Flash data storage startup raises $6 million News & Analysis 4/21/2011 1 comment Arkologic Holdings Ltd., a startup developing solid-state data storage products based on flash memory ICs, has said it has raised $6 million in a Series A financing round led by private equity firm Landtek Corp.
Report: Toshiba forced to halve NAND output News & Analysis 4/20/2011 2 comments Toshiba Corp. has told customers it will have to halve its output of NAND flash memory ICs in May and June because of a shortage of blank wafers and other materials, according to a Digitimes report that referenced unnamed industry sources.
China develops phase-change RAM Research 4/20/2011 18 comments The Shanghai Institute of Microsystem and Information Technology at the Chinese Academy of Sciences – working with foundry chipmaker SMIC and Microchip Technology – has announced it has developed phase-change random access memory (PCRAM) that is based on Chinese intellectual property, according to a Xinhua report.
Mobile apps bring momentum to DRAMs News & Analysis 4/18/2011 3 comments Mobile DRAM vendors face inventory shortfalls and a shift to next-generation technologies as volume demand and bandwidth requirements rise in smartphone and tablet markets.
Weak PC market in Q1 surprises Gartner News & Analysis 4/14/2011 10 comments Worldwide PC shipments totaled 84.3 million units in the first quarter of 2011, a 1.1 percent decline from the first quarter of 2010, according to preliminary results from Gartner, Inc. This is below Gartner's previous forecast of 3 percent growth in 1Q11.
Cadence IP targets DDR4 in SoCs Product News 4/13/2011 Post a comment Earlier this week, Cadence announced some new intellectual property (IP) that aims to streamline the incorporation of DDR4 memory into system on chip (SoC) designs. I spoke with Neil Hand, group director of marketing for SSD realization group, at length about the announcement.
Toshiba releases 24nm NAND flash Product News 4/6/2011 Post a comment Toshiba America Electronic Components, Inc. (TAEC) has released its SmartNAND™ product, which integrates 24nm process NAND flash technology with a control chip that supports error correction code (ECC).
Server is ready for hard work Product News 4/5/2011 Post a comment The application-ready Kontron rugged RAID Data Server OBSERVO is specially designed for surveillance data recording in harsh environments which require integrated mass storage and data integrity.
Hynix announces DDR4 DRAM and module Product News 4/4/2011 2 comments Hynix Semiconductor Inc. has announced that it has developed a 2-Gbit DDR4 DRAM IC and 2-Gbyte memory module based on the IC. The IC has been implanted using a 30-nm class (somewhere between 30 and 39-nm) manufacturing process technology.
Tower offers $140 million for Micron fab News & Analysis 4/4/2011 6 comments Tower Semiconductor Ltd., a specialty foundry chipmaker which trades under the name TowerJazz, has announced it is proposing to buy a wafer fab belonging to Micron Technology Inc. in Nishiwaki City, Hyogo prefecture, Japan, for $140 million.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.