Magnetic RAM Remains Niche Memory – for Now News & Analysis 6/30/2014 4 comments One report is bullish on MRAM's growth prospects and its potential to replace DRAM and SRAM, while the primary vendor of the nonvolatile memory still sees plenty of short-term opportunity in niche applications, including enterprise storage.
Micron 3D Memory Supercharges Xeon Phi News & Analysis 6/23/2014 8 comments Analysts have speculated wildly about the technical details of the massively parallel next-generation Knights Landing Xeon Phi. Today Intel and its 3D memory partner, Micron Technology Inc., put all that speculation to rest.
DRAM's Mood Swings Stabilize News & Analysis 6/17/2014 5 comments From factory fires to consolidations, DRAM manufacturers have been through a lot, but now appear to be stabilizing as the market takes off.
Engineer Hackers Rejuvenate DLP Slideshow 6/16/2014 11 comments Over the last two decades, largely unbeknownst to TI, Digital Light Processing technology has gradually found its way into unintended applications -- industrial and medical included -- thanks to persistent hacking by engineers.
Top Mobile Memory Vendors News & Analysis 6/16/2014 Post a comment In a recent report, Gartner ranked the top vendors of eMCP and eMMC mobile memory. In an interview with EETimes, Gartner's principal analyst, Brady Wang, explained the details.
Of World Cup & 10nm Blog 6/13/2014 6 comments How is the economics of hosting the World Cup justified when the stadiums will be left empty after the World Cup championship finishes? I see a parallel in the semiconductor industry building fabs.
Know Cost & Options Before You Design SoC Blog 6/10/2014 1 comment eSilicon launches new Web-based tools letting IC designers explore design and delivery options before they start designing new SoCs. It's equivalent to what Kayak is to consumers when travel shopping.
Ziptronix & EVG Improve Wafer Alignment News & Analysis 6/9/2014 3 comments Collaboration between Ziptronix and EVG has led to submicron post-bond alignment accuracy on customer-provided wafers. The process supports stacking and can be applied to memory and image sensors.
Marvell to Hitch Apple's Smart Home Ride News & Analysis 6/3/2014 3 comments As Apple guns for a big stake in technology for monitoring health and home, Marvell, Broadcom, and TI are looking to piggyback on the Apple campaign. Marvell launched three separate IoT SoCs made for iDevices.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.