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Content tagged with Memory/Storage
posted in July 2012
Spansion Q2 2012 earnings
News & Analysis  
7/31/2012   2 comments
Memory maker Spansion reported Q2 2012 revenue up 11 percent from Q1 to $233.4 million. Net income of $26 million compared with a first-quarter loss of $13.1 million.
Smart Storage releases next-gen SATA SSD
Product News  
7/30/2012   Post a comment
The XceedIOPS2 leverages 24-nm eMLC NAND flash for mainstream workloads.
The (non) persistence of memory
Blog  
7/30/2012   1 comment
How do we reliably store information for centuries when our compression algorithms are outmoded in less than a decade?
Breaking through the embedded memory bottleneck, part 1
Design How-To  
7/30/2012   1 comment
Memory operations per second (MOPS) provides a better metric for assessing new techniques like algorithmic memory.
Tech Beat: Codewords cut PCM energy needs
Memory Designline Blog  
7/23/2012   10 comments
Researchers leverage codeword techniques to minimize PCM energy consumption by as much as 44%.
Samsung rolls out 16-GB DDR4 modules
Product News  
7/23/2012   Post a comment
Designed for enterprise server systems, the units use 40% less power than DDR3 versions.
Diagnostic and repair tools for embedded memory boost SoC yields
Design How-To  
7/23/2012   Post a comment
Memory test, repair, and diagnostic solutions can improve both the manufacturing process and device performance.
Ramtron extends Fram agreement with Rohm
News & Analysis  
7/23/2012   Post a comment
Ferroelectric random access memory supplier Ramtron has entered into a new manufacturing and license partnering agreement with Rohm Co., Ltd. to manufacture Fram-based semiconductor products for Ramtron on Rohm’s Fram manufacturing line.
SSD vendor STEC's CEO charged with insider trading
News & Analysis  
7/20/2012   4 comments
Manouchehr Moshayedi, CEO of solid-state drive maker STEC, was charged by the U.S. SEC with insider trading in connection with a 2009 secondary offering of common stock.
Micron claims first high-volume production of PCM
News & Analysis  
7/18/2012   36 comments
Claiming to offer the first phase change memory in high-volume production, U.S. memory chip vendor Micron Technology announced availability of its 45-nm PCM for mobile devices.
Novocell expands one-time-programmable NVM IP
Product News  
7/16/2012   Post a comment
Three new NVM product families serve system-on-chip and fabless firms.
SLC vs MLC: Which works best for high-reliability applications?
Design How-To  
7/16/2012   5 comments
Although multi-level cell NAND flash offers a cost advantage, single-level cell NAND flash delivers longer lifetime, lower error rates, and better performance for mission-critical applications.
Atmel unveils two serial EEPROM lines
Product News  
7/9/2012   2 comments
The AT24MAC series provides pre-programmed MAC/EUI node identity addresses, while the AT24CS devices include factory-programmed, read-only serial numbers for easier inventory control.
Deciphering phone and embedded security - Part 2: What really happens during an unlock operation
Design How-To  
7/9/2012   9 comments
Part 2 of this series takes a deep dive into what really happens at the hardware level during an unlock operation, and tricks that hackers use to fool or bypass bootloaders and install custom ROMs.
Aeroflex offers 16-Mbit, 64-Mbit rad-hard MRAMs
Product News  
7/6/2012   2 comments
Aeroflex Inc., a supplier of electronic components for military and aerospace applications, has announced the availability of three magnetoresistive random access memory components made using a manufacturing license from Everspin Technologies.
Anti-fuse memory provides robust, secure NVM option
Design How-To  
7/5/2012   Post a comment
Non-volatile memory technology addresses demands of SoCs controlling 24/7 connected devices.
Ramtron rejects Cypress again, in talks with others
News & Analysis  
7/5/2012   5 comments
The board of ferroelectric memory company Ramtron has rejected the latest, improved offer from Cypress and is now in discussions with "major semiconductor companies" about a potential strategic transaction.
ARM, HP, SK Hynix join Hybrid Memory Cube group
News & Analysis  
7/4/2012   4 comments
ARM, Hewlett-Packard and SK Hynix have joined the Hybird Memory Cube Consortium led by Micron and Samsung, a sign of gathering momentum for this proposed application of 3-D memory stacks.
Technology Roundup: phase-change memory
Design How-To  
7/3/2012   Post a comment
How it works, the latest advances, and progress toward commercial viability.
Technology Roundup: NAND flash
Design How-To  
7/2/2012   Post a comment
A look at the basics, the evolution of the technology, and design tips.
Find out what large-capacity SRAM can do for you
Blog  
7/2/2012   Post a comment
As processes shrink below 28 nm, large-scale SRAM provides a useful solution for memory hungry enterprise systems and multimedia SoCs.
ISC8 rolls out secure SSD, memory stick
Product News  
7/2/2012   Post a comment
Both devices expand the company’s Vault-MM series, designed to support government and enterprise customers.
Micron confirms Elpida deal, also plans Rexchip purchase
News & Analysis  
7/2/2012   9 comments
Memory chip company Micron has confirmed that it has signed a definitive "sponsor agreement" to acquire and support Japan's Elpida for $2.5 billion. Micron said it will also buy a 24 percent share of Taiwanese DRAM fab Rexchip from Powerchip Technology Corp. for approximately $334 million.


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The Circle – The Future's Imperfect in the Present Tense
Betajet
Post a comment
The Circle, a satirical, dystopian novel published in 2013 by San Francisco-based writer Dave Eggers, is about a large, very powerful technology company that combines aspects of Google, ...

Max Maxfield

Recommended Reads From the Engineer's Bookshelf
Max Maxfield
2 comments
I'm not sure if I read more than most folks or not, but I do I know that I spend quite a lot of time reading. I hate to be idle, so I always have a book or two somewhere about my person -- ...

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No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
2 comments
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Making the Grade in Industrial Design
Rich Quinnell
15 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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