AMD eyes Dresden as site for 300mm wafer fab News & Analysis 12/12/2001 Post a comment Dresden, Germany -- Advanced Micro Devices' fab complex here is being considered as the site for a 300mm wafer pilot line sometime in 2003, and ultimately for a production fab a year later, officials here said Tuesday.
Intel, Sun sketch multiprocessor chip plans News & Analysis 12/10/2001 Post a comment Intel Corp. and Sun Microsystems Inc. are each laying plans to deliver multiprocessing computers on a chip. Both plan to put two to more processors on a die with simultaneous multithreading (SMT), a design approach that lets a processor handle two or more threads of an application simultaneously.
AMD raises Q4 sales forecast to 10% sequential growth News & Analysis 12/6/2001 Post a comment SUNNYVALE, Calif.--Advanced Micro Devices Inc. today raised its sales forecast for the fourth quarter partly because of strong for its new Athlon XP processor, which was introduced on Oct. 9. AMD said better-than-expected PC processor sales will drive up overall Q4 revenues by 10% compared to $765.9 million in the third quarter.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.