Renesas aims to gain market share with SoCs News & Analysis 9/30/2010 12 comments Renesas Electronics Corp. has announced measures it says will strengthen the company's system-on-chip (SoC) business for networking and industrial infrastructures that support the cloud-computing era.
IBM characterizes single-atom DRAM News & Analysis 9/23/2010 14 comments IBM Research described a new pulsed-technique to stimulate and read-out the state of an individual atom for atomic-scale memories, solar cells and future quantum computers. atomic-scale memories, solar cells and future quantum computers.
NAND market is up, down News & Analysis 9/22/2010 2 comments Traditional NAND flash parts based on single-level-cell and multi-level-cell technologies are hot, but NAND based on three-bit-per-cell technology is lukewarm to cold, said an analyst.
Project maps ARM core variability at 32-nm News & Analysis 9/21/2010 Post a comment A European collaborative research project has spent about $5.8 million performing a characterization of an ARM926 core for the statistical variability that is inherent at the 32-nm manufacturing process node.
ISuppli: DRAM production costs on the rise News & Analysis 9/14/2010 9 comments DRAM manufacturing costs increased for the first time in nearly four years in the second quarter, stoking concerns about memory production expenses, according to the market research firm iSuppli.
SPI Bus EEPROM optimized for automotive ECUs Product News 9/13/2010 Post a comment Rohm Semiconductor has announced an EEPROM product family which is optimized for a number of automotive ECUs. The BR35Hxxx feature SPI bus and a high reliability with guaranteed operational functionality at temperatures up to 125 degrees C.
Rice's silicon memristor aims to beat HP News & Analysis 9/1/2010 13 comments Memristors made from pure silicon could enable resistive random access memory that are simpler and cheaper to manufacture than Hewlett-Packard's titanium-based formulation, according to researchers at Rice University.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.