Micron shutting 200-mm fab, cutting more jobs News & Analysis 2/23/2009 Post a comment Memory chip specialist Micron Technology will cut up to 2,000 jobs and phase out 200-mm wafer manufacturing operations at the company's Boise, Idaho headquarters in response to deteriorating economic conditions.
Updated: NAND capex seen dropping 59% in 2009 News & Analysis 2/19/2009 2 comments Total NAND flash memory manufacturing capex is expected to fall by 59 percent in 2009 after decreasing by 28 percent in 2008, according to an analysis by DRAMeXchange, a memory clearing house.
Freescale MRAM spinoff names CEO News & Analysis 2/4/2009 Post a comment Everspin Technologies, the MRAM spinoff from Freescale Semiconductor, named former Altius Solutions co-founder and Cadence Design Systems executive Aurangzeb Khan president and CEO.
Court stays Rambus case against DRAM vendors News & Analysis 2/4/2009 Post a comment The U.S. District Court for the Northern District of California has stayed coordinated patent infringement cases by Rambus against memory suppliers Hynix Semiconductor, Micron Technology, Nanya Technology and Samsung Electronics following a ruling earlier this month by the Delaware District Court.
Micron, Mosaid settle patent dispute News & Analysis 2/2/2009 Post a comment Micron Technology will license the patent portfolio of Mosaid Technologies, and Mosaid will acquire 400 Micron patents under the terms of an agreement to settle pending litigation, the companies announced.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.