Breaking News
Content tagged with Memory/Storage
posted in January 2013
STEC releases pair of 2 TB SSDs
Product News  
1/31/2013   Post a comment
Both devices offer unlimited writes over the specified product lifespan.
Rambus rolls out LPDDR3 controller, interface
Product News  
1/31/2013   Post a comment
Memory architecture supports data rates of up to 3200 Mb/s.
Rosy 2013 for SSDs and DRAM?
Blog  
1/29/2013   Post a comment
Ultrabooks to double SSD market and push DRAM to double-digit growth.
London Calling: Flash Forward at the leading edge?
Blog  
1/29/2013   4 comments
What is the 1Y generation and who makes the world's most miniaturized chips? Is it Intel, Samsung? Or is it Flash Forward Ltd. of Japan, a joint venture between SanDisk and Toshiba?
Memory test tips #4: Characterizing phase change memory
Design How-To  
1/28/2013   Post a comment
Alternative load resistance measurement technique captures I-V and R-I performance curves without snapback.
London Calling: Nokia's Lumia hit by supply chain woes
Blog  
1/25/2013   7 comments
Mobile phone company Nokia has posted a profitable quarter but things are not looking so good for the firm's Lumia smartphone line, which has been hit by supply chain constraints.
Application simplifies eMMC compliance testing
News & Analysis  
1/22/2013   Post a comment
In response to the latest JEDEC specification, Agilent introduced the N6465A test application for embedded multimedia card (eMMC) compliance test.
Want to explain memory technology to family? Try video.
Blog  
1/22/2013   Post a comment
How to make SSDs, how flash memory works, and more.
Addressing the challenges of transition to DDR4
Design How-To  
1/22/2013   Post a comment
Taking full advantage of the new standard requires techniques like bank group tuning and timing analysis with protocol analyzers.
Micron releases 960-GB SSD
Product News  
1/14/2013   1 comment
The drive uses 20-nm MLC NAND flash with a SATA 6-Gb/s controller and the company’s custom firmware.
OCZ demos PCIe-based SSD
Product News  
1/14/2013   1 comment
Device provides lower latency and faster file transfers and boot-ups over the company’s SATA III models.
JEDEC DDR4 workshop reprises
Blog  
1/14/2013   Post a comment
Taught by members of the standards committee, the encore two-day session will give you a solid primer on the standard and how to implement it in your product.
Integrating large-capacity memory in advanced-node SoCs
Design How-To  
1/14/2013   1 comment
Improving system-on-chip performance using large-capacity SRAM instead of eDRAM requires avoiding design errors that can decrease speed and impact dynamic and leakage power—find out how.
DesignCon 2013 keeps the focus on memory
Design How-To  
1/14/2013   1 comment
Key presentations include a DDR4 forum and papers on LPDDR3 implementations.
Top 5 memory trends for 2013
Blog  
1/8/2013   4 comments
Changing markets, new standards, and maturing technologies
TI’s 4-MB flash memory targets harsh environments
Product News  
1/8/2013   Post a comment
Device enables small package integration into multi-chip modules for systems with limited board space.
Scaling directions for 2D, 3D NAND flash cells
Design How-To  
1/7/2013   Post a comment
While planar floating gate cells address 2D scaling challenges, 3D NAND flash is a bit trickier.
Helium-filled disk drives could lift Western Digital
Design How-To  
1/4/2013   16 comments
A line of helium-filled hard disk drives is likely to elevate Western Digital to the top of the enterprise disk drive market, a market research says.
Tech trends: Details on Everspin's ST-MRAM
Design How-To  
1/2/2013   3 comments
New materials for ST-MRAM enhance data stability and decrease failure.


Radio
LATEST ARCHIVED BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Like Us on Facebook
Special Video Section
With design sizes expected to increase by 5X through 2020, ...
01:48
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...