Intel outlines 3-D NAND transition Design How-To 5/24/2013 10 comments Intel and IM Flash Technologies executive says 2-D NAND flash memory can scale to 10-nm and that 3-D NAND needs to be manufactured with at least 32 layers to be economic.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.