Micron, Samsung in Flash Battle News & Analysis 2/5/2016 10 comments Micron described a 768Gbit 3D NAND flash chip that is twice as dense as Samsung’s current vertical NAND, but it’s not clear it will come to market.
16 Insights on ICs Slideshow 1/29/2016 5 comments At a talk in Silicon Valley semiconductor market guru Bill McClean predicted 4% growth in 2016 for the consolidating industry, but said China is a wild card.
3D XPoint Steps Into the Light News & Analysis 1/14/2016 8 comments With its 3D XPoint memories moving into the fab, an IM Flash executive revealed details of the technology and challenges making the devices.
Cypress Unveils Traveo OTA Update MCUs News & Analysis 1/12/2016 Post a comment Cypress Semiconductor Corp. rolled out the first series of Traveo MCUs with embedded flash on the 40nm process technology node, designed to enable mid-range to mass-market cars to implement over-the-air software updates.
AMD Tips Next Graphics Chip News & Analysis 1/4/2016 1 comment Advanced Micro Devices said its next-generation graphics processor, Polaris, will deliver nearly twice the performance/Watt of today’s Nvidia GPUs.
Toshiba Reorg Cuts Consumer Unit News & Analysis 12/21/2015 3 comments Toshiba will exit an ailing consumer notebook market but hang on to its profitable NAND flash business in a reorganization that includes 6,800 layoffs.
HPE Melds Servers, Storage News & Analysis 12/1/2015 1 comment Hewlett Packard Enterprise announced Synergy, a server blade system with integrated software to ease the job of managing jobs across arrays of processors and hard and solid-state disks.
Why Japan Hasn't Led IoT News & Analysis 11/19/2015 8 comments Germany has Industry 4.0. The U.S. is running with Industrial Internet Consortium. Where is Japan? Ken Sakamura, creator of TRON, Japan’s home-grown RTOS, blasted Japanese embedded designers for their inability to lead the Internet of Things on the world stage.
Parrot Unveils Bebop 2 Drone News & Analysis 11/17/2015 1 comment French drone company Parrot unveiled its next-generation consumer drone, Bebop 2. The 500 gram, four propeller device is designed to take photos and video with 25 minutes of fly time.
A Look at Metal eFuses Blog 11/8/2015 4 comments TechInsights reverse engineers chips to understand how they are made and in some cases why certain structures are the way they are. This article examines two electrically blown fuse structures (eFuse) used in metal gate logic processes. This first eFuse structure that we look at is made by Intel and the second by TSMC.
Further Details of FinFET ReRAM Released News & Analysis 10/22/2015 1 comment Further details have been released of the resistive RAM made using a 16nm logic FinFET manufacturing process. A full paper is due to be presented on a 1-kbit memory array of such devices at this year's International Electron Devices Meeting (IEDM) coming up in December.
Dell Preps Semi-Custom Servers News & Analysis 10/22/2015 Post a comment Dell unveiled new servers for the data center market and enterprise at its annual DellWorld conference, targeting custom and semi-custom network infrastructure and storage for tier two cloud providers and others.
Intel Rides Servers, Flash in Q3 News & Analysis 10/13/2015 2 comments Intel today reported third quarter revenue of $14.5 billion, a 10% increase from the second quarter of 2015, and flat year-over-year. Growth in its data center, non-volatile memory, and Internet of Things businesses offset lower client revenue.
Optical Phase-Change Memory Can Increase Bandwidth News & Analysis 9/28/2015 1 comment A research team from the universities of Oxford and Muenster has developed a phase-change, non-volatile memory that is programmed and read using light and which could be interfaced to conventional electronic processor for higher bandwidth.
16 Insights on ICs Slideshow 9/22/2015 5 comments The semiconductor market has settled into a slow-growth mode for the foreseeable future but tech disruptions are coming, said IC Insights.
7 Flash Memory Products Not to Miss Slideshow 9/6/2015 2 comments Last month’s Flash Memory Summit was the backdrop for a great deal of technology demonstrations and product announcements, while August was a popular month for introducing new SSDs.
What stops you from launching your startup? Flash Poll 9/5/2015 Post a comment As we reveal 2015 EE Times Silicon 60 startup list, tell us why you are or aren't involved in your own startup. Drop your questions for our live radio show (Sept. 8) as we talk to venture capitalists about current environment for hardware startups.
8+ Horizons at Hot Chips Slideshow 9/1/2015 Post a comment The chip horizon is bright and diverse said speakers at Hot Chips presenting on 5G cellular, neural networks, molecular diagnostics, chip stacks and FPGAs.
Nanotech Hub Targets 7nm, Beyond Slideshow 8/27/2015 2 comments We toured the College of Nanoscience and Engineering, part of a State University of New York campus, a hub for advanced semiconductor manufacturing research in areas such as lithography, 450mm wafers, and new materials as well as photonics, biotech and workforce development.
Inside GlobalFoundries' Fab 8 News & Analysis 8/18/2015 5 comments We tour GlobalFoundries' Fab 8, one of the largest chip fabs in the United States, in Malta, N.Y. and a hub for innovations developed at R&D centers in Albany.
Rambus to Enter Fabless Chip Biz News & Analysis 8/17/2015 9 comments Seizing the opportunity in a growing market of datacenters, Rambus is unveiling a server memory interface chipset. The move is significant because the company will enter a fabless chip business for the first time, instead of IP business.
15 Views from the Flash Summit Slideshow 8/14/2015 3 comments The Flash Memory Summit provided a look back at the start of the solid-state drive as well as the future for SSDs, flash and memory chips beyond.
Intel Preps Crosspoint Server News & Analysis 8/13/2015 6 comments Intel will debut next week a new class of high performance servers using the 3-D Crosspoint memories it recently announced with Micron, said one expert.
Samsung Drives Up 3-D Flash News & Analysis 8/11/2015 1 comment Samsung announced a handful of novel products using its 3-D NAND flash chips, but the mass market for such products may be more than a year away, said analysts.
Why 3D XPoint Isn’t Phase Change Memory Blog 8/6/2015 12 comments Since Intel and Micron are being rather tight-lipped about what’s actually under the hood of what they say is a new class of memory, the door is wide open for speculation as to what it might be
Will The World Coalesce Around USB Type C? News & Analysis 8/3/2015 5 comments USB Type C is still too new for any market forecast numbers. But some analysts anticipate that USB Type C with its alt modes could “bring some ‘consolidation’ in the connector market,” where consumers need just one cable.
Samsung's Slippage Stirs Smartphone Angst News & Analysis 7/30/2015 6 comments Samsung’s downbeat outlook is stirring up worries over the global smartphone market. A bigger question is if this dip is an isolated incident, or a harbinger of an inevitable slowdown in the smartphone market.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments