Future of PCM: Optoelectronic? Blog 7/22/2014 2 comments Work by a team at the University of Oxford and the University of Exeter may well become recognized as the first steps on the road to a new and bright optoelectronic future for phase-change memory materials.
NAND Suit: Toshiba Seeks $1.1B From SK Hynix News & Analysis 7/21/2014 4 comments South Korea's SK Hynix Inc. disclosed in a regulatory filing that Toshiba Corp. is seeking $1.1 billion in damages over the suspected theft of data related to NAND flash memory chip technology.
Testing ReRAM Structures Blog 7/14/2014 2 comments This article by Peter J. Hulbert addresses issues related to characterization and forming, as well as endurance testing for 1R ReRAM structures.
MCUs, Memory Balance Security, Performance News & Analysis 7/10/2014 1 comment The need to secure devices at the MCU or SSD level is becoming more pressing thanks to BYOD and the Internet of Things, but perceptions linger that encryption degrades device performance.
China's SMIC-Qualcomm 28-nm Deal: Why Now? News & Analysis 7/3/2014 16 comments SMIC and Qualcomm revealed their collaboration on 28-nm wafer production in China. Since China's antitrust investigation against Qualcomm, speculation abounds that Chinese are probing ways to coerce Qualcomm into collaborating with their electronics industry.
Crossbar RRAM Aims for 1TB Blog 7/1/2014 7 comments Crossbar demonstrates pre-production 1 MB arrays using its new 1 transistor/n resistor's non-volatile RRAM, addressing “sneak path” current issues to enable high-density memory.
Magnetic RAM Remains Niche Memory – for Now News & Analysis 6/30/2014 4 comments One report is bullish on MRAM's growth prospects and its potential to replace DRAM and SRAM, while the primary vendor of the nonvolatile memory still sees plenty of short-term opportunity in niche applications, including enterprise storage.
Micron 3D Memory Supercharges Xeon Phi News & Analysis 6/23/2014 8 comments Analysts have speculated wildly about the technical details of the massively parallel next-generation Knights Landing Xeon Phi. Today Intel and its 3D memory partner, Micron Technology Inc., put all that speculation to rest.
DRAM's Mood Swings Stabilize News & Analysis 6/17/2014 5 comments From factory fires to consolidations, DRAM manufacturers have been through a lot, but now appear to be stabilizing as the market takes off.
Engineer Hackers Rejuvenate DLP Slideshow 6/16/2014 11 comments Over the last two decades, largely unbeknownst to TI, Digital Light Processing technology has gradually found its way into unintended applications -- industrial and medical included -- thanks to persistent hacking by engineers.
Top Mobile Memory Vendors News & Analysis 6/16/2014 Post a comment In a recent report, Gartner ranked the top vendors of eMCP and eMMC mobile memory. In an interview with EETimes, Gartner's principal analyst, Brady Wang, explained the details.
Of World Cup & 10nm Blog 6/13/2014 6 comments How is the economics of hosting the World Cup justified when the stadiums will be left empty after the World Cup championship finishes? I see a parallel in the semiconductor industry building fabs.
Know Cost & Options Before You Design SoC Blog 6/10/2014 1 comment eSilicon launches new Web-based tools letting IC designers explore design and delivery options before they start designing new SoCs. It's equivalent to what Kayak is to consumers when travel shopping.
Ziptronix & EVG Improve Wafer Alignment News & Analysis 6/9/2014 3 comments Collaboration between Ziptronix and EVG has led to submicron post-bond alignment accuracy on customer-provided wafers. The process supports stacking and can be applied to memory and image sensors.
Marvell to Hitch Apple's Smart Home Ride News & Analysis 6/3/2014 3 comments As Apple guns for a big stake in technology for monitoring health and home, Marvell, Broadcom, and TI are looking to piggyback on the Apple campaign. Marvell launched three separate IoT SoCs made for iDevices.
Parallel NOR Delivers Performance SPI Can't News & Analysis 5/27/2014 2 comments The focus of systems designers is usually on reducing cost and power consumption by using serial flash, but many automotive and embedded applications require the high performance of a parallel interface.
UHS-II SD Cards Await Capable Devices News & Analysis 5/16/2014 1 comment Vendors including Toshiba, SanDisk, and Panasonic have steadily announced SD cards in different form factors that support faster transfer and write speeds, but it will take time for UHS-II capable devices to hit the market.
NXP Car Plan Teams NFC, Bluetooth News & Analysis 5/15/2014 6 comments The biggest issue for the current version of Bluetooth Low Energy may be "its security and pairing mechanism." NXP is proposing NFC for secure transactions, while BLE offers a data link.
Rambus Rejoins Jedec News & Analysis 5/14/2014 5 comments Rambus has been invited to rejoin the memory standards group Jedec after a nearly 20-year absence marked by suits with major DRAM suppliers.
NVMe Emerges as Memory Independent Blog 5/14/2014 Post a comment The first of a planned series of Tech Talk presentations by Intel focused on NVM Express and was given to a worldwide web audience by Amber Huffman, senior principal engineer and NVM Express Workgroup chair.
IBM Hawks PCM for Storage News & Analysis 5/9/2014 5 comments To meet the demands of big data, IBM believes in a hierarchical combination of DRAM, flash, and phase change memory over hard-disk drives.
Do Auto MCUs Need Proprietary Flash? News & Analysis 5/9/2014 11 comments As the technology moves down to the finer node, Globalfoundries sees the 28-nm process node becoming the "battleground." That might force automotive chip companies to give up proprietary embedded VNM technology.
$6 Billion Problem for Mobile Carriers Blog 5/8/2014 10 comments The real issue of the three-device (smartphone, tablet, and notebook) endgame is not the form factor but a $6 billion revenue loss for carriers -- and potentially a huge problem for device manufacturers.