Micron Makes Monolithic 8Gb DDR3 News & Analysis 7/29/2014 6 comments Using a 25 nm manufacturing process, Micron has created a monolithic 8 Gb DDR3 SDRAM component, while a startup is squeezing 8 Gb into a single chipset using proprietary techniques.
Samsung's Silicon Valley Home Blog 7/25/2014 11 comments Samsung is building a 10-story complex in the heart of Silicon Valley that will be home for some of its memory and display researchers and a whole lot of ecosystem efforts.
Future of PCM: Optoelectronic? Blog 7/22/2014 4 comments Work by a team at the University of Oxford and the University of Exeter may well become recognized as the first steps on the road to a new and bright optoelectronic future for phase-change memory materials.
NAND Suit: Toshiba Seeks $1.1B From SK Hynix News & Analysis 7/21/2014 7 comments South Korea's SK Hynix Inc. disclosed in a regulatory filing that Toshiba Corp. is seeking $1.1 billion in damages over the suspected theft of data related to NAND flash memory chip technology.
Testing ReRAM Structures Blog 7/14/2014 2 comments This article by Peter J. Hulbert addresses issues related to characterization and forming, as well as endurance testing for 1R ReRAM structures.
MCUs, Memory Balance Security, Performance News & Analysis 7/10/2014 1 comment The need to secure devices at the MCU or SSD level is becoming more pressing thanks to BYOD and the Internet of Things, but perceptions linger that encryption degrades device performance.
China's SMIC-Qualcomm 28-nm Deal: Why Now? News & Analysis 7/3/2014 16 comments SMIC and Qualcomm revealed their collaboration on 28-nm wafer production in China. Since China's antitrust investigation against Qualcomm, speculation abounds that Chinese are probing ways to coerce Qualcomm into collaborating with their electronics industry.
Crossbar RRAM Aims for 1TB Blog 7/1/2014 7 comments Crossbar demonstrates pre-production 1 MB arrays using its new 1 transistor/n resistor's non-volatile RRAM, addressing “sneak path” current issues to enable high-density memory.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.