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posted in July 2008
Video: When the fab shuts down
News & Analysis  
7/30/2008   Post a comment
Matt, a young process engineer at the Hynix DRAM fab in Eugene, Oregon, shares his views about the human impact of the Korean company's decision in late July to close its only U.S. manufacturing plant.
SanDisk unveils metric for solid-state drives
Product News  
7/24/2008   2 comments
SanDisk will announce today a metric that reduces to a single number the expected lifetime of a flash disk, hoping the industry will adopt its Longterm Data Endurance approach as a de facto standard for solid-state drives.
Hynix will close 200mm fab in Oregon
News & Analysis  
7/24/2008   Post a comment
Hynix Semiconductor will close within two months a 200mm DRAM wafer fab in Eugene, Oregon, according to local officials speaking immediately after a visit from Hynix chief executive Jong Kap Kim, a move that comes as a reaction to a DRAM market that has been in oversupply for months.
Hynix fab: Expand, diversify or close?
News & Analysis  
7/23/2008   Post a comment
The chairman of Hynix, Jong Kap Kim, is visiting Oregon Wednesday (July 23) on a trip that involves meetings with the governor, the mayor of Eugene where the company has its eight-inch DRAM fab and the president of the University of Oregon in Eugene and speculation about the purpose of the trip ranges widely from talk about an upgrade, diversification or even a closure.
CherryPal attempts to redefine PC
News & Analysis  
7/22/2008   Post a comment
A new "green" PC that consumes only 2 watts of power also lays claim to integrated software and "cloud computing" on a par with desktop PCs.
Jedec group will set flash drive standards
Product News  
7/18/2008   Post a comment
Jedec, the standards group best known for its work on DRAM interfaces, has formed a new group to set standards for solid-state disks that use NAND flash chips, chartered to develop standards for solid state drives used for embedded or removable memory storage leveraging the existing storage infrastructure.
Samsung, Sun boost flash drive endurance
News & Analysis  
7/17/2008   1 comment
Samsung Electronics has worked with server maker Sun Microsystems to develop a new 8 Gbit single-level-cell design for computer servers that it claims increases the number of read/write cycles for NAND flash memory chips five-fold.
Virage extends DDR3 offering
News & Analysis  
7/16/2008   Post a comment
Virage Logic has broadened its Intelli DDR memory interface product portfolio with the Intelli DDR3 memory interface that operates up to 1.6 Gb/s.
Elpida's secret weapon: Intermolecular
News & Analysis  
7/14/2008   Post a comment
How will Japan's Elpida Memory Inc. dig its way out of the DRAM downturn? The DRAM specialist appears to have a new and secret weapon.
Technology Week in Review: Memristors advance, solar paint
News & Analysis  
7/11/2008   Post a comment
This week's top technology stories include how artificial intelligence defeated humans at poker, how a robot defeated human air hockey players and paint-on solar panels.
Which IC maker is buying equipment?
News & Analysis  
7/11/2008   Post a comment
Fab-tool capital spending is down, but not out. So, which chip maker will buy IC-equipment in the near future--and who will slam the door on vendors' faces?
Rambus sues Nvidia over memory patents
News & Analysis  
7/11/2008   Post a comment
Rambus Inc. filed suit Thursday (July 10) against Nvidia Corp. for violating 17 of its memory patents, extending a long string of court actions to a company outside the memory industry.
3-D chip stacks standardized
News & Analysis  
7/10/2008   Post a comment
The Intimate Memory Interconnect Standard being promoted by the 3D-IC Alliance recently released its official specification for 3-D stacking memory chips.

As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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