Magnetic RAM Remains Niche Memory – for Now News & Analysis 6/30/2014 4 comments One report is bullish on MRAM's growth prospects and its potential to replace DRAM and SRAM, while the primary vendor of the nonvolatile memory still sees plenty of short-term opportunity in niche applications, including enterprise storage.
Micron 3D Memory Supercharges Xeon Phi News & Analysis 6/23/2014 8 comments Analysts have speculated wildly about the technical details of the massively parallel next-generation Knights Landing Xeon Phi. Today Intel and its 3D memory partner, Micron Technology Inc., put all that speculation to rest.
DRAM's Mood Swings Stabilize News & Analysis 6/17/2014 5 comments From factory fires to consolidations, DRAM manufacturers have been through a lot, but now appear to be stabilizing as the market takes off.
Engineer Hackers Rejuvenate DLP Slideshow 6/16/2014 11 comments Over the last two decades, largely unbeknownst to TI, Digital Light Processing technology has gradually found its way into unintended applications -- industrial and medical included -- thanks to persistent hacking by engineers.
Top Mobile Memory Vendors News & Analysis 6/16/2014 Post a comment In a recent report, Gartner ranked the top vendors of eMCP and eMMC mobile memory. In an interview with EETimes, Gartner's principal analyst, Brady Wang, explained the details.
Of World Cup & 10nm Blog 6/13/2014 6 comments How is the economics of hosting the World Cup justified when the stadiums will be left empty after the World Cup championship finishes? I see a parallel in the semiconductor industry building fabs.
Know Cost & Options Before You Design SoC Blog 6/10/2014 1 comment eSilicon launches new Web-based tools letting IC designers explore design and delivery options before they start designing new SoCs. It's equivalent to what Kayak is to consumers when travel shopping.
Ziptronix & EVG Improve Wafer Alignment News & Analysis 6/9/2014 3 comments Collaboration between Ziptronix and EVG has led to submicron post-bond alignment accuracy on customer-provided wafers. The process supports stacking and can be applied to memory and image sensors.
Marvell to Hitch Apple's Smart Home Ride News & Analysis 6/3/2014 3 comments As Apple guns for a big stake in technology for monitoring health and home, Marvell, Broadcom, and TI are looking to piggyback on the Apple campaign. Marvell launched three separate IoT SoCs made for iDevices.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments