Samsung Debuts 3D XPoint Killer
News & Analysis 8/11/2016 5 comments
Samsung announced Z-NAND, a 3D flash variant it says will have similar performance and lower cost in solid-state drives than Micron Quantx SSDs.
Micron demos 3D XPoint in drives
News & Analysis 8/9/2016 2 comments
Micron showed prototype solid-state drives using its 3D XPoint memories with data for their performance as Toshiba talked about NAND flash advances.
Western Digital Claims First 64-layer 3D NAND Memory
News & Analysis 7/27/2016 6 comments
Disk drive vendor Western Digital Corp. has claimed that it -- with Toshiba Corp. -- has developed the world's first 64-layer 3D NAND memory and that it is in pilot production at joint-venture production facilities at Yokkaichi, Japan.
Intel a Bear on PCs, a Bull on Flash
News & Analysis 7/20/2016 1 comment
Amid second-quarter results, Intel said it expects a double-digit PC decline this year but sees flash picking up as it continues a 14nm rollout and starts a 10nm ramp.
AMD Details Next-Gen APUs
News & Analysis 6/8/2016 4 comments
AMD still believes in PCs and recently announced its seventh generation of A-series processors targeted for that market. Code-named Bristol Ridge and Stony Ridge, the processors are designed to boost productivity, enhance multimedia, and improve energy efficiency.
Why ReRAM/RRAM Is Like Lightning
Blog 6/6/2016 2 comments
What must be considered is the possibility that the filaments-in-waiting have another role to control and keep a constant current density in the switching region.
Former Intel Exec Perlmutter to Chair ReRam Startup
News & Analysis 5/4/2016 5 comments
David Perlmutter, a former executive vice president and chief product officer at Intel, has agreed to be non-executive chairman of Weebit Nano, a startup formed to commercialize silicon dioxide resistive RAM technology.
Intel Reorg Shows Clouds Ahead
News & Analysis 4/20/2016 11 comments
Intel's $1.2 billion plan to cut 12,000 employees amid an accelerating PC decline got a mixed reception from market watchers noting issues in memory, IoT and data center markets.
Facebook Roadmap Eyes AR/VR, Connectivity
News & Analysis 4/13/2016 2 comments
Facebook's CEO said the company will target three major areas in the next 10 years: connecting everyone to the Internet, artificial intelligence, and virtual and augmented reality.
Sayonara, Japan Semiconductor Inc.
News & Analysis 4/12/2016 20 comments
The Japanese semiconductor industry’s downfall is undeniable. EE Times went back to Japan and explored what remains of Japanese chip vendors, how Japan Inc. has crumbled and if we grade recent restructuring programs, who comes out on top.
China Facing Long-Term Memory Gap
News & Analysis 4/8/2016 1 comment
China, Inc.’s rush to build its own memory business is real. But just how — and how soon — remains a complete mystery. But XMC claims its first 3D NAND flash memory test chip “passed the electrical verification” a year ago.
10nm DDR4 DRAM Could Defy Moore
News & Analysis 4/7/2016 5 comments
Samsung said it has overcome scaling challenges to address scaling challenges that were previously thought to mean the end of Moore's Law.
Google Preps for IBM, ARM Shift
Slideshow 4/7/2016 3 comments
Google has ported much of its data center code to IBM Power and ARM server architectures and will co-design a server on the upcoming Power9 chip which will sport 24 cores and a new interconnect.
Flash Rides HPE’s Memory Bus
News & Analysis 3/29/2016 2 comments
Hewlett Packard Enterprise is shipping NVDIMM-N modules, the first in a new line of persistent memory cards analysts say will bolster servers.
3D NAND Fab Seen as Milestone for China
News & Analysis 3/22/2016 4 comments
Breaking of ground for construction of XMC fab that will eventually produce 200,000 wafers per month signals new phase in development of China's domestic semiconductor manufacturing industry, says analyst.
Facebook Likes Intel's 3D XPoint
Slideshow 3/10/2016 7 comments
Facebook endorsed Intel’s 3D XPoint memories and got Google to join its Open Compute Project at its annual event that included new processors from Intel and networking code from Microsoft.
Micron, Samsung in Flash Battle
News & Analysis 2/5/2016 15 comments
Micron described a 768Gbit 3D NAND flash chip that is twice as dense as Samsung’s current vertical NAND, but it’s not clear it will come to market.
16 Insights on ICs
Slideshow 1/29/2016 5 comments
At a talk in Silicon Valley semiconductor market guru Bill McClean predicted 4% growth in 2016 for the consolidating industry, but said China is a wild card.
Chip Stacks Take New Tacks
News & Analysis 1/25/2016 4 comments
Chip stacks will be key to advances in semiconductors, but in logic TSVs are waning while fan-out techniques and SiPs are on the rise.
3D XPoint Steps Into the Light
News & Analysis 1/14/2016 10 comments
With its 3D XPoint memories moving into the fab, an IM Flash executive revealed details of the technology and challenges making the devices.
Cypress Unveils Traveo OTA Update MCUs
News & Analysis 1/12/2016 Post a comment
Cypress Semiconductor Corp. rolled out the first series of Traveo MCUs with embedded flash on the 40nm process technology node, designed to enable mid-range to mass-market cars to implement over-the-air software updates.
AMD Tips Next Graphics Chip
News & Analysis 1/4/2016 1 comment
Advanced Micro Devices said its next-generation graphics processor, Polaris, will deliver nearly twice the performance/Watt of today’s Nvidia GPUs.
Toshiba Reorg Cuts Consumer Unit
News & Analysis 12/21/2015 2 comments
Toshiba will exit an ailing consumer notebook market but hang on to its profitable NAND flash business in a reorganization that includes 6,800 layoffs.
HPE Melds Servers, Storage
News & Analysis 12/1/2015 1 comment
Hewlett Packard Enterprise announced Synergy, a server blade system with integrated software to ease the job of managing jobs across arrays of processors and hard and solid-state disks.
Why Japan Hasn't Led IoT
News & Analysis 11/19/2015 8 comments
Germany has Industry 4.0. The U.S. is running with Industrial Internet Consortium. Where is Japan? Ken Sakamura, creator of TRON, Japan’s home-grown RTOS, blasted Japanese embedded designers for their inability to lead the Internet of Things on the world stage.
Parrot Unveils Bebop 2 Drone
News & Analysis 11/17/2015 1 comment
French drone company Parrot unveiled its next-generation consumer drone, Bebop 2. The 500 gram, four propeller device is designed to take photos and video with 25 minutes of fly time.
A Look at Metal eFuses
Blog 11/8/2015 4 comments
TechInsights reverse engineers chips to understand how they are made and in some cases why certain structures are the way they are. This article examines two electrically blown fuse structures (eFuse) used in metal gate logic processes. This first eFuse structure that we look at is made by Intel and the second by TSMC.
Micron Extreme NOR Flashes All
News & Analysis 10/30/2015 9 comments
Micron Technology has a new flash memory technology that it claims will replace all NOR flash architectures over the next few years.
Further Details of FinFET ReRAM Released
News & Analysis 10/22/2015 1 comment
Further details have been released of the resistive RAM made using a 16nm logic FinFET manufacturing process. A full paper is due to be presented on a 1-kbit memory array of such devices at this year's International Electron Devices Meeting (IEDM) coming up in December.
Dell Preps Semi-Custom Servers
News & Analysis 10/22/2015 Post a comment
Dell unveiled new servers for the data center market and enterprise at its annual DellWorld conference, targeting custom and semi-custom network infrastructure and storage for tier two cloud providers and others.