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posted in October 2010
USB - the car-consumer connection
Design How-To  
10/29/2010   3 comments
In automotive environments, USB interface technology is about to conquer the pole position among competitive technologies. At chip level, the supporting infrastructure is already available.
ARM TechCon Teardown Smackdown: Dell Streak vs. The Archos 7
Blog  
10/26/2010   11 comments
The promo for this ARM TechCon event is actually a bit misleading: “Which tablet PC will come out on top? Watch as EE Times Editors Brian Fuller and Patrick Mannion dissect the inner workings of the devices and explore which is the strongest contender, based on speed, power consumption, display, features and functionality.”
Spansion dragged to loss; sees sales growth
News & Analysis  
10/26/2010   1 comment
NOR flash memory vendor Spansion reported a third quarter sequential increase in net sales and said it expects further growth in the fourth quarter.
Qimonda settles with U.S. subsidiaries
News & Analysis  
10/26/2010   1 comment
German chip maker Qimonda said its insolvency administrator has reached a settlement with Qimonda's U.S. subsidiaries, giving the parent company the right to over 800 patents and patent applications, according to a Dow Jones report.
CE parts met cockpit avionics in vintage F-15 video camera
Teardown  
10/25/2010   Post a comment
A video camera system once used in the F-15 essentially marries a general-purpose Sony CCD camera chip set to some special-purpose military hardware.
PCM Scalability:The Myth (Part 2)
Design How-To  
10/24/2010   2 comments
Ron Neale expands on some of the points he made in his earlier feature and addresses some of the comments from EETimes’ expert readers that were generated as a result of the first article.
ITC judge finds for Samsung over Spansion
News & Analysis  
10/22/2010   6 comments
An administrative law judge with the U.S. International Trade Commission issued an initial determination finding that Samsung did not violate flash memory patents held by Spansion.
Apple changing the game with memory
Memory Designline Blog  
10/21/2010   25 comments
As a newly-minted Mac fan, I was happy to see the news this week that its new MacBook Air would be dropping the traditional hard drive for some nice solid-state flash memory ranging from 64 to 256GB.
France's CNRS offers nano-memory IP
News & Analysis  
10/19/2010   3 comments
France's Centre National de la Recherche Scientifique (CNRS) has done preliminary work on several nanoelectronic memory technologies that it now wishes to progress further through licensing agreements.
Consumer electronics rebounds, says iSuppli
News & Analysis  
10/15/2010   20 comments
The consumer electronics equipment and semiconductor markets are rebounding in 2010, according to analyst firm iSuppli Corp.
Spansion boosts Q3 sales target
News & Analysis  
10/13/2010   Post a comment
Spansion said it is expecting to report higher third quarter sales than it did previously and also announced that it is seeking approval from lenders to buy back $85 million of its shares.
ESC Boston and embedded's #1 problem
Blog  
10/13/2010   Post a comment
"Embedded" has somehow evolved to a dirty word, or at least a boring one, getting associated with many vital, but "boring" machines that just don't generate excitement.
Samsung stages NAND fight back at 2X-nm
Product News  
10/13/2010   21 comments
Samsung Electronics Co. Ltd. has said it is now producing 64-Gbit NAND flash memory with three bits per memory cell on a 20-nm class process.
Tower, Crocus embed MRAM in 130-nm CMOS
News & Analysis  
10/12/2010   13 comments
Tower Semiconductor Ltd., a foundry which trades as TowerJazz, has announced that it has integrated a thermally assisted switching (TAS) magnetic random access memory (MRAM) into its 130-nm CMOS manufacturing process.
Rambus: Signal and power integrity limitations for mobile memory in 3D packaging (Part 2 of 2)
Design How-To  
10/11/2010   13 comments
Mobile devices, like cell phones and portable game consoles, require memory systems that meet two key requirements: low power dissipation and high packaging density. In order to meet these requirements, mobile memories are implementing changes compared to traditional memories that impact signal and power integrity. Part two of this article looks at signal integrity analysis results.
Report: Elpida could buy Taiwan's DRAM makers
News & Analysis  
10/8/2010   40 comments
Elpida Memory Inc., the number three DRAM maker behind Samsung and Hynix, is considering buying shares in Taiwanese DRAM makers to bolster its position, according to a Bloomberg report.
Micron misses estimates, inks Samsung deal
News & Analysis  
10/7/2010   44 comments
Micron Technology reported lower-than-expected sales for its most recently concluded quarter and announced a 10-year, $275 million patent cross licensing agreement with rival Samsung Electronics.
Elpida cuts FY estimates, capex says report
News & Analysis  
10/5/2010   1 comment
Memory chipmaker Elpida Memory Inc. is cutting capital expenditure plans as a slow growing memory market means it will miss previous earnings projections, according to a Bloomberg report which cited company president Yukio Sakamoto as its source.


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The Circle – The Future's Imperfect in the Present Tense
Betajet
5 comments
The Circle, a satirical, dystopian novel published in 2013 by San Francisco-based writer Dave Eggers, is about a large, very powerful technology company that combines aspects of Google, ...

Max Maxfield

Recommended Reads From the Engineer's Bookshelf
Max Maxfield
27 comments
I'm not sure if I read more than most folks or not, but I do I know that I spend quite a lot of time reading. I hate to be idle, so I always have a book or two somewhere about my person -- ...

Martin Rowe

Make This Engineering Museum a Reality
Martin Rowe
Post a comment
Vincent Valentine is a man on a mission. He wants to make the first house to ever have a telephone into a telephone museum. Without help, it may not happen.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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