China's LTE Bid Good for Apple Blog 12/4/2013 2 comments The Chinese government licensed its three big carriers for LTE, opening a door to more sales for Apple and a handful of China and US chip makers.
China Investigates Qualcomm News & Analysis 11/25/2013 19 comments Qualcomm Incorporated Monday disclosed that China's National Development and Reform Commission, which regulates prices, has begun investigating Qualcomm regarding compliance with the Chinese Anti-Monopoly Law.
Spansion Exec Reassures Fujitsu Customers News & Analysis 11/25/2013 9 comments The most tangible technology advances, after Spansion acquired Fujitsu Semiconductor's MCU/analog business, will come from the adoption of Spansion’s proprietary eCT technology in embedded MCUs -- to be released in 2015.
Sensor Showcase From Japan With Love Slideshow 11/22/2013 18 comments At Embedded Technology 2013, vendors were talking up M2M, sensors, energy harvesting ICs, battery-less wireless connectivity, HTML browsers, and big data -- all thrown together as a solution.
Qualcomm Ups the Mobile Ante Blog 11/21/2013 9 comments Mobile processor leader Qualcomm used its analyst day to rev its product line, upping the ante on competitors angling for the hot smartphone market.
Intel to Customize High-End Processors News & Analysis 11/20/2013 13 comments Intel's roadmap for its future high-end processors promises greater levels of integration as well as customized models of its Xeon and Xeon Phi processors with in-package memory, high-speed switches, optical fabrics, next-generation storage, and 3D stacked memory.
Chat With Presidential Fellows on IoT Blog 11/18/2013 8 comments This Friday EE Times is hosting a Twitter chat on the Internet of Things with two veteran entrepreneurs and US Presidential Innovation Fellows behind the Smart America Challenge.
Sony PS4 Goes Monolithic, Says Chipworks Slideshow 11/15/2013 17 comments The PS4 uses a single die CPU/GPU and one main shared 8GB memory array. We therefore expected to see a single die under the main processor package, with no separate DRAM die in package, and no embedded DRAM on the main die. This is indeed what we have found. A huge monolithic die of 20 x 20mm.
EE Times Community Weighs In on Toyota Case News & Analysis 11/7/2013 27 comments EE Times readers took Toyota’s unintended acceleration case to heart. After all, Toyota’s failures, pointed out by the expert witnesses, aren’t just Toyota’s problems. Its failures are relevant to all the hard choices engineers make.
Apple iPad Air Packs Faster A7 News & Analysis 11/1/2013 14 comments Early teardown results suggest a slightly faster A7 in the Apple iPad Air than in the iPhone 5 but few other surprises, according to Chipworks and iFixit.
Qualcomm Buys Arteris Tech, Team News & Analysis 10/31/2013 11 comments Arteris says it will continue to license, support, and enhance its on-chip networking technology even though Qualcomm now owns the IP and the design team.
ARM Drives Mali GPU to New High News & Analysis 10/29/2013 9 comments ARM announced two new Mali mobile GPU cores, the T760, which it claims outperforms archrival Imagination, and the T720 for middle-market devices.
Blog Make a Frequency Plan Tom Burke 17 comments When designing a printed circuit board, you should develop a frequency plan, something that can be easily overlooked. A frequency plan should be one of your first steps ...