South Korea closes NAND antitrust probe News & Analysis 12/30/2009 Post a comment South Korea's Fair Trade Commission has closed a three-year investigation of NAND flash memory chip makers, saying it found no evidence that they were engaged in international price fixing, according to reports.
ITC issues final determination against Tessera News & Analysis 12/30/2009 Post a comment The U.S. International Trade Commission issued a final determination that Tessera Technologies failed to prove that its patents were infringed by some DRAM manufacturers and sellers, including Elpida Memory, Nanya Technology, Powerchip Semiconductor and ProMOS Technologies.
The 10 most popular stories of 2009 News & Analysis 12/29/2009 Post a comment Here are the top ten stories for 2009 as ranked by EE Times readers, up to and including Tuesday, Dec. 29. The ranking is based on the number of reader "views" or "hits" on a particular article.
Taiwan set to outspend Samsung on DRAM capex, says analyst News & Analysis 12/28/2009 Post a comment Inotera Memories Inc. will triple its capital expenditure in 2010 to $1,385 billion as part of an effort by Taiwan DRAM manufacturers that will, in aggregate, eclipse the spending of market leader Samsung Electronics Co. Ltd., according to DRAMexchange Technology Inc., a Taiwan-based market analysis company.
DRAM capex set to rise 80% in 2010, says analyst News & Analysis 12/28/2009 Post a comment Capital expenditure by DRAM makers will increase by 80 percent year-on-year to $7.85 billion in 2010, according to DRAMexchange Technology Inc., a Taiwan-based market analysis company. The company estimated the DRAM makers will spend $4.30 billion in 2009.
Hynix confirms 2010 capex increase News & Analysis 12/24/2009 Post a comment South Korean memory chip vendor Hynix Semiconductor has confirmed that it will increase its planned capital expenditure for 2010 to 2.3 trillion won (about $1.95 billion), according to reports, which cite a filing made by Hynix with the South Korea Stock Exchange.
Global sales were strong in November, says analyst News & Analysis 12/23/2009 Post a comment Global chip sales in November were strong according to analysts at Carnegie Group (Oslo, Norway). The average of September, October and November chip sales is expected to be reported as $22.5 billion versus $21.7 billion for the equivalent figure in October.
Nano vacuum tubes could make better batteries, or memories News & Analysis 12/23/2009 2 comments Researchers at the University of Illinois at Urbana-Champaign, reckon the vacuum tube could be basis of a high energy density battery, or a non-volatile memory. In theory arrays of nanometer-scale vacuum tubes should be able to achieve three times the energy density of lithium-ion batteries.
No compromise: NXP's MCU strategy is ARM, says exec News & Analysis 12/11/2009 Post a comment A gasp of surprise was raised at the ARM European Technical Conference when an NXP executive described, with an almost religious fervor, the six-year relationship between his chip company and the processor intellectual property licensor.
MLC is not priority for phase-change memory, says Numonyx News & Analysis 12/9/2009 Post a comment Nonvolatile memory supplier Numonyx BV (Rolle, Switzerland) is working on adding multilevel cell (MLC) capability to its phase-change memory technology but the work is not a priority, according to Paolo Cappelletti, vice president of technology development at Numonyx.
Day of the Indian engineer News & Analysis 12/9/2009 17 comments Indian engineers can have their day under the sun soon blessed as they are with advantages such as low average age, desirous of staying current on news and continuing technical education and are not blinkered by age-old methods, according to a senior Mentor Graphics executive.
Numonyx 1-Gbit phase-change memory set to sample in Q1 News & Analysis 12/8/2009 Post a comment Nonvolatile memory supplier Numonyx BV (Rolle, Switzerland) is on course to provide customers with samples of its 1-Gbit phase-change random access memory (PCRAM) in the first quarter of 2010 and get into volume production later in the same year.
Panelists question fabless model viability Blog 12/4/2009 Post a comment Is fabless still fabulous? In a panel session at the IP-ESC 2009 Conference this week in Grenoble, France, panelists discussed the evolution of semiconductor business models and confronted views on whether the fabless model is dead or alive and kicking.
Samsung plans to rival TSMC in foundry, says report News & Analysis 12/4/2009 4 comments South Korea's Samsung Electronics Co. Ltd. plans to double its production of chips for others, so called foundry production, every year until it rivals market leader Taiwan Semiconductor Manufacturing Co. Ltd., according to a Chosun Ilbo report that referenced an un-named company spokesman as its source.
ST reorganizes regional structure News & Analysis 12/3/2009 Post a comment STMicroelectronics NV (Geneva, Switzerland) has announced changes in its global sales and marketing organization, consolidating ST's regions in Asia to two: Greater China & South Asia, Japan & Korea, with effect from Jan. 1, 2010.
Analyst raises forecast on soaring October chip sales News & Analysis 12/1/2009 Post a comment Bruce Diesen, analyst with Carnegie ASA (Oslo, Norway), has raised his forecast for the 2009 chip market, for the second month in a row. Carnegie asserts the market will still be down but the shrink will be less than Carnegie previously predicted.
October chip sales grew fastest in Europe News & Analysis 12/1/2009 Post a comment The European and Americas regions grew fastest according to the October three-month average chip sales released by the Semiconductor Industry Association on Monday (Nov. 30), when compared with the previous month.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.