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Content tagged with Memory/Storage
posted in June 2012
CEA-Leti preps for PCM, HKMG research below 20-nm
6/27/2012   1 comment
French research institute CEA-Leti has received an AltaCVD machine and plans to use it to develop phase-change memory devices and high-k metal gate structures for the sub-20nm technology node.
Understanding DDR SDRAM timing parameters
Design How-To  
6/25/2012   4 comments
Learn about various timing parameters and their impact on the performance of the DRAM.
ADATA launches two mSATA SSDs
Product News  
6/25/2012   Post a comment
The XPG SX300 and Premier Pro find a home on select motherboards with built-in mSATA sockets.
Milan startup offers radiation hardened SRAM
Product News  
6/25/2012   3 comments
A radiation hardened 512-kbit SRAM designed by Italian fabless chip startup RedCat Devices srl withstands a 15-Mrad total ionization dose. The chip was manufactured for RedCat by foundry Tower Semiconductor Ltd. in its 180-nm CMOS manufacturing process.
Software extends hardware-in-the-loop real-time simulation
Design How-To  
6/25/2012   Post a comment
HIL initiative uses the latest generation of symbolic modeling technology to rapidly develop high fidelity, multi-domain models of the planetary rover subsystems.
Facebook likes wimpy cores, CPU subscriptions
News & Analysis  
6/21/2012   20 comments
Facebook could be running at least in part on so-called wimpy server CPU cores by the second half of 2013 and long term wants to buy CPUs on a subscription model.
Micron recasts Intel JV, includes emerging memory
News & Analysis  
6/21/2012   4 comments
Micron has announced the reorganized of production arrangements within its IM Flash Technologies joint venture with Intel and the scope has been expanded to include certain emerging memory technologies.
Micron still interested in Elpida despite more losses
News & Analysis  
6/21/2012   7 comments
Micron made a net loss of $320 million on net sales of $2.2 billion in the third quarter of fiscal 2012, which ended May 31 due to continuing softness in the memory markets, the company said.
SK Hynix buys memory controller chip company
News & Analysis  
6/20/2012   2 comments
Memory chipmaker SK Hynix Inc., has agreed to buy California-based Link_A_Media Devices Corp. The purchase price was not disclosed.
Micron launches power-sipping DDR3 DRAM
Product News  
6/18/2012   Post a comment
The 30-nm 2-Gb and 4-Gb units are designed for the discrete graphics and high-speed networking markets.
Improved memory throughput using serial NOR flash - part 2
Design How-To  
6/18/2012   Post a comment
Discover protocol-level upgrades and hardware changes that can speed serial NOR flash memory.
Toshiba shows first SCSI-like Universal Flash demo system
News & Analysis  
6/13/2012   2 comments
The demonstration is a complete testing environment for next-gen memory solutions built around the latest JEDEC 1.1 UFS specification.
Cypress goes public on offers to buy Ramtron
News & Analysis  
6/12/2012   5 comments
Chip company Cypress Semiconductor has offered to acquire all the outstanding stock of non-volatile memory company Ramtron for $2.48 per share, a 37 percent premium over Ramtron's closing stock price on Monday June 11.
Industry View: Semico Research on where NAND flash goes next
6/11/2012   1 comment
Discover where the market correction will take us, how the cloud will change the playing field, and which supplier hopes to catch its competitors looking.
12 Gb/s SAS flash manager delivers 300K IOPS
Product News  
6/11/2012   Post a comment
With advanced flash reclamation and wear-leveling processes, PMC controller extends MLC NAND endurance up to as much as five years.
Improved memory throughput using serial NOR flash - part 1
Design How-To  
6/11/2012   2 comments
Discover system-level and memory-device strategies that allow higher read throughput for economical NOR flash memory.
Toshiba rolls out 19-nm NAND flash SSD
Product News  
6/11/2012   Post a comment
The THNSNF family uses less than 0.1 W of power and clocks in around twice the speed of the manufacturer’s HG3 series.
Hybrid memory cube controller IP operates up to 240 GBps
Product News  
6/4/2012   Post a comment
Hybrid memory cube controller IP enables next-gen design for high-performance computing, networking and test & measurement applications.
Multi-die DRAM packaging technology drives down Ultrabook platform cost – part 2
Design How-To  
6/4/2012   Post a comment
Quad face down (QFD) technology delivers the memory functionality of a 1-GB SODIMM in a compact, 243-ball package.


What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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