
Western Digital Claims First 64-layer 3D NAND Memory
News & Analysis 7/27/2016 6 comments
Disk drive vendor Western Digital Corp. has claimed that it -- with Toshiba Corp. -- has developed the world's first 64-layer 3D NAND memory and that it is in pilot production at joint-venture production facilities at Yokkaichi, Japan.
Intel a Bear on PCs, a Bull on Flash
News & Analysis 7/20/2016 1 comment
Amid second-quarter results, Intel said it expects a double-digit PC decline this year but sees flash picking up as it continues a 14nm rollout and starts a 10nm ramp.
AMD Details Next-Gen APUs
News & Analysis 6/8/2016 4 comments
AMD still believes in PCs and recently announced its seventh generation of A-series processors targeted for that market. Code-named Bristol Ridge and Stony Ridge, the processors are designed to boost productivity, enhance multimedia, and improve energy efficiency.
Why ReRAM/RRAM Is Like Lightning
Blog 6/6/2016 2 comments
What must be considered is the possibility that the filaments-in-waiting have another role to control and keep a constant current density in the switching region.
Former Intel Exec Perlmutter to Chair ReRam Startup
News & Analysis 5/4/2016 5 comments
David Perlmutter, a former executive vice president and chief product officer at Intel, has agreed to be non-executive chairman of Weebit Nano, a startup formed to commercialize silicon dioxide resistive RAM technology.
Intel Reorg Shows Clouds Ahead
News & Analysis 4/20/2016 11 comments
Intel's $1.2 billion plan to cut 12,000 employees amid an accelerating PC decline got a mixed reception from market watchers noting issues in memory, IoT and data center markets.
Facebook Roadmap Eyes AR/VR, Connectivity
News & Analysis 4/13/2016 2 comments
Facebook's CEO said the company will target three major areas in the next 10 years: connecting everyone to the Internet, artificial intelligence, and virtual and augmented reality.
Sayonara, Japan Semiconductor Inc.
News & Analysis 4/12/2016 20 comments
The Japanese semiconductor industry’s downfall is undeniable. EE Times went back to Japan and explored what remains of Japanese chip vendors, how Japan Inc. has crumbled and if we grade recent restructuring programs, who comes out on top.
China Facing Long-Term Memory Gap
News & Analysis 4/8/2016 1 comment
China, Inc.’s rush to build its own memory business is real. But just how — and how soon — remains a complete mystery. But XMC claims its first 3D NAND flash memory test chip “passed the electrical verification” a year ago.
10nm DDR4 DRAM Could Defy Moore
News & Analysis 4/7/2016 5 comments
Samsung said it has overcome scaling challenges to address scaling challenges that were previously thought to mean the end of Moore's Law.
Google Preps for IBM, ARM Shift
Slideshow 4/7/2016 3 comments
Google has ported much of its data center code to IBM Power and ARM server architectures and will co-design a server on the upcoming Power9 chip which will sport 24 cores and a new interconnect.
Flash Rides HPE’s Memory Bus
News & Analysis 3/29/2016 2 comments
Hewlett Packard Enterprise is shipping NVDIMM-N modules, the first in a new line of persistent memory cards analysts say will bolster servers.
3D NAND Fab Seen as Milestone for China
News & Analysis 3/22/2016 4 comments
Breaking of ground for construction of XMC fab that will eventually produce 200,000 wafers per month signals new phase in development of China's domestic semiconductor manufacturing industry, says analyst.
Facebook Likes Intel's 3D XPoint
Slideshow 3/10/2016 7 comments
Facebook endorsed Intel’s 3D XPoint memories and got Google to join its Open Compute Project at its annual event that included new processors from Intel and networking code from Microsoft.
Micron, Samsung in Flash Battle
News & Analysis 2/5/2016 15 comments
Micron described a 768Gbit 3D NAND flash chip that is twice as dense as Samsung’s current vertical NAND, but it’s not clear it will come to market.
16 Insights on ICs
Slideshow 1/29/2016 5 comments
At a talk in Silicon Valley semiconductor market guru Bill McClean predicted 4% growth in 2016 for the consolidating industry, but said China is a wild card.
Chip Stacks Take New Tacks
News & Analysis 1/25/2016 4 comments
Chip stacks will be key to advances in semiconductors, but in logic TSVs are waning while fan-out techniques and SiPs are on the rise.
3D XPoint Steps Into the Light
News & Analysis 1/14/2016 10 comments
With its 3D XPoint memories moving into the fab, an IM Flash executive revealed details of the technology and challenges making the devices.
Cypress Unveils Traveo OTA Update MCUs
News & Analysis 1/12/2016 Post a comment
Cypress Semiconductor Corp. rolled out the first series of Traveo MCUs with embedded flash on the 40nm process technology node, designed to enable mid-range to mass-market cars to implement over-the-air software updates.