Rambus: Court orders Hynix to post bond News & Analysis 5/26/2009 Post a comment Memory technology licensor Rambus said the U.S. District Court for the Northern District of California has ordered Hynix Semiconductor to secure about $397 million through a combination of a bond and a lien on a Hynix property in South Korea stemming from a March ruling in favor of Rambus.
Rambus targets DDR4 DRAMs News & Analysis 5/26/2009 1 comment Rambus has announced a set of new and existing interconnect technologies it says will meet the needs of main memory in 2011 and beyond and hopes the industry adopts them as part of a pending DDR4 DRAM standard.
Micron moves into microdisplay panel market News & Analysis 5/20/2009 Post a comment Micron Technology is moving into the microdisplay panel market through the acquisition of technology and products from Displaytech. The company declined to provide financial details of the acquisition.
Cisco discloses server ASICs News & Analysis 5/19/2009 Post a comment Cisco Systems has designed a set of proprietary ASICs to more than double the DRAM memory linked to an Intel Nehalem processor in hopes of leapfrogging existing server makers in areas such as database performance or the number of virtual machines a server can support.
Trade group questions Taiwan's DRAM plan News & Analysis 5/14/2009 Post a comment The Taiwanese government plan to consolidate the island's DRAM industry around the government-backed Taiwan Memory Co. remains unclear and could do more harm than good, according to a report by a U.S.-Taiwan lobbying group.
Micron regains No. 3 spot in DRAM News & Analysis 5/8/2009 Post a comment For the first time in more than three years, U.S. memory chip vendor Micron Technology was among the top three in global DRAM market share in the first quarter, an analyst said in a report.