Elpida to partner for China fab, says report News & Analysis 6/15/2010 Post a comment Japan's Elpida Memory Inc. is planning to team up with a Taiwanese DRAM chipmaker to share the cost of a wafer fab in mainland China, according to a Taiwan Economic News report, which cited newswires quoting Elpida CEO Yukio Sakamoto as its source.
TSMC's May sales rise is lower than average News & Analysis 6/14/2010 Post a comment Foundry giant Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) said its unconsolidated May sales were approximately NT$33.84 billion (about $1.05 billion), an increase of 3.5 percent over April 2010 and an increase of 38.3 percent over May 2009.
An IMEC Technology Forum compendium News & Analysis 6/11/2010 Post a comment Set out below are a number of articles, videos and a photographic slideshow authored from a press tour to the IMEC research centers in Eindhoven, The Netherlands and Leuven, Belgium. The tour was held immediately prior to the IMEC Technology Forum in Antwerp, Belgium, where many of the same topics were discussed.
Wafer prices, allocation up in Q1, says GSA News & Analysis 6/10/2010 Post a comment Rising wafer prices, longer lead times and, in some cases, wafer rationing, characterized foundry chip supply in the first quarter of 2010, according to a survey conducted by the Global Semiconductor Alliance.
Appeals court to rehear Rambus cases News & Analysis 6/9/2010 1 comment A U.S. appellate court will rehear arguments in cases involving Rambus and memory chip vendors Hynix Semiconductor and Micron Technology, apparently placing in jeopardy a $397 million judgment Rambus won against Hynix last year.
20-nm ready for tape out in 2012, says ST News & Analysis 6/4/2010 Post a comment STMicroelectronics NV will be ready to tape out designs using a 20-nm CMOS low power process technology in the fourth quarter of 2012, according to Jean-Marc Chery, the company’s chief technology officer.
ST sees strong demand, no inventory build up News & Analysis 6/4/2010 Post a comment STMicrolectronics told analysts that it sees strong customer demand and no signs of that demand going to inventory. With the company stating that it is running its manufacturing at full capacity utilization the comments highlighted that 2010 should be a boom year.
HP researcher predicts memory-centric processors News & Analysis 6/2/2010 1 comment Hewlett-Packard researchers are exploring ways to make their memristor the centerpiece of a future server design and have determined low power processors such as those based on ARM cores are superior for some data center workloads.
Analysis: Big spenders reinforce boom-bust cycle Blog 6/1/2010 2 comments A surge in announcements of increased chip making capital expenditure is not going to make an impact any time soon. But when the spending does hit it will almost certainly produce an oversupply bust sometime as consolidation amongsts the pure-play IDMs exacerbates the boom-bust cycle.
IBM, partners to report 22-nm FinFET SRAM News & Analysis 6/1/2010 2 comments A research team comprising authors from IBM Research, GlobalFoundries, Toshiba and NEC has produced an SRAM cell with an area of 0.0063 square microns using FinFET transistors and optical lithography.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.