Samsung samples 30nm, 32GB DDR3 RDIMMs Product News 8/18/2011 2 comments In an effort to deliver higher performance with lower power consumption to the next-generation server market, Samsung has developed 32GB DDR3 RDIMMs that use 3D through silicon via (TSV) package technology.
SanDisk flash drive targets advanced tablets Product News 8/18/2011 2 comments SanDisk Corporation recently introduced the iNAND™ Extreme® embedded flash drive (EFD), the first in a new line of products from the company that is designed for high-end tablets running advanced operating systems and data-intensive applications.
e-MMC vs. NAND with built-in ECC Design How-To 8/18/2011 7 comments Ultimately, if your processor can support both e-MMC and MLC NAND with ECC, which should you choose? A look at the attributes, benefits and situational advantages of each
Answering the consumer market’s demand for non-volatile memory Design How-To 8/10/2011 1 comment Non-volatile memory requires substantial R&D investment in terms of both human resources and characterization tools to help them evolve. This is an area in which consumer products manufacturers and their vendors must continue to invest if they are to compete globally.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.