Spansion Exec Reassures Fujitsu Customers News & Analysis 11/25/2013 9 comments The most tangible technology advances, after Spansion acquired Fujitsu Semiconductor's MCU/analog business, will come from the adoption of Spansion’s proprietary eCT technology in embedded MCUs -- to be released in 2015.
Qualcomm Ups the Mobile Ante Blog 11/21/2013 10 comments Mobile processor leader Qualcomm used its analyst day to rev its product line, upping the ante on competitors angling for the hot smartphone market.
Intel to Customize High-End Processors News & Analysis 11/20/2013 13 comments Intel's roadmap for its future high-end processors promises greater levels of integration as well as customized models of its Xeon and Xeon Phi processors with in-package memory, high-speed switches, optical fabrics, next-generation storage, and 3D stacked memory.
Chat With Presidential Fellows on IoT Blog 11/18/2013 8 comments This Friday EE Times is hosting a Twitter chat on the Internet of Things with two veteran entrepreneurs and US Presidential Innovation Fellows behind the Smart America Challenge.
Sony PS4 Goes Monolithic, Says Chipworks Slideshow 11/15/2013 17 comments The PS4 uses a single die CPU/GPU and one main shared 8GB memory array. We therefore expected to see a single die under the main processor package, with no separate DRAM die in package, and no embedded DRAM on the main die. This is indeed what we have found. A huge monolithic die of 20 x 20mm.
UFS Set to Eclipse e-MMC News & Analysis 11/11/2013 2 comments Vendors such as Toshiba see UFS meeting demand for high performance and capacity as early as next year, but don’t write off e-MMC just yet.
EE Times Community Weighs In on Toyota Case News & Analysis 11/7/2013 27 comments EE Times readers took Toyota’s unintended acceleration case to heart. After all, Toyota’s failures, pointed out by the expert witnesses, aren’t just Toyota’s problems. Its failures are relevant to all the hard choices engineers make.
Top Memory Articles of 2013 Blog 11/4/2013 7 comments One of the major areas of interest this year is the advances in 3D memory, which is symptomatic of the general trend in memory topic readership on EETimes, which tends to center around, “What’s Next?!”
Apple iPad Air Packs Faster A7 News & Analysis 11/1/2013 13 comments Early teardown results suggest a slightly faster A7 in the Apple iPad Air than in the iPhone 5 but few other surprises, according to Chipworks and iFixit.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.