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LPDDR3 Is A Half-Step
News & Analysis  
9/30/2014   Post a comment
The rapid evolution of smartphones drove the quick adoption of LPDDR3, but its successor is more thought out and will take over relatively quickly.
DDR Memory Testing: Best-Practices
Blog  
9/29/2014   Post a comment
The strict control of clock and data timing leaves little margin for error in a DDR SDRAM interface. Testing of these interfaces demands adherence to some important best-practices to ensure accurate and repeatable results.
Securing Trustworthy & Resilient Chips
News & Analysis  
9/23/2014   2 comments
The National Science Foundation and the Semiconductor Research Corp. are funding a $10 million three-year project to make chips secure, trustworthy, assured, and resilient against hackers.
SD Cards Now Support Contactless Communication
News & Analysis  
9/23/2014   Post a comment
A new specification allows SD memory cards in PCs, smartphones, and printers to exchange data using TransferJet, which is quicker than wireless LAN.
Top 10 Candidates for Next-Gen Storage
Slideshow  
9/22/2014   6 comments
What's the next step in the evolution of memory? This slideshow gives you the top 10 candidates for next-generation memory devices.
Memory Product Round Up: September 2014
Blog  
9/22/2014   Post a comment
Summaries of memory products making news this month, including SD card controllers, SRAMs, RDIMM, LRDIMM, and RAM.
Micron SSD Allows MLC to Mimic SLC
News & Analysis  
9/16/2014   Post a comment
New 16nm lithography enables Micron to offer dynamic write acceleration, enabling MLC NAND to behave as SLC and better meet the demands of mobile computing.
HGST Fires Up Flash Fabric
News & Analysis  
9/16/2014   Post a comment
The Western Digital-owned enterprise storage company is leveraging recently acquisitions to turn Flash into a platform with clustering of PCIe storage devices.
Phoneless Billions Lure Google to India
News & Analysis  
9/15/2014   19 comments
Google’s rollout of Android One-branded smartphone in India has suddenly thrust that nation into the middle of the battle for emerging markets among budget smartphone vendors.
Marvell's 4K Ultra HD SoC Targets Hybrid Boxes
News & Analysis  
9/10/2014   5 comments
Marvell’s new SoC featuring a variety of interfaces (Gigabit Ethernet for IPTV, DVB-T/S input) is designed for “hybrid boxes,” allowing the reception of terrestrial broadcast, pay TV, and IP content on the same platform.
JEDEC Releases Wide I/O 2 Mobile DRAM Standard
News & Analysis  
9/9/2014   Post a comment
Following the recent release of the LPDDR4 spec, JEDEC publishes its Wide I/O 2 mobile DRAM standard for 3D memory devices.
DDR4 Ramps Up, Enterprise First
News & Analysis  
9/9/2014   1 comment
While DDR3 got its start in client devices, DDR4 will hit enterprise servers and datacenters first, driven by in-memory systems and high transaction computing that require better performance and higher density.
Can China Buy Its Way Into Global IC Industry?
News & Analysis  
9/4/2014   13 comments
By taking over OmniVision, China will gain instant access to the global market. Such a deal also generates demand for volume production of CMOS image sensors in China -- enough to fill SMIC’s capacity.
IoT Gives Old Technology New Life
News & Analysis  
9/2/2014   2 comments
Cypress Semiconductor sees a great deal of potential for SONOS technology, dating back to the 1960s, for addressing scaling and power challenges in Internet of Things (IoT) devices.
Data Centers May Ride on ASICs
News & Analysis  
8/28/2014   10 comments
Firebox, a research prototype in the works at UC Berkeley, aims to point the way to warehouse-scale computers for data centers in 2020 based on ASICs and optical links.
Google Preps Virtual Network
News & Analysis  
8/27/2014   2 comments
Google described Andromeda, a central server-based controller users will be able to access to create, run, and extend virtual networks running in Google's data centers.
SanDisk Bullish on SSD Adoption
News & Analysis  
8/26/2014   5 comments
Ultra II is aimed at consumers looking to upgrade HDD or first generation SSD with simple migration tools in a PC market that has experienced flat growth at best.
Memory Design Articles: DDR4, LRDIMMs, MBIST, Embedded Flash
Blog  
8/26/2014   2 comments
A roundup and summary of memory design articles across the network this month.
US Launches Smart Cities Effort
News & Analysis  
8/26/2014   12 comments
The US has launched a challenge to municipal governments around the world to work with vendors in the Internet of Things to deploy smart cities applications.
NAND, DRAM 3D-Transition Roadmaps
News & Analysis  
8/25/2014   Post a comment
IC Insights has done its best to encapsulate the latest information from DRAM and NAND vendors to provide a roadmap for the transition to finer geometry processes and to multi-layered memories.
DDR4 LRDIMMs: Ready for Enterprise Memory
Blog  
8/22/2014   Post a comment
Here's a look at the advances the industry has made with the latest memory technology DDR4 and, more specifically, on DDR4 LRDIMM.
Startup Sees Enterprise Op for TLC NAND
News & Analysis  
8/19/2014   Post a comment
NxGn Data looks to make TLC viable as cold storage for enterprises while moving data and computation closer with its In-Situ Processing.
AMD Enters Storage Sector
News & Analysis  
8/19/2014   1 comment
Advanced Micro Devices Inc. has entered the storage sector with a line of Radeon-branded solid-state drives targeted specifically at the game console market.
25 Views of Hot Chips 2014
Slideshow  
8/18/2014   3 comments
ARM commanded much of the spotlight at Hot Chips 2014, but the event made it clear Intel maintains its position as king of the microprocessor hill.
China vs. Qualcomm: Chip's 'Nationality' Still Matters
Blog  
8/15/2014   22 comments
China is using every possible tool to pressure foreign companies. It appears a little too convenient for Chinese regulators to scrutinize multinationals for antitrust allegations while China's chip vendors, now "state-owned," become less transparent.
Destroying Data Is Hard Work
News & Analysis  
8/13/2014   2 comments
Spinning media retains data despite corruption and damage, but flash and SSDs are more complex when it comes to guaranteeing sensitive information is truly banished from a device.
SanDisk Expands ULLtraDIMM Reach
News & Analysis  
8/12/2014   Post a comment
Supermicro is the latest to adopt SanDisk’s enterprise SSDs using a memory channel storage architecture, while its Fusion-io acquisition addresses latency using PCIe.
9 Peaks From the Flash Summit
Slideshow  
8/8/2014   8 comments
Flash controllers want to be compute nodes, vertical NAND wants to ship and next-gen non-volatiles want a shot, I was told at the Flash Summit.
Intel's Embedded DRAM: New Era of Cache Memory
Blog  
8/7/2014   26 comments
With SRAM so costly to make, Intel's Embedded DRAM is an intriguing option. Techinsights examines eDRAM and its potential.
Samsung Tips 3-Bit Vertical NAND
News & Analysis  
8/5/2014   8 comments
Samsung said it will ship a version of its 128 Gbit vertical NAND supporting three bits per cell within weeks.
Flash Fails 5 Ways, Says Alibaba
News & Analysis  
8/5/2014   4 comments
An R&D manager for cloud services at China's Alibaba datacenters gave a laundry list of problems flash vendors need to address in a keynote at the Flash Memory Summit.
Silicon Motion SSD Controller Anticipates TLC Growth
News & Analysis  
8/5/2014   1 comment
Triple-level-cell NAND appears to be following a path similar to that of MLC, with adoption picking up steam in client devices. But TLC finding its way into the enterprise could take another few years.
PMC Plugs DRAM Into PCI Express
News & Analysis  
8/5/2014   Post a comment
PMC-Sierra is using its NAND flash controller in a flash-backed DRAM memory card that plugs into the PCI Express 3.0 bus, aimed at memory-constrained systems that demand more performance.
EV Battery Management Gets More Intelligent
Blog  
8/4/2014   Post a comment
The EV battery management system is being more broadly redefined, so that it can be responsible for battery fault detection and reaction, control and monitoring, system-level thermal management, and security/brand protection.
Micron Makes Monolithic 8Gb DDR3
News & Analysis  
7/29/2014   6 comments
Using a 25 nm manufacturing process, Micron has created a monolithic 8 Gb DDR3 SDRAM component, while a startup is squeezing 8 Gb into a single chipset using proprietary techniques.
Samsung's Silicon Valley Home
Blog  
7/25/2014   11 comments
Samsung is building a 10-story complex in the heart of Silicon Valley that will be home for some of its memory and display researchers and a whole lot of ecosystem efforts.
Future of PCM: Optoelectronic?
Blog  
7/22/2014   4 comments
Work by a team at the University of Oxford and the University of Exeter may well become recognized as the first steps on the road to a new and bright optoelectronic future for phase-change memory materials.
NAND Suit: Toshiba Seeks $1.1B From SK Hynix
News & Analysis  
7/21/2014   7 comments
South Korea's SK Hynix Inc. disclosed in a regulatory filing that Toshiba Corp. is seeking $1.1 billion in damages over the suspected theft of data related to NAND flash memory chip technology.
Testing ReRAM Structures
Blog  
7/14/2014   2 comments
This article by Peter J. Hulbert addresses issues related to characterization and forming, as well as endurance testing for 1R ReRAM structures.
IBM Turns PCM Cell Into Nano-Sized Lab
Blog  
7/10/2014   Post a comment
For the first time, researchers have provided actual crystallization and melting temperatures from inside the memory cell.
MCUs, Memory Balance Security, Performance
News & Analysis  
7/10/2014   1 comment
The need to secure devices at the MCU or SSD level is becoming more pressing thanks to BYOD and the Internet of Things, but perceptions linger that encryption degrades device performance.
Nanotubes May Put IBM Watson in a Pocket
News & Analysis  
7/10/2014   2 comments
Stanford research describes progress in carbon nanotubes, noting the material's promise to pack the equivalent of IBM's Watson system into a handheld.
Resistive Memory Devices: Basics & Characterization
Blog  
7/8/2014   Post a comment
This post addresses the basics of resistive random access memory (ReRAM) structures, as well as the test hardware available to characterize them, using examples from Keithley Instruments’ portfolio.
Medical Devices Require Radiation-Tolerant Memory
News & Analysis  
7/8/2014   10 comments
While a great deal of focus for memory in medical applications is placed on size and power consumption, devices that are smarter and implantable will need to withstand sterilization through radiation.
6 Keys to Navigating Connected Car's Software Quagmire
News & Analysis  
7/8/2014   11 comments
The rush to achieve connected cars has thrown the automotive industry into a technological quagmire. EE Times dissects the technological building blocks and lays out who the players are and who benefits most.
IBM Needs Custom Silicon Prowess
Blog  
7/3/2014   15 comments
IBM needs its own unique silicon process technology to drive its server business, but few -- even within IBM's top ranks -- really appreciate that reality.
China's SMIC-Qualcomm 28-nm Deal: Why Now?
News & Analysis  
7/3/2014   16 comments
SMIC and Qualcomm revealed their collaboration on 28-nm wafer production in China. Since China's antitrust investigation against Qualcomm, speculation abounds that Chinese are probing ways to coerce Qualcomm into collaborating with their electronics industry.
Crossbar RRAM Aims for 1TB
Blog  
7/1/2014   7 comments
Crossbar demonstrates pre-production 1 MB arrays using its new 1 transistor/n resistor's non-volatile RRAM, addressing “sneak path” current issues to enable high-density memory.
Magnetic RAM Remains Niche Memory – for Now
News & Analysis  
6/30/2014   4 comments
One report is bullish on MRAM's growth prospects and its potential to replace DRAM and SRAM, while the primary vendor of the nonvolatile memory still sees plenty of short-term opportunity in niche applications, including enterprise storage.
Ultra-Low-Power FRAM-Based MCUs Target Next-Gen Applications
News & Analysis  
6/24/2014   21 comments
TI's MSP430 FRAM-based MCUs, coupled with EnergyTrace++ technology, are designed from the ground up to enable the world’s lowest-power MCU systems.
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