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posted in November 2013
3D Stacks Need Lower Costs, Broader Backing
11/26/2013   13 comments
A recent gathering at Georgia Tech showed the emerging technology for 3D chip stacking needs to come down in costs and get broader backing from designers and managers.
Slideshow: NAND Flash Process Nodes
11/26/2013   3 comments
As the major suppliers jockey for position at the 1x process node, here's a look at their latest offerings and market projections.
Flash Shortages Drive SSD Shifts
News & Analysis  
11/26/2013   13 comments
A tighter supply of NAND flash has spiked chip prices and is driving consolidation among dozens of independent solid-state drive makers.
Spansion Exec Reassures Fujitsu Customers
News & Analysis  
11/25/2013   9 comments
The most tangible technology advances, after Spansion acquired Fujitsu Semiconductor's MCU/analog business, will come from the adoption of Spansion’s proprietary eCT technology in embedded MCUs -- to be released in 2015.
Micron's Automata Exploits Parallelism to Solve Big Data Problems
News & Analysis  
11/22/2013   13 comments
The new Automata Processor architecture tackles the memory bottleneck while providing software tools that simplifying programming. Early university partners are already reaping the benefits.
IoT on Fingertip Appears at EE Live!
News & Analysis  
11/21/2013   13 comments
After helping pioneer the Internet of Things, Berkeley's Kris Pister wants to put an entire node (including power source) on a chip.
Qualcomm Ups the Mobile Ante
11/21/2013   10 comments
Mobile processor leader Qualcomm used its analyst day to rev its product line, upping the ante on competitors angling for the hot smartphone market.
Big Data May Mimic, Replace Brain
News & Analysis  
11/20/2013   11 comments
A venture capitalist calls for advances that automate healthcare while a researcher shows ways of applying algorithms used by the neocortex.
Intel to Customize High-End Processors
News & Analysis  
11/20/2013   13 comments
Intel's roadmap for its future high-end processors promises greater levels of integration as well as customized models of its Xeon and Xeon Phi processors with in-package memory, high-speed switches, optical fabrics, next-generation storage, and 3D stacked memory.
Sony Makes $18 on PS4, IHS Estimates
News & Analysis  
11/19/2013   11 comments
Sony stands to make a marginal profit on each of its new PS4 consoles, a shift from past practices, according to a teardown analysis from IHS.
Diablo Memory Architecture Finds Favor With High Performance Apps
News & Analysis  
11/19/2013   Post a comment
60East Technologies will incorporate Memory Channel Storage architecture into messaging platform while SanDisk will collaborate with Diablo to develop ULL technology for servers
Chat With Presidential Fellows on IoT
11/18/2013   8 comments
This Friday EE Times is hosting a Twitter chat on the Internet of Things with two veteran entrepreneurs and US Presidential Innovation Fellows behind the Smart America Challenge.
Sony PS4 Goes Monolithic, Says Chipworks
11/15/2013   17 comments
The PS4 uses a single die CPU/GPU and one main shared 8GB memory array. We therefore expected to see a single die under the main processor package, with no separate DRAM die in package, and no embedded DRAM on the main die. This is indeed what we have found. A huge monolithic die of 20 x 20mm.
Memory's Evolution: From Stone Tablets to Electronic Ones
11/14/2013   19 comments
This slideshow takes a journey from our earliest recording devices through the memory breakthroughs of the last couple of decades.
Toshiba Releases New Enterprise Solid-State Drive
News & Analysis  
11/12/2013   1 comment
Based on eMLC NAND flash, the new SSD has a SAS interface and layered ECC.
SD Association Adds Memory Standard
News & Analysis  
11/12/2013   Post a comment
New ultra-high-speed class aims to support high-end video.
UFS Set to Eclipse e-MMC
News & Analysis  
11/11/2013   2 comments
Vendors such as Toshiba see UFS meeting demand for high performance and capacity as early as next year, but don’t write off e-MMC just yet.
Apple, Samsung, Foundries Key to 3D ICs
News & Analysis  
11/8/2013   21 comments
The Apple A7 in the iPhone 5s is a "poor man's 3D IC" said one veteran at a panel discussion that shed light on the state and future of chip stacks.
EE Times Community Weighs In on Toyota Case
News & Analysis  
11/7/2013   27 comments
EE Times readers took Toyota’s unintended acceleration case to heart. After all, Toyota’s failures, pointed out by the expert witnesses, aren’t just Toyota’s problems. Its failures are relevant to all the hard choices engineers make.
SK Hynix, Mediatek Rise in 2013 Rankings
News & Analysis  
11/7/2013   5 comments
SK Hynix and Mediatek will be the big winners and a trio of Japan giants the big losers in 2013 rankings of chip sales, IC Insights predicts.
Inside NFV, SDN & the Emerging Network
11/6/2013   2 comments
Nabil Damouny provides a tour of the work on software defined networking and network function virtualization in a new blog.
September Semiconductor Sales Set New Records
News & Analysis  
11/5/2013   11 comments
The SIA has released its global semiconductor sales statistics, showing a record-breaking month.
IBM Flash Improves European Cloud
News & Analysis  
11/5/2013   Post a comment
Managed service provider ties together all-flash arrays and other storage using IBM FlashSystem while controlling space, power, and cooling in its datacenters.
Korea Drives High-End, Low-End Memory at ISSCC
News & Analysis  
11/5/2013   3 comments
Samsung will demo its first mobile DDR4 chips while SK Hynix discloses its High-Bandwidth Memory stack at ISSCC.
Slideshow: ARM Flexes From Servers to Wearables
11/4/2013   6 comments
At last week's ARM Tech Con, partners showed chips, boards, and systems using the low-power cores in everything from servers to wearables.
Top Memory Articles of 2013
11/4/2013   7 comments
One of the major areas of interest this year is the advances in 3D memory, which is symptomatic of the general trend in memory topic readership on EETimes, which tends to center around, “What’s Next?!”
Apple iPad Air Packs Faster A7
News & Analysis  
11/1/2013   13 comments
Early teardown results suggest a slightly faster A7 in the Apple iPad Air than in the iPhone 5 but few other surprises, according to Chipworks and iFixit. Parts Search

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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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