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posted in May 2014
Apple’s IoT 'Good Housekeeping' Label: MFi
News & Analysis  
5/30/2014   33 comments
Expect Apple to beat Google to the punch by unveiling the company’s IoT strategy on its home front at Apple’s Worldwide Developer Conference next week in San Francisco.
Parallel NOR Delivers Performance SPI Can't
News & Analysis  
5/27/2014   2 comments
The focus of systems designers is usually on reducing cost and power consumption by using serial flash, but many automotive and embedded applications require the high performance of a parallel interface.
Phase Change Memory: From Multi-Level to Multi-Tasking
Blog  
5/23/2014   5 comments
Here's a preview of what's in store for PCM at this year's VLSI Symposium 2014.
HP Plans 16,000 More Layoffs
News & Analysis  
5/22/2014   21 comments
Hewlett-Packard stunned analysts with plans to lay off 16,000 more employees, but execs insisted the company is on the road back.
DesignCon Issues 2015 Call for Abstracts
News & Analysis  
5/22/2014   7 comments
The annual conference on high-speed digital design, signal integrity, and power integrity is now taking submissions for paper abstracts.
Samsung Ramps Up 3D NAND Fab in China
News & Analysis  
5/20/2014   3 comments
With 3D NAND likely to hit the market in the second half of 2015, major manufacturers are expanding their facilities to prepare for the conversion from 2D.
IBM Sets World Record With Mag Tape
News & Analysis  
5/19/2014   3 comments
IBM and FujiFilm announce a world record in data density on the more reliable and long-lived storage medium for big data, the venerable tape drive.
Spansion Courts Carmakers With Cortex-R5-Based MCUs
News & Analysis  
5/19/2014   5 comments
In hopes of gaining a sizable share in the growing automotive chip market, Spansion Inc. is rolling out a new family of automotive MCUs, called Traveo, based on ARM Cortex 5 cores.
UHS-II SD Cards Await Capable Devices
News & Analysis  
5/16/2014   1 comment
Vendors including Toshiba, SanDisk, and Panasonic have steadily announced SD cards in different form factors that support faster transfer and write speeds, but it will take time for UHS-II capable devices to hit the market.
NXP Car Plan Teams NFC, Bluetooth
News & Analysis  
5/15/2014   5 comments
The biggest issue for the current version of Bluetooth Low Energy may be "its security and pairing mechanism." NXP is proposing NFC for secure transactions, while BLE offers a data link.
Rambus Rejoins Jedec
News & Analysis  
5/14/2014   5 comments
Rambus has been invited to rejoin the memory standards group Jedec after a nearly 20-year absence marked by suits with major DRAM suppliers.
NVMe Emerges as Memory Independent
Blog  
5/14/2014   Post a comment
The first of a planned series of Tech Talk presentations by Intel focused on NVM Express and was given to a worldwide web audience by Amber Huffman, senior principal engineer and NVM Express Workgroup chair.
3D NAND Transition: 15nm Process Technology Takes Shape
News & Analysis  
5/13/2014   5 comments
SanDisk and Toshiba are both continuing to push floating gates until 3D NAND makes economic sense with 15nm process technology that will be applied to wide range of market segments
IBM Hawks PCM for Storage
News & Analysis  
5/9/2014   5 comments
To meet the demands of big data, IBM believes in a hierarchical combination of DRAM, flash, and phase change memory over hard-disk drives.
Do Auto MCUs Need Proprietary Flash?
News & Analysis  
5/9/2014   11 comments
As the technology moves down to the finer node, Globalfoundries sees the 28-nm process node becoming the "battleground." That might force automotive chip companies to give up proprietary embedded VNM technology.
$6 Billion Problem for Mobile Carriers
Blog  
5/8/2014   10 comments
The real issue of the three-device (smartphone, tablet, and notebook) endgame is not the form factor but a $6 billion revenue loss for carriers -- and potentially a huge problem for device manufacturers.
Post-Merger Spansion 'Integrates' With Big Move Into Auto
News & Analysis  
5/7/2014   3 comments
Synergy is no longer the stated goal behind Spansion’s acquisition of Fujitsu Semiconductor’s MCU and analog businesses. Shown in its Q1 results, Spansion is scoring design wins globally, especially in the automotive sector.
Fully Autonomous Car? Don't Buy Shotgun Yet
Blog  
5/6/2014   29 comments
I suspect what’s discussed today as an “autonomous car” is likely to emerge in phases. These cars in each phase will come with fine print stipulating the conditions under which they must be driven.
Expansion of NVMe Support Signals Growth
Blog  
5/6/2014   Post a comment
Product announcements, OS support, and test-community support are all signs of growth for NVMe, the interface protocol for non-volatile memory (NVM)-based storage technology aimed at enabling the full potential of PCI Express SSDs.
Serial-Interface Memory Architectures for 100 GbE
Blog  
5/5/2014   Post a comment
From the need for packet processing to 100GbE line rates and the move to IPv6, the traditional memory approaches in networking are being squeezed. What's the best way forward?


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NEXT UPCOMING BROADCAST
In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.
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