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Content tagged with Memory/Storage
posted in May 2012
Renesas, TSMC tout licensable MCU platform using 40-nm eFlash
News & Analysis  
5/28/2012   7 comments
Renesas and TSMC Monday outlined joint plans to develop an embedded flash-based MCU platform licensable to other chip suppliers around the world.
Advantest launches high-speed DRAM test system
Product News  
5/25/2012   Post a comment
Offering a maximum test speed of 8 Gb/s, the T5511 supports DDR4-SDRAM and GDDR5-SDRAM devices.
Multi-die DRAM packaging technology drives down Ultrabook platform cost – part 1
Design How-To  
5/25/2012   1 comment
By leveraging face-down architecture, design provides the memory functionality of an SODIMM in a single package.
Video and audio storage requirements drive doubling of maximum hard drive densities by 2016
5/22/2012   3 comments
Maximum areal densities in hard disk drives (HDD) are expected to more than double during the five-year period from 2011 to 2016, spurring continued growth for HDDs in storage-intensive applications such as video and audio systems, according to an IHS iSuppli Storage Space Market Brief report.
UK researchers follow silicon-oxide ReRAM route
News & Analysis  
5/22/2012   23 comments
Researchers from University College London have developed a silicon oxide based resistive RAM by following a promising line of research similar to that pursued by teams at Rice University and the University of Pennsylvania.
JEDEC publishes LPDDR3 standard for low-power memory devices
News & Analysis  
5/21/2012   Post a comment
The standard satisfies the performance and density demands of the latest generation of mobile devices.
EMC snaps up XtremeIO
Memory Designline Blog  
5/21/2012   Post a comment
The deal might let EMC corner the market on a new flash technology—if the patents hold.
Samsung delivers 20% smaller mobile DRAM
Product News  
5/21/2012   Post a comment
The 4-Gb LPDDR2 memory module targets tablets and smart phones.
A scalable, cost-effective phase change RAM technology
Design How-To  
5/21/2012   Post a comment
Fully integrated 1-Gb device based on an 84-nm pitch demonstrates functionality and reliability.
Swissbit extends flash storage card portfolio
Product News  
5/18/2012   Post a comment
The F-200 Series CFast card delivers 600 IOPS with a maximum power consumption of 0.9 W.
ESilicon set to reap rewards of Asian gamble
News & Analysis  
5/17/2012   Post a comment
Jack Harding, CEO of design services provider eSilicon, says the company's move to Asia is beginning to pay off as it helps customers navigate two very different chip markets in Taiwan and mainland China.
The automotive graphical user interface—compromise or opportunity?
Design How-To  
5/17/2012   Post a comment
Traditional automotive switch, button, and analog gauge HMIs are becoming GUIs (graphical user interfaces) offering enormous flexibility. The scope and variety of information that can be displayed are almost limitless and can be changed dynamically while in use.
RAPIDO in-line programmer delivers gang programming of up to 16 sites
Product News  
5/14/2012   Post a comment
The RPS900-S16 allows users to reuse test and programming routines.
TDK develops mSATA SSD for industrial applications
Product News  
5/14/2012   Post a comment
The drives offer storage of up to 64 GB and 170 MB/s read speeds.
A middle-1X nm NAND flash memory cell (M1X-NAND) with highly manufacturable integration technologies
Design How-To  
5/14/2012   2 comments
New integration technologies overcome the scaling limits of mid-1x-nm technology to yield a highly manufacturable mid-1x-nm NAND flash memory.
Industry view: iSuppli on Micron/Elpida deal
Memory Designline Blog  
5/14/2012   8 comments
Mike Howard of IHS iSuppli weighs in on rational markets, Micron's most likely integration strategy, and the one thing Elpida must not do.
Teardown Report: Chevy Volt's electronic secrets
Design How-To  
5/10/2012   3 comments
Beyond battery chemistry, and electric propulsion and control, this enhanced-range electric vehicle was designed for upgrades, ruggedness, and diagnostics—with attention to quality in its construction.
Elpida buy to remake DRAM landscape
Memory Designline Blog  
5/7/2012   3 comments
Micron reportedly wins the rights to negotiate for Elpida even as it begins sampling its first DDR4 DRAM module.
Extended scalability of perpendicular STT-MRAM towards sub-20-nm MTJ node
Design How-To  
5/7/2012   4 comments
The authors demonstrate the STT switching of 17-nm node P-MTJ cells using improved integration processes and perpendicular materials with high interface anisotropy.
Falling DRAM prices challenge market
News & Analysis  
5/7/2012   Post a comment
Demand rises courtesy of mobile-device market but oversupply pressures pricing
Talk from the hip at Microchip
News & Analysis  
5/7/2012   14 comments
Microchip CEO Steve Sanghi is a straight talker. When he comments on the economy, outsourcing, technology or market trends, you’ll hear very little conventional wisdom or polite evasion. He has no stake winning a popularity contest or looking fashionable.
Fujitsu shows radiation-hardened RFID using FRAM technology
News & Analysis  
5/6/2012   Post a comment
Fujitsu Semiconductor America and a group of partner companies will highlight innovative RFID solutions using Fujitsu's FRAM technology at Interphex 2012 from May 1-3 in New York City.

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Max Maxfield

Teensy-Weensy GPAK4 Mixed Signal FPGAs
Max Maxfield
Post a comment
The vast majority of the embedded designers I know typically create MCU-based systems -- they rarely even consider using a Field-Programmable Gate Array (FPGA).

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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