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Future of PCM: Optoelectronic?
Blog  
7/22/2014   2 comments
Work by a team at the University of Oxford and the University of Exeter may well become recognized as the first steps on the road to a new and bright optoelectronic future for phase-change memory materials.
NAND Suit: Toshiba Seeks $1.1B From SK Hynix
News & Analysis  
7/21/2014   2 comments
South Korea's SK Hynix Inc. disclosed in a regulatory filing that Toshiba Corp. is seeking $1.1 billion in damages over the suspected theft of data related to NAND flash memory chip technology.
Testing ReRAM Structures
Blog  
7/14/2014   2 comments
This article by Peter J. Hulbert addresses issues related to characterization and forming, as well as endurance testing for 1R ReRAM structures.
IBM Turns PCM Cell Into Nano-Sized Lab
Blog  
7/10/2014   Post a comment
For the first time, researchers have provided actual crystallization and melting temperatures from inside the memory cell.
MCUs, Memory Balance Security, Performance
News & Analysis  
7/10/2014   1 comment
The need to secure devices at the MCU or SSD level is becoming more pressing thanks to BYOD and the Internet of Things, but perceptions linger that encryption degrades device performance.
Nanotubes May Put IBM Watson in a Pocket
News & Analysis  
7/10/2014   2 comments
Stanford research describes progress in carbon nanotubes, noting the material's promise to pack the equivalent of IBM's Watson system into a handheld.
Resistive Memory Devices: Basics & Characterization
Blog  
7/8/2014   Post a comment
This post addresses the basics of resistive random access memory (ReRAM) structures, as well as the test hardware available to characterize them, using examples from Keithley Instruments’ portfolio.
Medical Devices Require Radiation-Tolerant Memory
News & Analysis  
7/8/2014   7 comments
While a great deal of focus for memory in medical applications is placed on size and power consumption, devices that are smarter and implantable will need to withstand sterilization through radiation.
6 Keys to Navigating Connected Car's Software Quagmire
News & Analysis  
7/8/2014   9 comments
The rush to achieve connected cars has thrown the automotive industry into a technological quagmire. EE Times dissects the technological building blocks and lays out who the players are and who benefits most.
IBM Needs Custom Silicon Prowess
Blog  
7/3/2014   19 comments
IBM needs its own unique silicon process technology to drive its server business, but few -- even within IBM's top ranks -- really appreciate that reality.
China's SMIC-Qualcomm 28-nm Deal: Why Now?
News & Analysis  
7/3/2014   16 comments
SMIC and Qualcomm revealed their collaboration on 28-nm wafer production in China. Since China's antitrust investigation against Qualcomm, speculation abounds that Chinese are probing ways to coerce Qualcomm into collaborating with their electronics industry.
Crossbar RRAM Aims for 1TB
Blog  
7/1/2014   7 comments
Crossbar demonstrates pre-production 1 MB arrays using its new 1 transistor/n resistor's non-volatile RRAM, addressing “sneak path” current issues to enable high-density memory.
Magnetic RAM Remains Niche Memory – for Now
News & Analysis  
6/30/2014   4 comments
One report is bullish on MRAM's growth prospects and its potential to replace DRAM and SRAM, while the primary vendor of the nonvolatile memory still sees plenty of short-term opportunity in niche applications, including enterprise storage.
Ultra-Low-Power FRAM-Based MCUs Target Next-Gen Applications
News & Analysis  
6/24/2014   21 comments
TI's MSP430 FRAM-based MCUs, coupled with EnergyTrace++ technology, are designed from the ground up to enable the world’s lowest-power MCU systems.
Micron 3D Memory Supercharges Xeon Phi
News & Analysis  
6/23/2014   8 comments
Analysts have speculated wildly about the technical details of the massively parallel next-generation Knights Landing Xeon Phi. Today Intel and its 3D memory partner, Micron Technology Inc., put all that speculation to rest.
Repair Teeth Without the Drill: Non-Volatile Memory in the Dentist Chair
Blog  
6/20/2014   13 comments
A new technique for repairing teeth without the drill, which seems strangely familiar, has been developed at King’s College London.
NV Memory: Filament Size & Shape Matters
Blog  
6/19/2014   6 comments
A look at the ReRAM and RRAM papers at this year's VLSI 2014 conference.
Amazon’s Fire Phone: It's Good for Bezos, Not So Much for Us
Blog  
6/19/2014   36 comments
Amazon’s Fire Phone features new technologies such as Firefly and dynamic perspective. But Amazon’s strategy -- pushing its own hardware, not the app, so closely tied to its own store -- raises some serious questions.
Why MIPS? Imagination Makes Its Case
News & Analysis  
6/19/2014   19 comments
Here are a few facts about where MIPS stands, and some clues to the big picture Imagination hopes to paint for its new customers.
Samsung Edges Q'comm in New Android Test
News & Analysis  
6/18/2014   6 comments
Initial results using a new Android benchmark from EEMBC show Samsung's Exynos 5 Octa nudging ahead of Qualcomm's Snapdragon 800.
DRAM's Mood Swings Stabilize
News & Analysis  
6/17/2014   5 comments
From factory fires to consolidations, DRAM manufacturers have been through a lot, but now appear to be stabilizing as the market takes off.
Power-Conscious Controllers Reduce Energy Consumption
News & Analysis  
6/17/2014   1 comment
While a great deal of effort is put into reducing power consumption of memory, controllers are playing a key role in driving down energy needs of overall systems.
Engineer Hackers Rejuvenate DLP
Slideshow  
6/16/2014   11 comments
Over the last two decades, largely unbeknownst to TI, Digital Light Processing technology has gradually found its way into unintended applications -- industrial and medical included -- thanks to persistent hacking by engineers.
Top Mobile Memory Vendors
News & Analysis  
6/16/2014   Post a comment
In a recent report, Gartner ranked the top vendors of eMCP and eMMC mobile memory. In an interview with EETimes, Gartner's principal analyst, Brady Wang, explained the details.
Of World Cup & 10nm
Blog  
6/13/2014   6 comments
How is the economics of hosting the World Cup justified when the stadiums will be left empty after the World Cup championship finishes? I see a parallel in the semiconductor industry building fabs.
4K Video in Focus at World Cup
Blog  
6/12/2014   5 comments
Engineers may see in Brazil's World Cup visions of future video design challenges as resolutions move toward 4K ultra-high definition.
ON Semi's Aptina Acquisition Aims at Automotive
News & Analysis  
6/11/2014   2 comments
ON Semiconductor's $400 million acquisition of Aptina Imaging makes ON Semi the world's repository of CMOS image sensor experts.
IoT, Wearables Drive Lower Power Memory Innovation
News & Analysis  
6/10/2014   8 comments
As the functionality of smartphones begins to get squeezed into smaller form factors, new pressures are being put on memory power consumption for wearables and other devices
Know Cost & Options Before You Design SoC
Blog  
6/10/2014   1 comment
eSilicon launches new Web-based tools letting IC designers explore design and delivery options before they start designing new SoCs. It's equivalent to what Kayak is to consumers when travel shopping.
Ziptronix & EVG Improve Wafer Alignment
News & Analysis  
6/9/2014   3 comments
Collaboration between Ziptronix and EVG has led to submicron post-bond alignment accuracy on customer-provided wafers. The process supports stacking and can be applied to memory and image sensors.
VLSI 2014 Memory: Lessons Learned & Photonics
Blog  
6/9/2014   2 comments
A preview of Micron's presentation plans at 2014 VLSI Symposia.
Design Cars Like Planes, Use Them Like Cellphones
News & Analysis  
6/4/2014   6 comments
A Ford executive cautioned that, without tools that keep up with the automotive design challenges, a car's complexity will just keep growing. No longer will consumers be able to say: "It just works."
Seagate Acquires LSI Assets to Address Flash Market
News & Analysis  
6/3/2014   Post a comment
LSI’s PCIe and SandForce controller technologies will help Seagate expand its SSD and flash portfolio, but it has a lot of work ahead of it to make inroads in the enterprise and PC SSD segments
Marvell to Hitch Apple's Smart Home Ride
News & Analysis  
6/3/2014   3 comments
As Apple guns for a big stake in technology for monitoring health and home, Marvell, Broadcom, and TI are looking to piggyback on the Apple campaign. Marvell launched three separate IoT SoCs made for iDevices.
Apple’s IoT 'Good Housekeeping' Label: MFi
News & Analysis  
5/30/2014   33 comments
Expect Apple to beat Google to the punch by unveiling the company’s IoT strategy on its home front at Apple’s Worldwide Developer Conference next week in San Francisco.
Parallel NOR Delivers Performance SPI Can't
News & Analysis  
5/27/2014   2 comments
The focus of systems designers is usually on reducing cost and power consumption by using serial flash, but many automotive and embedded applications require the high performance of a parallel interface.
Phase Change Memory: From Multi-Level to Multi-Tasking
Blog  
5/23/2014   5 comments
Here's a preview of what's in store for PCM at this year's VLSI Symposium 2014.
HP Plans 16,000 More Layoffs
News & Analysis  
5/22/2014   21 comments
Hewlett-Packard stunned analysts with plans to lay off 16,000 more employees, but execs insisted the company is on the road back.
DesignCon Issues 2015 Call for Abstracts
News & Analysis  
5/22/2014   7 comments
The annual conference on high-speed digital design, signal integrity, and power integrity is now taking submissions for paper abstracts.
Samsung Ramps Up 3D NAND Fab in China
News & Analysis  
5/20/2014   3 comments
With 3D NAND likely to hit the market in the second half of 2015, major manufacturers are expanding their facilities to prepare for the conversion from 2D.
IBM Sets World Record With Mag Tape
News & Analysis  
5/19/2014   3 comments
IBM and FujiFilm announce a world record in data density on the more reliable and long-lived storage medium for big data, the venerable tape drive.
Spansion Courts Carmakers With Cortex-R5-Based MCUs
News & Analysis  
5/19/2014   5 comments
In hopes of gaining a sizable share in the growing automotive chip market, Spansion Inc. is rolling out a new family of automotive MCUs, called Traveo, based on ARM Cortex 5 cores.
UHS-II SD Cards Await Capable Devices
News & Analysis  
5/16/2014   1 comment
Vendors including Toshiba, SanDisk, and Panasonic have steadily announced SD cards in different form factors that support faster transfer and write speeds, but it will take time for UHS-II capable devices to hit the market.
NXP Car Plan Teams NFC, Bluetooth
News & Analysis  
5/15/2014   6 comments
The biggest issue for the current version of Bluetooth Low Energy may be "its security and pairing mechanism." NXP is proposing NFC for secure transactions, while BLE offers a data link.
Rambus Rejoins Jedec
News & Analysis  
5/14/2014   5 comments
Rambus has been invited to rejoin the memory standards group Jedec after a nearly 20-year absence marked by suits with major DRAM suppliers.
NVMe Emerges as Memory Independent
Blog  
5/14/2014   Post a comment
The first of a planned series of Tech Talk presentations by Intel focused on NVM Express and was given to a worldwide web audience by Amber Huffman, senior principal engineer and NVM Express Workgroup chair.
3D NAND Transition: 15nm Process Technology Takes Shape
News & Analysis  
5/13/2014   5 comments
SanDisk and Toshiba are both continuing to push floating gates until 3D NAND makes economic sense with 15nm process technology that will be applied to wide range of market segments
IBM Hawks PCM for Storage
News & Analysis  
5/9/2014   5 comments
To meet the demands of big data, IBM believes in a hierarchical combination of DRAM, flash, and phase change memory over hard-disk drives.
Do Auto MCUs Need Proprietary Flash?
News & Analysis  
5/9/2014   11 comments
As the technology moves down to the finer node, Globalfoundries sees the 28-nm process node becoming the "battleground." That might force automotive chip companies to give up proprietary embedded VNM technology.
$6 Billion Problem for Mobile Carriers
Blog  
5/8/2014   10 comments
The real issue of the three-device (smartphone, tablet, and notebook) endgame is not the form factor but a $6 billion revenue loss for carriers -- and potentially a huge problem for device manufacturers.
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Max Maxfield
13 comments
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Jeremy Cook
3 comments
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Jeremy Cook
21 comments
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