USB - the car-consumer connection Design How-To 10/29/2010 3 comments In automotive environments, USB interface technology is about to conquer the pole position among competitive technologies. At chip level, the supporting infrastructure is already available.
ARM TechCon Teardown Smackdown: Dell Streak vs. The Archos 7 Blog 10/26/2010 11 comments The promo for this ARM TechCon event is actually a bit misleading: “Which tablet PC will come out on top? Watch as EE Times Editors Brian Fuller and Patrick Mannion dissect the inner workings of the devices and explore which is the strongest contender, based on speed, power consumption, display, features and functionality.”
Qimonda settles with U.S. subsidiaries News & Analysis 10/26/2010 1 comment German chip maker Qimonda said its insolvency administrator has reached a settlement with Qimonda's U.S. subsidiaries, giving the parent company the right to over 800 patents and patent applications, according to a Dow Jones report.
PCM Scalability:The Myth (Part 2) Design How-To 10/24/2010 2 comments Ron Neale expands on some of the points he made in his earlier feature and addresses some of the comments from EETimes’ expert readers that were generated as a result of the first article.
ITC judge finds for Samsung over Spansion News & Analysis 10/22/2010 6 comments An administrative law judge with the U.S. International Trade Commission issued an initial determination finding that Samsung did not violate flash memory patents held by Spansion.
Apple changing the game with memory Memory Designline Blog 10/21/2010 25 comments As a newly-minted Mac fan, I was happy to see the news this week that its new MacBook Air would be dropping the traditional hard drive for some nice solid-state flash memory ranging from 64 to 256GB.
France's CNRS offers nano-memory IP News & Analysis 10/19/2010 3 comments France's Centre National de la Recherche Scientifique (CNRS) has done preliminary work on several nanoelectronic memory technologies that it now wishes to progress further through licensing agreements.
Spansion boosts Q3 sales target News & Analysis 10/13/2010 Post a comment Spansion said it is expecting to report higher third quarter sales than it did previously and also announced that it is seeking approval from lenders to buy back $85 million of its shares.
Tower, Crocus embed MRAM in 130-nm CMOS News & Analysis 10/12/2010 13 comments Tower Semiconductor Ltd., a foundry which trades as TowerJazz, has announced that it has integrated a thermally assisted switching (TAS) magnetic random access memory (MRAM) into its 130-nm CMOS manufacturing process.
Micron misses estimates, inks Samsung deal News & Analysis 10/7/2010 44 comments Micron Technology reported lower-than-expected sales for its most recently concluded quarter and announced a 10-year, $275 million patent cross licensing agreement with rival Samsung Electronics.
Elpida cuts FY estimates, capex says report News & Analysis 10/5/2010 1 comment Memory chipmaker Elpida Memory Inc. is cutting capital expenditure plans as a slow growing memory market means it will miss previous earnings projections, according to a Bloomberg report which cited company president Yukio Sakamoto as its source.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.