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Content tagged with Memory/Storage
posted in March 2009
Elpida to raise $465 million through offering
News & Analysis  
3/27/2009   Post a comment
Japanese DRAM vendor Elpida Memory plans to raise capital to shore up its finances by selling shares in two of its businesses.
Memory system tradeoffs: embedded DRAM in SoCs, Chip-on-Board, multichip packages or memory modules
Design How-To  
3/24/2009   Post a comment
A tutorial on memory module use in embedded designs compared to other processor main memory alternatives such as embedded DRAM in System-on-Chip (SoC), Chip-on-board (COB), and Multi-chip Packages (MCP).
NAND prices on the rebound, analyst says
News & Analysis  
3/23/2009   Post a comment
Average selling prices for NAND flash memory parts have rebounded from a low of about 80 cents per gigabyte in the fourth quarter of 2008 and are currently close to covering cash costs, according to a memory industry analyst who cited cuts in capacity and fab utilization.
The 50-nm DRAM battle rages on: An overview of Micron's technology
News & Analysis  
3/23/2009   Post a comment
With the help of advanced imaging techniques, Semiconductor Insights analyzed the process technology used to fabricate Micron's newest 1-Gbit DDR2 50nm SDRAM and is now ready to reveal some of the design trends introduced by the North American DRAM manufacturer.
Samsung claims first 16-Gb DDR3 module shipment
News & Analysis  
3/19/2009   Post a comment
South Korea's Samsung Electronics said Thursday it shipped the first high-density memory modules based on 2-gigabit, 50-nanometer-class DDR3 memory.
Q1 PC builds looking up again, says analyst
News & Analysis  
3/19/2009   Post a comment
PC build forecasts are looking better for a second straight month, an analyst said.
Ramtron cuts workforce, salaries
News & Analysis  
3/17/2009   Post a comment
Nonvolatile ferroelectric random access memory vendor Ramtron International will cut its workforce by 17 percent and reduce salaries for all employees by 5 to 12 percent as part of a series of cost reduction actions, the company said.
SMIC's CEO says orders, utilization increasing
News & Analysis  
3/17/2009   Post a comment
China's SMIC has recently experienced a clear rise in orders and expects its capacity utilization rate for the first quarter to be substantially higher than original expectations, according to a Reuters report citing SMIC CEO Richard Chang.
Spansion appoints chief restructuring officer
News & Analysis  
3/16/2009   Post a comment
Troubled NOR flash vendor Spansion appointed John Brincko to the position of chief restructuring officer, charging him with overseeing the restructure of the company's roughly $1.5 billion in debt.
DRAM spot prices down again
News & Analysis  
3/16/2009   Post a comment
Spot prices for DRAM parts declined again the week of March 13, with spot prices on some parts down as much as 17 percent, according to market research firm Gartner.
Tessera moves to dismiss ITC action
News & Analysis  
3/13/2009   Post a comment
Tessera Technologies has moved to terminate a U.S. International Trade Commission action it brought against semiconductor packaging subcontractors, one of three complaints by Tessera currently before the ITC.
China's chip industry 'broken,' says analyst
News & Analysis  
3/11/2009   2 comments
China's semiconductor industry is broken due to recession and underinvestment, with a dip in total chip production contrasted by a 6.8 percent increase in consumption in the country in 2008, according to an analyst.
Spansion gets Nasdaq delisting notice
News & Analysis  
3/11/2009   Post a comment
Troubled NOR flash vendor Spansion has been notified by the Nasdaq Marketplace that its stock is subject to delisting, the company said.
Samsung, ON Semi settle patent dispute
News & Analysis  
3/11/2009   Post a comment
ON Semiconductor and Samsung Electronics have crossed-licensed their patent portfolios for an unspecified number of years under the terms of an agreement that resolves a patent infringement dispute, according to a statement released by ON Semi.
Xilinx CEO: Venture capital won't return to semis
News & Analysis  
3/11/2009   3 comments
Venture capital funding is in short supply and won't return to the semiconductor industry even after the current recession, according to Moshe Gavrielov, president and CEO of programmable logic supplier Xilinx.
Analyst: Lean inventories could speed recovery
News & Analysis  
3/10/2009   Post a comment
The semiconductor industry will suffer double-digit contraction in 2009, but lean inventories across the supply chain could jump-start a rapid recovery for the industry once the economy starts to improve, an analyst said.
Attend the 'too-hot-to-miss' live product teardowns at ESC Silicon Valley
Product News  
3/6/2009   Post a comment
We're tearing it up in Silicon Valley. See the inner workings of a deep-sea unmanned sub, a high-flying black box, and other cool stuff.
Credit crisis catches up with PCs, says iSuppli
News & Analysis  
3/5/2009   Post a comment
Fourth quarter 2008 PC shipments declined by 1.5 percent compared with the third quarter, putting an abrupt halt to an era when PCs seemed to defy gravity by showing growth despite the emergency of a global economic crisis, according to market research firm iSuppli.
Avoid the crowds at ESC booth events
Product News  
3/4/2009   Post a comment
Know what's going on in the booths, and get there first
WIZnet expands from wired to wireless focus
Product News  
3/3/2009   Post a comment
WIZnet offers an 802.11bg WLAN Access Point module a pin-head package. Parts Search

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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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