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SanDisk Bullish on SSD Adoption
News & Analysis  
8/26/2014   5 comments
Ultra II is aimed at consumers looking to upgrade HDD or first generation SSD with simple migration tools in a PC market that has experienced flat growth at best.
Memory Design Articles: DDR4, LRDIMMs, MBIST, Embedded Flash
Blog  
8/26/2014   2 comments
A roundup and summary of memory design articles across the network this month.
US Launches Smart Cities Effort
News & Analysis  
8/26/2014   12 comments
The US has launched a challenge to municipal governments around the world to work with vendors in the Internet of Things to deploy smart cities applications.
NAND, DRAM 3D-Transition Roadmaps
News & Analysis  
8/25/2014   Post a comment
IC Insights has done its best to encapsulate the latest information from DRAM and NAND vendors to provide a roadmap for the transition to finer geometry processes and to multi-layered memories.
DDR4 LRDIMMs: Ready for Enterprise Memory
Blog  
8/22/2014   Post a comment
Here's a look at the advances the industry has made with the latest memory technology DDR4 and, more specifically, on DDR4 LRDIMM.
Startup Sees Enterprise Op for TLC NAND
News & Analysis  
8/19/2014   Post a comment
NxGn Data looks to make TLC viable as cold storage for enterprises while moving data and computation closer with its In-Situ Processing.
AMD Enters Storage Sector
News & Analysis  
8/19/2014   1 comment
Advanced Micro Devices Inc. has entered the storage sector with a line of Radeon-branded solid-state drives targeted specifically at the game console market.
25 Views of Hot Chips 2014
Slideshow  
8/18/2014   3 comments
ARM commanded much of the spotlight at Hot Chips 2014, but the event made it clear Intel maintains its position as king of the microprocessor hill.
China vs. Qualcomm: Chip's 'Nationality' Still Matters
Blog  
8/15/2014   22 comments
China is using every possible tool to pressure foreign companies. It appears a little too convenient for Chinese regulators to scrutinize multinationals for antitrust allegations while China's chip vendors, now "state-owned," become less transparent.
Destroying Data Is Hard Work
News & Analysis  
8/13/2014   2 comments
Spinning media retains data despite corruption and damage, but flash and SSDs are more complex when it comes to guaranteeing sensitive information is truly banished from a device.
SanDisk Expands ULLtraDIMM Reach
News & Analysis  
8/12/2014   Post a comment
Supermicro is the latest to adopt SanDisk’s enterprise SSDs using a memory channel storage architecture, while its Fusion-io acquisition addresses latency using PCIe.
9 Peaks From the Flash Summit
Slideshow  
8/8/2014   8 comments
Flash controllers want to be compute nodes, vertical NAND wants to ship and next-gen non-volatiles want a shot, I was told at the Flash Summit.
Intel's Embedded DRAM: New Era of Cache Memory
Blog  
8/7/2014   26 comments
With SRAM so costly to make, Intel's Embedded DRAM is an intriguing option. Techinsights examines eDRAM and its potential.
Samsung Tips 3-Bit Vertical NAND
News & Analysis  
8/5/2014   8 comments
Samsung said it will ship a version of its 128 Gbit vertical NAND supporting three bits per cell within weeks.
Flash Fails 5 Ways, Says Alibaba
News & Analysis  
8/5/2014   4 comments
An R&D manager for cloud services at China's Alibaba datacenters gave a laundry list of problems flash vendors need to address in a keynote at the Flash Memory Summit.
Silicon Motion SSD Controller Anticipates TLC Growth
News & Analysis  
8/5/2014   1 comment
Triple-level-cell NAND appears to be following a path similar to that of MLC, with adoption picking up steam in client devices. But TLC finding its way into the enterprise could take another few years.
PMC Plugs DRAM Into PCI Express
News & Analysis  
8/5/2014   Post a comment
PMC-Sierra is using its NAND flash controller in a flash-backed DRAM memory card that plugs into the PCI Express 3.0 bus, aimed at memory-constrained systems that demand more performance.
EV Battery Management Gets More Intelligent
Blog  
8/4/2014   Post a comment
The EV battery management system is being more broadly redefined, so that it can be responsible for battery fault detection and reaction, control and monitoring, system-level thermal management, and security/brand protection.
Micron Makes Monolithic 8Gb DDR3
News & Analysis  
7/29/2014   6 comments
Using a 25 nm manufacturing process, Micron has created a monolithic 8 Gb DDR3 SDRAM component, while a startup is squeezing 8 Gb into a single chipset using proprietary techniques.
Samsung's Silicon Valley Home
Blog  
7/25/2014   11 comments
Samsung is building a 10-story complex in the heart of Silicon Valley that will be home for some of its memory and display researchers and a whole lot of ecosystem efforts.
Future of PCM: Optoelectronic?
Blog  
7/22/2014   4 comments
Work by a team at the University of Oxford and the University of Exeter may well become recognized as the first steps on the road to a new and bright optoelectronic future for phase-change memory materials.
NAND Suit: Toshiba Seeks $1.1B From SK Hynix
News & Analysis  
7/21/2014   7 comments
South Korea's SK Hynix Inc. disclosed in a regulatory filing that Toshiba Corp. is seeking $1.1 billion in damages over the suspected theft of data related to NAND flash memory chip technology.
Testing ReRAM Structures
Blog  
7/14/2014   2 comments
This article by Peter J. Hulbert addresses issues related to characterization and forming, as well as endurance testing for 1R ReRAM structures.
IBM Turns PCM Cell Into Nano-Sized Lab
Blog  
7/10/2014   Post a comment
For the first time, researchers have provided actual crystallization and melting temperatures from inside the memory cell.
MCUs, Memory Balance Security, Performance
News & Analysis  
7/10/2014   1 comment
The need to secure devices at the MCU or SSD level is becoming more pressing thanks to BYOD and the Internet of Things, but perceptions linger that encryption degrades device performance.
Nanotubes May Put IBM Watson in a Pocket
News & Analysis  
7/10/2014   2 comments
Stanford research describes progress in carbon nanotubes, noting the material's promise to pack the equivalent of IBM's Watson system into a handheld.
Resistive Memory Devices: Basics & Characterization
Blog  
7/8/2014   Post a comment
This post addresses the basics of resistive random access memory (ReRAM) structures, as well as the test hardware available to characterize them, using examples from Keithley Instruments’ portfolio.
Medical Devices Require Radiation-Tolerant Memory
News & Analysis  
7/8/2014   10 comments
While a great deal of focus for memory in medical applications is placed on size and power consumption, devices that are smarter and implantable will need to withstand sterilization through radiation.
6 Keys to Navigating Connected Car's Software Quagmire
News & Analysis  
7/8/2014   11 comments
The rush to achieve connected cars has thrown the automotive industry into a technological quagmire. EE Times dissects the technological building blocks and lays out who the players are and who benefits most.
IBM Needs Custom Silicon Prowess
Blog  
7/3/2014   18 comments
IBM needs its own unique silicon process technology to drive its server business, but few -- even within IBM's top ranks -- really appreciate that reality.
China's SMIC-Qualcomm 28-nm Deal: Why Now?
News & Analysis  
7/3/2014   16 comments
SMIC and Qualcomm revealed their collaboration on 28-nm wafer production in China. Since China's antitrust investigation against Qualcomm, speculation abounds that Chinese are probing ways to coerce Qualcomm into collaborating with their electronics industry.
Crossbar RRAM Aims for 1TB
Blog  
7/1/2014   7 comments
Crossbar demonstrates pre-production 1 MB arrays using its new 1 transistor/n resistor's non-volatile RRAM, addressing “sneak path” current issues to enable high-density memory.
Magnetic RAM Remains Niche Memory – for Now
News & Analysis  
6/30/2014   4 comments
One report is bullish on MRAM's growth prospects and its potential to replace DRAM and SRAM, while the primary vendor of the nonvolatile memory still sees plenty of short-term opportunity in niche applications, including enterprise storage.
Ultra-Low-Power FRAM-Based MCUs Target Next-Gen Applications
News & Analysis  
6/24/2014   21 comments
TI's MSP430 FRAM-based MCUs, coupled with EnergyTrace++ technology, are designed from the ground up to enable the world’s lowest-power MCU systems.
Micron 3D Memory Supercharges Xeon Phi
News & Analysis  
6/23/2014   8 comments
Analysts have speculated wildly about the technical details of the massively parallel next-generation Knights Landing Xeon Phi. Today Intel and its 3D memory partner, Micron Technology Inc., put all that speculation to rest.
Repair Teeth Without the Drill: Non-Volatile Memory in the Dentist Chair
Blog  
6/20/2014   13 comments
A new technique for repairing teeth without the drill, which seems strangely familiar, has been developed at King’s College London.
NV Memory: Filament Size & Shape Matters
Blog  
6/19/2014   6 comments
A look at the ReRAM and RRAM papers at this year's VLSI 2014 conference.
Amazon’s Fire Phone: It's Good for Bezos, Not So Much for Us
Blog  
6/19/2014   36 comments
Amazon’s Fire Phone features new technologies such as Firefly and dynamic perspective. But Amazon’s strategy -- pushing its own hardware, not the app, so closely tied to its own store -- raises some serious questions.
Why MIPS? Imagination Makes Its Case
News & Analysis  
6/19/2014   19 comments
Here are a few facts about where MIPS stands, and some clues to the big picture Imagination hopes to paint for its new customers.
Samsung Edges Q'comm in New Android Test
News & Analysis  
6/18/2014   6 comments
Initial results using a new Android benchmark from EEMBC show Samsung's Exynos 5 Octa nudging ahead of Qualcomm's Snapdragon 800.
DRAM's Mood Swings Stabilize
News & Analysis  
6/17/2014   5 comments
From factory fires to consolidations, DRAM manufacturers have been through a lot, but now appear to be stabilizing as the market takes off.
Power-Conscious Controllers Reduce Energy Consumption
News & Analysis  
6/17/2014   1 comment
While a great deal of effort is put into reducing power consumption of memory, controllers are playing a key role in driving down energy needs of overall systems.
Engineer Hackers Rejuvenate DLP
Slideshow  
6/16/2014   11 comments
Over the last two decades, largely unbeknownst to TI, Digital Light Processing technology has gradually found its way into unintended applications -- industrial and medical included -- thanks to persistent hacking by engineers.
Top Mobile Memory Vendors
News & Analysis  
6/16/2014   Post a comment
In a recent report, Gartner ranked the top vendors of eMCP and eMMC mobile memory. In an interview with EETimes, Gartner's principal analyst, Brady Wang, explained the details.
Of World Cup & 10nm
Blog  
6/13/2014   6 comments
How is the economics of hosting the World Cup justified when the stadiums will be left empty after the World Cup championship finishes? I see a parallel in the semiconductor industry building fabs.
4K Video in Focus at World Cup
Blog  
6/12/2014   5 comments
Engineers may see in Brazil's World Cup visions of future video design challenges as resolutions move toward 4K ultra-high definition.
ON Semi's Aptina Acquisition Aims at Automotive
News & Analysis  
6/11/2014   2 comments
ON Semiconductor's $400 million acquisition of Aptina Imaging makes ON Semi the world's repository of CMOS image sensor experts.
IoT, Wearables Drive Lower Power Memory Innovation
News & Analysis  
6/10/2014   8 comments
As the functionality of smartphones begins to get squeezed into smaller form factors, new pressures are being put on memory power consumption for wearables and other devices
Know Cost & Options Before You Design SoC
Blog  
6/10/2014   1 comment
eSilicon launches new Web-based tools letting IC designers explore design and delivery options before they start designing new SoCs. It's equivalent to what Kayak is to consumers when travel shopping.
Ziptronix & EVG Improve Wafer Alignment
News & Analysis  
6/9/2014   3 comments
Collaboration between Ziptronix and EVG has led to submicron post-bond alignment accuracy on customer-provided wafers. The process supports stacking and can be applied to memory and image sensors.
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