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Content tagged with Memory/Storage
posted in September 2011
Samsung preps 30-nm LPDDR3 DRAM
Product News  
9/29/2011   1 comment
Samsung said it has developed the first monolithic 4-Gb LPDDR3 memory using 30nm class technology for mobile applications.
Models, models, models…
9/29/2011   3 comments
Without models the EDA industry could not exist and when it comes to trying to promote a new abstraction level, models become the sticking point. Synopsys intends to change that…
Crocus appoints CEO for Russian MRAM fab
News & Analysis  
9/29/2011   Post a comment
Crocus Technology Inc., a developer of MRAM memory ICs, has announced the appointment of Boris Omarov as CEO of a manufacturing joint venture, Crocus Nano Electronics (CNE), which is being created to run an MRAM wafer fab under development in Russia.
Advantages of SONOS memory for embedded flash technology
Design How-To  
9/29/2011   7 comments
This article makes the case for the use of 65nm SONOS technology for embedded flash applications.
Spansion claims world's fastest serial flash memory
Product News  
9/28/2011   Post a comment
Spansion aims to change the way serial flash is perceived and open up new markets.
Elpida has 4-Gbit DRAM in 25-nm process
Product News  
9/27/2011   2 comments
Elpida Memory Inc. has said it has completed development of the industry's first 25-nm process 4-Gbit DDR3 synchronous DRAM. The company claims the part is also the smallest 4-Gbit DRAM yet produced.
EDA Roundup
9/21/2011   Post a comment
There are many news stories out every week that are interesting, but on their own don't warrant a full writeup. This is a roundup of such information...
IEDM: Samsung to present 20nm planar process
9/21/2011   5 comments
Researchers from Samsung Electronics Co. Ltd. are set to unveil the company's 20-nm logic process at the International Electron Devices Meeting, which is due to take place in Washington DC, Dec. 5 to 7, 2011.
DFI helps speed up the memory sub-system
9/19/2011   Post a comment
A revision to the DFI standard promises faster memory access and support for DDR4 memory sub-systems. Cadence also announced availability of supporting IP.
High-speed memory controller spec released for DDR4
9/19/2011   Post a comment
DFI Technical Group releases latest high-speed memory controller and PHY interface specification that enables transition to next-generation DDR4 memory
Anobit claims best-in-class flash SSDs for enterprise and cloud
Product News  
9/18/2011   2 comments
Anobit has announced its second generation Genesis SSDs, targeted at network and server attached storage, as well as enterprise business and cloud-based applications.
Break memory barriers for next-generation servers
Design How-To  
9/17/2011   1 comment
LRDIMM Revisited: Memory buffer technology poised to unleash speed, capacity in next-generation server designs.
IEDM: Hynix takes NAND to 15-nm
News & Analysis  
9/16/2011   15 comments
Hynix has developed a 15-nm NAND flash memory cell which it plans to unveil at this year's International Electron Devices Meeting in December. At the same conference the company is due to present 42-nm half-pitch process for the production of 1-Gbit phase-change memories and beyond.
ST's M24LR64 wireless EEPROM memory combined with NFC technology enables new consumer apps
Product News  
9/7/2011   1 comment
ST’s M24LR64 dual-interface wireless EEPROM memory can transmit and receive information from within an application to a smartphone containing near-field communication (NFC)* technology or to an industrial RFID (radio-frequency identification) reader, allowing for transactions, data exchange, object identification, and tracking to occur rapidly.
Sidense sues Kilopass and CEO Cheng
News & Analysis  
9/6/2011   2 comments
Sidense Corp., a developer of licensable non-volatile memory, has said it has filed a law suit in the Northern District of California against rival Kilopass Technology Inc. and Kilopass CEO Charlie Cheng, on five counts, alleging defamation and unfair competition.
OWC goes for high speed and low price on 60GB SSD
Product News  
9/2/2011   Post a comment
Other World Computing (OWC®) announced the $129.99 MSRP 60GB capacity model to its OWC Mercury Electra™ 6G Solid State Drive line. 
New JEDEC spec online
9/2/2011   2 comments
I just heard from my contacts at JEDEC that they have issued Release 4 of the DDR3 Serial Presence Detect (SPD) Specification.
Improving performance using SPI-DDR NOR flash memory
Design How-To  
9/2/2011   Post a comment
The availability of new NOR Flash memory based upon the serial peripheral interface (SPI) provides developers with performance approaching parallel NOR while greatly reducing the device pin count. Parts Search

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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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